Fabrication of Micro Components to Silicon Wafer Using EDM Process

2006 ◽  
Vol 505-507 ◽  
pp. 217-222 ◽  
Author(s):  
Feng Tsai Weng ◽  
Chen Siang Hsu ◽  
Wen Feng Lin
Keyword(s):  
Tungsten Carbide ◽  
Silicon Wafer ◽  
Electrode Array ◽  
Copper Electrode ◽  
Silicon Wafers ◽  
Tool Electrode ◽  
Micro Holes ◽  
Micro Hole ◽  
Fine Tungsten ◽  
Edm Process

In this paper, the machining possibilities of silicon wafers by the EDM process are described. Micro components of silicon wafer were processed by EDM process. A fine tungsten carbide rod was machined as tool electrode for EDM process. Performance was investigated utilizing serious experiments. Micro hole was process with the fine electrode using EDM drilling. Micro slots were also processed on the surface of a silicon plate by a copper section electrode. The surface roughness of the silicon wafers in the EDM process was investigated. Array-micro-hole was machined by a tungsten carbide multi-electrode. Array micro holes on the coaxial circle were processed by a graphite-copper electrode of Dia.0.45mm. Batch production technology for economical EDM machining of micro holes were proposed.

scholarly journals Improving the precision of micro-EDM for blind holes in titanium alloy by fixed reference axial compensation

2021 ◽  
Vol 60 (1) ◽  
pp. 771-783
Author(s):  
Chaohui Lin ◽  
Jiaming Li ◽  
Shiyong Liang ◽  
Yonghui Zhang ◽  
Junfeng Gou ◽  
...  
Keyword(s):  
Electrode Materials ◽  
Electrical Discharge Machining ◽  
Copper Electrode ◽  
Pulse Power ◽  
Tool Electrode ◽  
Electrode Wear ◽  
Micro Holes ◽  
Micro Hole ◽  
Fixed Reference ◽  
Tungsten Steel

Abstract During the electrical discharge machining (EDM) process, the tool electrode wear is inevitable, which affects the process precision of the micro-hole. In the present experimental investigation, a fixed reference axial compensation (FRAC) method is proposed to enhance the machining precision of micro-hole. The effect of pulse power, compensation methods, and electrode materials on the depth and roundness factor of micro-hole are explored. The experiment results show that the FRAC method can realize the accurate compensation and reach the expected depth hole processing. When the FRAC is used, the depth deviation is less than 0.43%, and the minimum difference from the expected depth is only 0.106 µm. In addition, the micro-holes of tungsten steel and brass electrodes machine by the FRAC method were close to the expected depth, the difference from the expected depth less than 0.7%, but the bottom of micro-hole produced a cone. However, compared to tungsten steel and brass electrodes, the copper electrode has a better processing performance, the roundness factor is up to 79.8%. When the long-pulse power supply is applied, the expected depth of 400–1,600 µm blind holes with a better processing shape, and the phenomenon of the cone at the bottom are not apparent. Therefore, the proposed FRAC method can be utilized in many high-end manufacturing fields to improve the precision of the micro-hole for micro features.

Development of Tool Electrode High Frequency Vibration Assisted Micro-Hole EDM Machine for Industry Environment

2010 ◽  
Vol 44-47 ◽  
pp. 430-435
Author(s):  
Ming Gang Xu ◽  
Xue Ke Luo ◽  
Yong Li
Keyword(s):  
High Frequency ◽  
Main Body ◽  
Tool Electrode ◽  
High Frequency Vibration ◽  
Electrical Control ◽  
Industry Environment ◽  
Micro Holes ◽  
Micro Hole ◽  
Micro Tool ◽  
Series Of Experiments

A new tool electrode high frequency vibration assisted micro-hole EDM machine tool aimed to resolve the problem of machine large quantities micro holes in industry was designed. The machine is mainly composed of main body, electrical control module and assistant mechanisms etc. And drawn tungsten wire was used as the micro tool electrode. A series of experiments were carried out using the micro-hole EDM machine.

