Monitoring on Creation and Annihilation of Interface Trap Levels with NO Oxidation, Re-Oxidation and N2 Annealing with Conductance Measurements

2020 ◽  
Vol 1004 ◽  
pp. 595-600
Author(s):  
Xiang Zhou ◽  
Collin W. Hitchcock ◽  
Rajendra P. Dahal ◽  
Gyanesh Pandey ◽  
Jacob Kupernik ◽  
...  
Keyword(s):  
Gate Oxide ◽  
Metal Oxide Semiconductor ◽  
No Oxidation ◽  
Oxide Semiconductor ◽  
Electron Trapping ◽  
Process Conditions ◽  
Interface Trap ◽  
Annihilation Process ◽  
Mos Capacitors ◽  
Trap Levels

We have determined, using the Conductance-Frequency (G-ω) Technique, the creation and annihilation process of the 3 interface trap levels (OX, OX’ and NI levels) previously reported [1-3] and their possible correlation to inversion electron trapping and mobilities. The measurements were carried out on various 4H-SiC Metal Oxide Semiconductor (MOS) capacitors that have been processed using several gate oxide processes [2,5,6]. Our analysis focus on the correlation of the interface trap levels on the process conditions so as to first understand and then control their formation.

Reliability of 4H-SiC(000-1) MOS Gate Oxide Using N2O Nitridation

2009 ◽  
Vol 615-617 ◽  
pp. 557-560 ◽  
Author(s):  
Takuma Suzuki ◽  
Junji Senzaki ◽  
Tetsuo Hatakeyama ◽  
Kenji Fukuda ◽  
Takashi Shinohe ◽  
...  
Keyword(s):  
Dielectric Breakdown ◽  
Gate Oxide ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Band Offset ◽  
Mos Capacitors ◽  
Conduction Band Offset ◽  
Time Dependent Dielectric Breakdown ◽  
Oxide Reliability ◽  
Mos Gate

The oxide reliability of metal-oxide-semiconductor (MOS) capacitors on 4H-SiC(000-1) carbon face was investigated. The gate oxide was fabricated by using N2O nitridation. The effective conduction band offset (Ec) of MOS structure fabricated by N2O nitridation was increased to 2.2 eV compared with Ec = 1.7 eV for pyrogenic oxidation sample of. Furthermore, significant improvements in the oxide reliability were observed by time-dependent dielectric breakdown (TDDB) measurement. It is suggested that the N2O nitridation as a method of gate oxide fabrication satisfies oxide reliability on 4H-SiC(000-1) carbon face MOSFETs.

Current conduction mechanisms in thermal nitride and dry gate oxide grown on 4H-silicon carbide (SiC)

2017 ◽  
Vol 20 (1) ◽  
Author(s):  
Li Liu ◽  
Yin-Tang Yang
Keyword(s):  
Barrier Height ◽  
Conduction Mechanism ◽  
Gate Oxide ◽  
Annealed Sample ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Mos Capacitors ◽  
Electrical Fields ◽  
Conduction Mechanisms ◽  
Current Conduction

AbstractCurrent conduction mechanisms of SiC metal-oxide-semiconductor (MOS) capacitors on n-type 4H-SiC with or without NO annealing have been investigated in this work. It has been revealed that Fowler-Nordheim (FN) tunneling is the dominating current conduction mechanism in high electrical fields, with barrier height of 2.67 and 2.54 eV respectively for samples with NO and without NO annealing. A higher barrier height for NO-annealed sample indicates the effect of N element on the SiC/SiO

Electrical Characterization of GaN Metal Oxide Semiconductor Diode using Sc2O3 as the Gate Oxide

2001 ◽  
Vol 693 ◽  
Author(s):  
R. Mehandru ◽  
B.P. Gila ◽  
J. Kim ◽  
J.W. Johnson ◽  
K.P. Lee ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Inductively Coupled Plasma ◽  
Electron Cyclotron Resonance ◽  
Gate Oxide ◽  
Metal Oxide Semiconductor ◽  
Trap Density ◽  
Oxide Semiconductor ◽  
Semiconductor Diode ◽  
Interface Trap Density ◽  
Interface Trap

AbstractGaN metal oxide semiconductor diodes were demonstrated utilizing Sc2O3 as the gate oxide. Sc2O3 was grown at 100°C on MOCVD grown n-GaN layers in a molecular beam epitaxy (MBE) system, using a scandium elemental source and an Electron Cyclotron Resonance (ECR) oxygen plasma. Ar/Cl2 based discharges was used to remove Sc2O3, in order to expose the underlying n-GaN for ohmic metal deposition in an Inductively Coupled Plasma system. Electron beam deposited Ti/Al/Pt/Au and Pt/Au were utilized as ohmic and gate metallizations, respectively. An interface trap density of 5 × 1011 eV-1cm-2was obtained with the Terman method. Conductance-voltage measurements were also used to estimate the interface trap density and a slightly higher number was obtained as compared to the Terman method. Results of capacitance measurements at elevated temperature (up to 300°C) indicated the presence of deep states near the interface.

