Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy
2016 ◽
Vol 675-676
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pp. 513-516
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Keyword(s):
The dependence of microstructure and mechanical properties of Sn-0.7wt.%Cu solder alloys on different cooling rates were investigated. Two cooling rates were employed during solidification: 0.04 °C/s (mold-cooled system) and 1.66 °C/s (water-cooled system). The results showed that the ultimate tensile strength of Sn-0.7wt.%Cu solder alloy increased but the elongation decreased when water-cooled system was used. The microstructure of Sn-0.7wt.%Cu solder alloys solidified by both cooling systems exhibited two phases of Sn-rich and Cu6Sn5 intermetallic compounds (IMCs). However, finer grains were observed in the water-cooled specimens.
2017 ◽
Vol 898
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pp. 124-130
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Keyword(s):
2018 ◽
Vol 37
(1)
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pp. 97-103
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2013 ◽
Vol 747-748
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pp. 245-250
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2010 ◽
Vol 152-153
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pp. 1083-1087