Generation of Microelectrodes for Micro EDM

2013 ◽  
Vol 581 ◽  
pp. 310-315
Author(s):  
Kohichi Miura ◽  
Shun Ichiro Kohmo ◽  
Takazo Yamada ◽  
Hwa Soo Lee
Keyword(s):  
High Precision ◽  
Thrust Force ◽  
High Accuracy ◽  
Micro Edm ◽  
Turning Operation ◽  
Micro Holes ◽  
Micro Hole ◽  
Short Time ◽  
Hole Machining ◽  
Edm Process

In order to fabricate micro holes by EDM process, microelectrodes with high accuracy of form are needed. At present, micro electrodes are generated by grinding and/or on-machine EDM operations and then it is well known that efficient productivity of micro electrodes cannot be realized. Controlling method of thrust force for micro shaft is already proposed. Applying this method, thrust force is controlled to be 0 in turning operation, therefore microelectrodes are generated efficiently. Actually, microelectrode which diameter is less than 0.1 mm can be easily machined in short time. high-precision micro hole machining requires microelectrodes with high cylindricity. In this study, turning method for microelectrodes with high cylindricity is discussed.

scholarly journals Investigating Tungsten Carbide Micro-Hole Drilling Characteristics by Desktop Micro-ECM with NaOH Solution

Micromachines ◽  
2018 ◽  
Vol 9 (10) ◽  
pp. 512 ◽  
Author(s):  
Yung-Yi Wu ◽  
Dong-Yea Sheu
Keyword(s):  
Tool Wear ◽  
Tungsten Carbide ◽  
Low Cost ◽  
Machining Process ◽  
Hole Drilling ◽  
Tungsten Carbides ◽  
Micro Ecm ◽  
Micro Holes ◽  
Micro Hole ◽  
Drawing Dies

Due to their hardness and low tool wear, tungsten carbides are widely used in industrial applications, such as spray nozzles, wire drawing dies and spinning nozzles. However, there is no conventional machining process that is capable of fabricating micro-holes, slots and complicated shapes in tungsten carbide. In this study, a low-cost desktop micro electro-chemical machining (ECM) was developed to investigate the characteristics of tungsten carbide micro-hole drilling. The performance parameters of the machining conditions by desktop micro-ECM, such as the machining time, material removal rate, relative tool wear rate, surface quality and dimensional accuracy, were also investigated in this study. The experimental results demonstrate that the low-cost desktop micro-ECM could fabricate micro-holes in the tungsten cemented carbide (WC-Co) workpiece.

scholarly journals Influence of Adaptive Gap Control Mechanism and Tool Electrodes on Machining Titanium (Ti-6Al-4V) Alloy in EDM Process

Materials ◽  
2022 ◽  
Vol 15 (2) ◽  
pp. 513
Author(s):  
Shoufa Liu ◽  
Muthuramalingam Thangaraj ◽  
Khaja Moiduddin ◽  
Abdulrahman M. Al-Ahmari
Keyword(s):  
Titanium Alloy ◽  
Tungsten Carbide ◽  
Control Mechanism ◽  
Air Gap ◽  
Tool Electrode ◽  
Discharge Energy ◽  
Linear Action ◽  
Control Scheme ◽  
Gap Control ◽  
Edm Process

Titanium alloy is widely used for orthodontic technology and easily machined using the EDM process. In the EDM process, the workpiece and tool electrode must be separated by a continuous air gap during the machining operation to generate discharge energy in this method. In the present study, an endeavor was made to analyze the effects of a servo feed air gap control and tool electrode in the EDM process. The developed mechanical setup consists of a linear action movement with zero backlash along the X-axis, which can be controlled up to 0.03 mm. It was observed that the suggested air gap control scheme can enhance the servo feed mechanism on a machining titanium alloy. A tungsten carbide electrode can enhance the surface measures owing to its ability to produce tiny craters with uniform distribution. Since it produces a little crater and has a higher melting point, a tungsten carbide electrode can create lesser surface roughness than a copper tool and brass tool electrode.