Stable Phosphorus Passivated SiO2/4H-SiC Interface Using Thin Oxides

2014 ◽  
Vol 806 ◽  
pp. 139-142 ◽  
Author(s):  
Yogesh K. Sharma ◽  
A.C. Ahyi ◽  
Tamara Issacs-Smith ◽  
M.R. Jennings ◽  
S.M. Thomas ◽  
...  
Keyword(s):  
Metal Oxide Semiconductor ◽  
Trap Density ◽  
Oxide Semiconductor ◽  
Interface Trap Density ◽  
Interface Trap ◽  
Polar Material ◽  
Mos Capacitors ◽  
Channel Mobility ◽  
Inversion Channel ◽  
Phosphosilicate Glass

The NO (nitric oxide) passivation process for 4H-SiC MOSFETs (silicon carbide metal-oxide-semiconductor filed effect transistors) effectively reduces the interface trap density and increases the inversion channel mobility from less that 10 to around 35cm2/V.s, only 5% of the bulk mobility. Recent results on the phosphorous passivation of the SiO2/4H-SiC interface have shown that it improves the mobility to about 90 cm2/V.s. Phosphorous passivation converts oxide (SiO2) into phosphosilicate glass (PSG) which is a polar material and results in device instabilities under abias-temperature stress (BTS) measurements. To limit the polarization effect, a new thin PSG process has been developed. The interface trap density of 4H-SiC-MOS capacitors using this process is as low as 3x1011cm-2eV-1. BTS results on MOSFETs have shown that the thin PSG devices are as stable as NO passivated devices with mobility around 80 cm2/V.s.

Electrical Properties of Thermally Grown SiO2-SiC Interfaces

1992 ◽  
Vol 242 ◽  
Author(s):  
Nitya N. Singh ◽  
A. Rys ◽  
A. U. Ahmed
Keyword(s):  
Electrical Properties ◽  
Metal Oxide ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Interface Trap ◽  
Mos Capacitors ◽  
Time Constants ◽  
Fixed Charges ◽  
Emission Time ◽  
Thermally Grown

ABSTRACTFabrication processes of metal-oxide semiconductor (MOS) capacitors on n-type, Si-face, 6H-SiC were studied. The effects of thermal oxidation conditions at temperatures between 1100 and 1250°C on the electrical properties of MOS capacitors were determined. The wafers were annealed under argon to improve the C-V characteristics. C-V characteristics of AI-SiO2-SiC metal-oxide-semiconductor were measured at high frequency in the dark and under illumination. In the dark inversion does not occur, probably owing to the absence of minority carriers due to the large band gap of 6H-SiC. The accumulation, depletion, and inversion regions were clearly observed when the C-V measurements were made under illumination for both wet and dry thermally grown oxides. The interface trap densities and emission time constants of fast states were determined by ac conductance measurements. From the analysis of data we obtained a total of Fixed charges and the slow interface traps, Nf + NssSlow of 1.5 to 3.3 × 1012 cm-2, fast interface trap densities, NssFast of 0.5 to 1.7 × 1011 cm-2 eV-1 and emission times constant of 0.3 to 1.4 μsec for wet oxidation. For dry oxidation, Nf + N, ssSlow of 3.5 to 11.2 × 10cm-2, NssFast of 0.7 to 1.25 × 1010 cm-2 eV-1 and emission time constants of 0.6 to 2 μsec were obtained.

Investigation of Oxide Films Prepared by Direct Oxidation of C-Face 4H-SiC in Nitric Oxide

2010 ◽  
Vol 645-648 ◽  
pp. 515-518 ◽  
Author(s):  
Dai Okamoto ◽  
Hiroshi Yano ◽  
Yuki Oshiro ◽  
Tomoaki Hatayama ◽  
Yukiharu Uraoka ◽  
...  
Keyword(s):  
Field Effect ◽  
High Performance ◽  
Room Temperature ◽  
Field Effect Transistors ◽  
Gate Oxide ◽  
Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Interface Traps ◽  
Direct Oxidation ◽  
Mos Capacitors

Characteristics of metal–oxide–semiconductor (MOS) capacitors and MOS field-effect transistors (MOSFETs) fabricated by direct oxidation of C-face 4H-SiC in NO were investigated. It was found that nitridation of the C-face 4H-SiC MOS interface generates near-interface traps (NITs) in the oxide. These traps capture channel mobile electrons and degrade the performance of MOSFETs. The NITs can be reduced by unloading the samples at room temperature after oxidation. It is important to reduce not only the interface states but also the NITs to fabricate high-performance C-face 4H-SiC MOSFETs with nitrided gate oxide.

Electrical Characterization of GaN Metal Oxide Semiconductor Diodes Using MgO as the Gate Oxide

2001 ◽  
Vol 693 ◽  
Author(s):  
J. Kim ◽  
B. P. Gila ◽  
R. Mehandru ◽  
J.W. Johnson ◽  
J. H. Shin ◽  
...  
Keyword(s):  
Metal Oxide ◽  
Electron Cyclotron Resonance ◽  
Gate Oxide ◽  
State Density ◽  
Metal Oxide Semiconductor ◽  
Trap Density ◽  
Oxide Semiconductor ◽  
Interface Trap Density ◽  
Interface Trap ◽  
Conductance Method

AbstractGaN metal oxide semiconductor diodes were demonstrated utilizing MgO as the gate oxide. MgO was grown at 100°C on MOCVD grown n-GaN in a molecular beam epitaxy system using a Mg elemental source and an electron cyclotron resonance oxygen plasma. H3PO4 based wet-chemical etchant was used to remove MgO to expose the underlying n-GaN for ohmic metal deposition. Electron deposited Ti/Al/Pt/Au and Pt/Au were utilized as ohmic and gate metallization, respectively. An interface trap density of low-to-mid 1011 eV-1cm-2was obtained from temperature conductance-voltage measurements. Terman method was also used to estimate the interface trap density and a slight lower number was obtained as compared to the conductance method. Results from elevated temperature (up to 300°C) conductance measurements showed an interface state density roughly three times higher(6x1011 eV–1 cm-2 ) than at 25°C.

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