Effect of Cooling Speed on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.05Ni Solder Alloy

2018 ◽  
Vol 934 ◽  
pp. 73-78
Author(s):  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Melting Point ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Solder Alloys ◽  
Scanning Calorimetry ◽  
Microstructure And Mechanical Properties ◽  
Cooling Speed

To study the effect of cooling speed on the microstructure and mechanical properties of Sn-0.7Cu-0.05Ni solder alloy, molten alloys were cooled at two different rates, using water-cooling and mold-cooling. The mechanical properties of the obtained alloys were analyzed with a universal testing machine (UTM) and by Vickers microhardness testing (HV). The microstructures were characterized using an optical microscope (OM) and energy dispersive X-ray spectroscopy (EDX).The melting point was ascertained by differential scanning calorimetry (DSC). The cooling rate of the water-cooled system (0.28 o C/s) was faster than the cooling rate of the mold-cooled system (0.05 °C/s). The grain size of the alloy produced by the faster cooling rate was finer than that of the alloy obtained from the slower cooling rate. This finer grain size gave the alloy superior ultimate tensile strength (UTS) and hardness but inferior ductility (%EL). The microstructure of both Sn-0.7Cu-0.05Ni solder alloys exhibited three phases of β-Sn, Cu6Sn5 and (Cu,Ni)6Sn5 intermetallic compounds. The melting point and undercooling of the solder alloys was 233.8 °C and 35.7 °C, respectively.

Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-0.7wt.%Cu Solder Alloy

2016 ◽  
Vol 675-676 ◽  
pp. 513-516 ◽  
Author(s):  
Phairote Sungkhaphaitoon ◽  
Thawatchai Plookphol
Keyword(s):  
Mechanical Properties ◽  
Tensile Strength ◽  
Ultimate Tensile Strength ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Solder Alloys ◽  
Cooling Systems ◽  
Cooling Rates ◽  
Microstructure And Mechanical Properties ◽  
Two Phases

The dependence of microstructure and mechanical properties of Sn-0.7wt.%Cu solder alloys on different cooling rates were investigated. Two cooling rates were employed during solidification: 0.04 °C/s (mold-cooled system) and 1.66 °C/s (water-cooled system). The results showed that the ultimate tensile strength of Sn-0.7wt.%Cu solder alloy increased but the elongation decreased when water-cooled system was used. The microstructure of Sn-0.7wt.%Cu solder alloys solidified by both cooling systems exhibited two phases of Sn-rich and Cu6Sn5 intermetallic compounds (IMCs). However, finer grains were observed in the water-cooled specimens.

Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

2017 ◽  
Vol 751 ◽  
pp. 9-13
Author(s):  
Kogaew Inkong ◽  
Phairote Sungkhaphaitoon
Keyword(s):  
Mechanical Properties ◽  
Cooling Rate ◽  
Solder Alloy ◽  
Testing Machine ◽  
Optical Microscope ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cooling Systems ◽  
Lead Free Solder Alloy ◽  
Free Solder

The effect of cooling rate on the microstructural and mechanical properties of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy was studied. The microstructure of specimens was characterized by using an optical microscope (OM) and an energy dispersive X-ray spectroscopy (EDX). The mechanical properties were performed by using a universal testing machine (UTM). The results showed that the cooling rate of water-cooled specimens was about 2.37 °C/s and the cooling rate of mold-cooled specimens was about 0.05 °C/s. To compare the different cooling rates, it was found that the grain size of water-cooled specimens was finer than that of the mold-cooled specimens, this resulted in an increment of mechanical properties of solder alloy. A higher tensile strength (33.10 MPa) and a higher elongation (34%) were observed when water-cooled and mold-cooled systems were used, respectively. The microstructure of Sn-0.3Ag-0.7Cu-0.05Ni lead-free solder alloy solidified by both cooling systems exhibited three phases: β-Sn, Ag3Sn and (Cu,Ni)6Sn5 IMCs.

Effects of Thermo-Mechanical Process on the Microstructure and Mechanical Properties of Low Carbon HSLA Steels

2006 ◽  
Vol 15-17 ◽  
pp. 786-791 ◽  
Author(s):  
J.S. Kang ◽  
Y. Huang ◽  
C.W. Lee ◽  
Chan Gyung Park
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Cooling Rate ◽  
High Strength ◽  
Nucleation Site ◽  
Polygonal Ferrite ◽  
Low Alloy Steels ◽  
Low Carbon ◽  
Microstructure And Mechanical Properties ◽  
Average Grain Size

Effects of deformation at austenite region and cooling rate on the microstructure and mechanical properties of low carbon (0.06 wt. % C) high strength low alloy steels have been investigated. Average grain size decreased and polygonal ferrite transformation promoted with increasing deformation amount at austenite region due to increase of ferrite nucleation site. Microstructure was also influenced by cooling rate resulting in the development of a mixture of fine polygonal ferrite and acicular ferrite at 10°C/s cooling rate. Discontinuous yielding occurred in highly deformed specimen due to the formation of polygonal ferrite. However, small grain size of highly deformed specimen caused lower ductile-to-brittle transition temperature than slightly deformed specimen.

