Analysis and Experimental Investigation of Grinding Force in Ultrasonic Vibration Mill-Grinding of Brittle Materials

2013 ◽  
Vol 568 ◽  
pp. 3-8
Author(s):  
Guo Chao Qiao ◽  
Guo Jun Dong ◽  
Ming Zhou

Based on the Kinematic analysis, the indentation fracture mechanics is used to build a force model of ultrasonic vibration mill-grinding. To verify the force model, experiments are carried out for silicon nitride ceramics with various machining parameters, meanwhile grinding forces are measured. Finally, comparison between predicted results with experimental results is presented.

2012 ◽  
Vol 565 ◽  
pp. 129-134 ◽  
Author(s):  
Kyeong Tae Kim ◽  
Yun Hyuck Hong ◽  
Kyung Hee Park ◽  
Young Jae Choi ◽  
Seok Woo Lee ◽  
...  

In this work, grinding test was performed in terms of machining parameters, such as grinding speed, feed rate, etc., in order to study effect of ultrasonic vibration in grinding. The design of experiment (DOE) approach was used for an optimal condition of ultrasonic assisted grinding, which can minimize the grinding forces. In DOE, ultrasonic amplitude power, feed rate, and rotation speed of spindle were chosen as the major machining factors. The grinding forces were measured and compared between the conventional grinding and ultrasonic assisted grinding. From the experiment, it was found that the grinding forces decreased as the ultrasonic vibration power and the rotation speed of spindle increased while the grinding force was reduced as the feed rate increased. In addition, regression model was formulated for obtaining optimal grinding condition.


1995 ◽  
Vol 10 (12) ◽  
pp. 3204-3209 ◽  
Author(s):  
Hockin H.K. Xu ◽  
Lanhua Wei ◽  
Said Jahanmir

The relationship between grinding forces and the material's resistance to microfracture is investigated in abrasive machining of silicon nitride ceramics. Surface grinding is performed on two forms of silicon nitride with different microstructures, and the grinding forces are measured. In addition, single-point scratching is performed on polished surfaces to amplify the damage associated with the action of an individual abrasive particle in grinding. A thermal wave measurement technique is then used on the cross sections to characterize the density of subsurface microcracks associated with scratching. Compared to a fine-grain silicon nitride, the density of microcracks in a course-grain silicon nitride is significantly larger, while the grinding force is smaller. The smaller grinding force for the coarse-grain silicon nitride is attributed to the ease of local intergranular microfracture and grain dislodgement during grinding.


2012 ◽  
Vol 500 ◽  
pp. 287-294 ◽  
Author(s):  
Peng Yan ◽  
Jian Hua Zhang ◽  
Guo Sheng Su

In the ultrasonic vibration assisted grinding and EDM, grinding and pulse discharge machining are favorable conditions for each other, can significantly improve the processing efficiency by adjusting the processing parameters, and get high-quality machined surface. The grinding force is an important parameter in characterizing the grinding process, which is the g the main object of study in grinding process. The interaction of ultrasonic vibration, grinding and EDM is investigated. From the view of material removal volume, the volume of removal by EMD is calculated. Then the volume by grinding is gotten. The grinding force model of combined machining is established. The influence machining parameters on grinding force is studied, which is helpful for the detection and control of grinding force.


2012 ◽  
Vol 591-593 ◽  
pp. 405-408
Author(s):  
Guo Chao Qiao ◽  
Ming Zhou

An experimental investigation is reported of the temperature measurement for ultrasonic vibration mill-grinding of silicon nitride with infrared thermovision. The effects of machining parameters such as spindle speed, feed speed, cutting depth on the surface temperature of workpiece were investigated and the reasons for the trend of temperature changes were analyzed. From the analyses, it indicates that infrared imager technology is suitable for temperature measurement in ultrasonic vibration mill-grinding of ceramics and tool wear has an important effect on the measurement results.


2010 ◽  
Vol 42 ◽  
pp. 204-208 ◽  
Author(s):  
Xiang Dong Li ◽  
Quan Cai Wang

In this paper, the characteristic of grinding force in two-dimensional ultrasonic vibration assisted grinding nano-ceramic was studied by experiment based on indentation fracture mechanics, and mathematical model of grinding force was established. The study shows that grinding force mainly result from the impact of the grains on the workpiece in ultrasonic grinding, and the pulse power is much larger than normal grinding force. The ultrasonic vibration frequency is so high and the contact time of grains with the workpiece is so short that the pulse force will be balanced by reaction force from workpiece. In grinding workpiece was loaded by the periodical stress field, which accelerates the fatigue fracture.


2006 ◽  
Vol 304-305 ◽  
pp. 232-235 ◽  
Author(s):  
Dao Hui Xiang ◽  
Y.P. Ma ◽  
Bo Zhao ◽  
Ming Chen

The crack extension course and ductile removal mechanism of nano ZrO2 ceramics were analyzed in this paper. On the basis of contrast tests with or without ultrasonic vibration, the influences of critical ductile grinding depth on grinding forces and surface quality were studied by dynamometer, SEM and AFM in different grinding condition. The reason for the increase of the critical grinding depth was discussed based on the analysis of grinding force and ultrasonic vibration course. At last, the formation mechanism of surface topography observed by AFM in ductile domain was analyzed. The research indicated that ultrasonic machining could obtain nano finished surface with high efficient.


2014 ◽  
Vol 2014 ◽  
pp. 1-10 ◽  
Author(s):  
Zhang Jianhua ◽  
Zhao Yan ◽  
Zhang Shuo ◽  
Tian Fuqiang ◽  
Guo Lanshen ◽  
...  

Ultrasonic vibration assisted micro end grinding (UAMEG) is a promising processing method for micro parts made of hard and brittle materials. First, the influence of ultrasonic assistance on the mechanism of this processing technology is theoretically analyzed. Then, in order to reveal the effects of ultrasonic vibration and grinding parameters on grinding forces and surface quality, contrast grinding tests of silica glass with and without ultrasonic assistance using micro radial electroplated diamond wheel are conducted. The grinding forces are measured using a three-component dynamometer. The surface characteristics are detected using the scanning electron microscope. The experiment results demonstrate that grinding forces are significantly reduced by introducing ultrasonic vibration into conventional micro end grinding (CMEG) of silica glass; ultrasonic assistance causes inhibiting effect on variation percentages of tangential grinding force with grinding parameters; ductile machining is easier to be achieved and surface quality is obviously improved due to ultrasonic assistance in UAMEG. Therefore, larger grinding depth and feed rate adopted in UAMEG can lead to the improvement of removal rate and machining efficiency compared with CMEG.


2012 ◽  
Vol 500 ◽  
pp. 269-274 ◽  
Author(s):  
Guo Chao Qiao ◽  
Ming Zhou ◽  
Ming Wang

In order to investigate the influences of machining parameters on surface roughness in ultrasonic vibration mill-grinding, the motion of abrasive grain is analyzed. The analysis indicates that grain and workpiece separate periodically which are beneficial for coolant entering into grinding zone to reduce grinding temperature and grinding force and improve surface quality. Experiments are carried out and detected by SEM and roughmeter, the results indicate that influences of spindle rate, feeding speed, cutting depth and amplitude decrease in turn. Through regression analysis, an empirical formula is obtained. The experiments indicate that material removal mode dominates surface roughness.


2009 ◽  
Vol 29 (8) ◽  
pp. 1535-1542 ◽  
Author(s):  
Hiroyuki Miyazaki ◽  
Hideki Hyuga ◽  
Yu-ichi Yoshizawa ◽  
Kiyoshi Hirao ◽  
Tatsuki Ohji

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