Effect of SiC Nanoparticles Dispersion on the Microstructure and Mechanical Properties of Electroplated Sn-Bi Solder Alloy

2010 ◽  
Vol 11 ◽  
pp. 113-118 ◽  
Author(s):  
Chang Woo Lee ◽  
Y.S. Shin ◽  
S.H. Yoo
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Solder Alloy ◽  
High Reliability ◽  
Nanoparticle Dispersion ◽  
Sic Nanoparticles ◽  
Microstructure And Mechanical Properties ◽  
Nanoparticles Dispersion ◽  
Average Grain Size ◽  
Joining Strength

The effect of SiC nanoparticle dispersion was investigated for microstructure change and mechanical properties of Sn-Bi electroplated alloys. The diameters of SiC nanoparticle in this study were 45-55 nm. The SiC nanoparticles were mixed with Sn-Bi electroplating and then the nanoparticles were dispersed with ultrasonic vibrator. After the dispersion, the SiC dispersed Sn-Bi alloys were electroplated on Cu deposited Si wafer. The microstructure and mechanical properties of the sample were evaluated by FE-TEM, FE-SEM, EDS, and shear tester. For TEM observation, the specimens were prepared by ultramicrotome and FIB. The SiC nanoparticles were well-dispersed in Sn-Bi alloy. SiC particles were located near grain boundaries or grain inside. The average grain size of the solder alloy was decrease about 30% compared with the grain size of Sn-Bi alloy prepared in the same condition. Due to the grain refinement and dispersion hardening by SiC nanoparticles, the SiC dispersed Sn-Bi alloy is expected to obtain high reliability and joining strength when it applied to interconnection materials.

scholarly journals Development of Al–Mg–Si alloy performance by addition of grain refiner Al–5Ti–1B alloy

2021 ◽  
Vol 104 (2) ◽  
pp. 003685042110294
Author(s):  
Khaled Abd El-Aziz ◽  
Emad M Ahmed ◽  
Abdulaziz H Alghtani ◽  
Bassem F Felemban ◽  
Hafiz T Ali ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Grain Size ◽  
Corrosion Resistance ◽  
Testing Machine ◽  
Dendritic Structure ◽  
Grain Refiner ◽  
Corrosion Properties ◽  
Average Grain Size ◽  
Structural Applications ◽  
Alloy Addition

Aluminum alloys are the most essential part of all shaped castings manufactured, mainly in the automotive, food industry, and structural applications. There is little consensus as to the precise relationship between grain size after grain refinement and corrosion resistance; conflicting conclusions have been published showing that reduced grain size can decrease or increase corrosion resistance. The effect of Al–5Ti–1B grain refiner (GR alloy) with different percentages on the mechanical properties and corrosion behavior of Aluminum-magnesium-silicon alloy (Al–Mg–Si) was studied. The average grain size is determined according to the E112ASTM standard. The compressive test specimens were made as per ASTM: E8/E8M-16 standard to get their compressive properties. The bulk hardness using Vickers hardness testing machine at a load of 50 g. Electrochemical corrosion tests were carried out in 3.5 % NaCl solution using Autolab Potentiostat/Galvanostat (PGSTAT 30).The grain size of the Al–Mg–Si alloy was reduced from 82 to 46 µm by the addition of GR alloy. The morphology of α-Al dendrites changes from coarse dendritic structure to fine equiaxed grains due to the addition of GR alloy and segregation of Ti, which controls the growth of primary α-Al. In addition, the mechanical properties of the Al–Mg–Si alloy were improved by GR alloy addition. GR alloy addition to Al–Mg–Si alloy produced fine-grained structure and better hardness and compressive strength. The addition of GR alloy did not reveal any marked improvements in the corrosion properties of Al–Mg–Si alloy.

Study of mechanical properties of indium-based solder alloys for cryogenic applications

2022 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Madhuri Chandrashekhar Deshpande ◽  
Rajesh Chaudhari ◽  
Ramesh Narayanan ◽  
Harishwar Kale
Keyword(s):  
Mechanical Properties ◽  
Solder Alloy ◽  
Charpy Impact ◽  
Charpy Impact Test ◽  
Test Results ◽  
Solder Alloys ◽  
Content Type ◽  
Electron Microscope Analysis ◽  
American Society ◽  
Work Done

Purpose This study aims to develop indium-based solders for cryogenic applications. Design/methodology/approach This paper aims to investigate mechanical properties of indium-based solder formulations at room temperature (RT, 27 °C) as well as at cryogenic temperature (CT, −196 °C) and subsequently to find out their suitability for cryogenic applications. After developing these alloys, mechanical properties such as tensile and impact strength were measured as per American Society for Testing and Materials standards at RT and at CT. Charpy impact test results were used to find out ductile to brittle transition temperature (DBTT). These properties were also evaluated after thermal cycling (TC) to find out effect of thermal stress. Scanning electron microscope analysis was performed to understand fracture mechanism. Results indicate that amongst the solder alloys that have been studied in this work, In-34Bi solder alloy has the best all-round mechanical properties at RT, CT and after TC. Findings It can be concluded from the results of this work that In-34Bi solder alloy has best all-round mechanical properties at RT, CT and after TC and therefore is the most appropriate solder alloy amongst the alloys that have been studied in this work for cryogenic applications Originality/value DBTT of indium-based solder alloys has not been found out in the work done so far in this category. DBTT is necessary to decide safe working temperature range of the alloy. Also the effect of TC, which is one of the major reasons of failure, was not studied so far. These parameters are studied in this work.

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