Effect of SiC-Cu Electrode on Material Removal Rate, Tool Wear and Surface Roughness in EDM Process

2020 ◽  
Vol 38 (9A) ◽  
pp. 1406-1413
Author(s):  
Yousif Q. Laibia ◽  
Saad K. Shather
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal Rate ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
304 Stainless Steel ◽  
Tool Electrode ◽  
Pulse Time ◽  
Edm Process

Electrical discharge machining (EDM) is one of the most common non-traditional processes for the manufacture of high precision parts and complex shapes. The EDM process depends on the heat energy between the work material and the tool electrode. This study focused on the material removal rate (MRR), the surface roughness, and tool wear in a 304 stainless steel EDM. The composite electrode consisted of copper (Cu) and silicon carbide (SiC). The current effects imposed on the working material, as well as the pulses that change over time during the experiment. When the current used is (8, 5, 3, 2, 1.5) A, the pulse time used is (12, 25) μs and the size of the space used is (1) mm. Optimum surface roughness under a current of 1.5 A and the pulse time of 25 μs with a maximum MRR of 8 A and the pulse duration of 25 μs.

Improvement of thread turning process using micro-hole textured solid-lubricant embedded tools

2021 ◽  
pp. 095440542110199
Author(s):  
Salman Khani ◽  
Seyedhamidreza Shahabi Haghighi ◽  
Mohammad Reza Razfar ◽  
Masoud Farahnakian
Keyword(s):  
Surface Roughness ◽  
Mechanical Strength ◽  
Solid Lubricant ◽  
Operating Cost ◽  
Contact Length ◽  
Solid Lubrication ◽  
Turning Process ◽  
Micro Holes ◽  
Micro Hole ◽  
Cutting Inserts

In this paper, the thread turning of aluminum 7075-T6 alloy is studied using micro-hole textured solid-lubricant embedded carbide inserts. The primary focus of this work is to enhance the performance of the thread turning process for producing high quality threaded parts. To achieve this, micro-holes were generated by laser micro-machining on the rake face of tools and then, MoS2 and CNT (carbon nanotube) solid-lubricants were embedded into micro-holes. The effects of micro-holes and solid-lubrication on the performance of the thread turning process were examined using traditional tool ( T0), micro-hole textured tool ( T1), micro-hole textured MoS2 embedded tool ( T2), and micro-hole textured CNT embedded tool ( T3). In this study, cutting forces, chip-tool contact length, built-up edge (BUE), surface roughness, and operating cost were investigated. The influence of micro-hole generation on the mechanical strength of cutting inserts was evaluated using the finite element method. The results showed that the fabrication of the micro-holes on the rake surface of cutting inserts has no significant effect on the mechanical strength of the tools. The comparisons of our method with traditional tools demonstrated that the cutting performance improved in the threading process. Our results reveal that the main cutting force, radial thrust force, surface roughness, built-up edge, and chip-tool contact length reduced 37.1%, 40.9%, 37.9%, 58.3%, and 38.2%, respectively, as T3 tools are applied in this process. A cost analysis, based on estimated tooling costs, showed that the T3 tool can yield an 18% reduction in overall operating cost.

scholarly journals The Influence of Wire Speed on Phase Transitions and Residual Stress in Single Crystal Silicon Wafers Sawn by Resin Bonded Diamond Wire Saw

Micromachines ◽  
2021 ◽  
Vol 12 (4) ◽  
pp. 429
Author(s):  
Tengyun Liu ◽  
Peiqi Ge ◽  
Wenbo Bi
Keyword(s):  
Residual Stress ◽  
Surface Layer ◽  
Phase Transitions ◽  
Single Crystal ◽  
Amorphous Silicon ◽  
Silicon Wafer ◽  
Single Crystal Silicon ◽  
Silicon Wafers ◽  
Crystal Silicon ◽  
Diamond Wire

Lower warp is required for the single crystal silicon wafers sawn by a fixed diamond wire saw with the thinness of a silicon wafer. The residual stress in the surface layer of the silicon wafer is the primary reason for warp, which is generated by the phase transitions, elastic-plastic deformation, and non-uniform distribution of thermal energy during wire sawing. In this paper, an experiment of multi-wire sawing single crystal silicon is carried out, and the Raman spectra technique is used to detect the phase transitions and residual stress in the surface layer of the silicon wafers. Three different wire speeds are used to study the effect of wire speed on phase transition and residual stress of the silicon wafers. The experimental results indicate that amorphous silicon is generated during resin bonded diamond wire sawing, of which the Raman peaks are at 178.9 cm−1 and 468.5 cm−1. The ratio of the amorphous silicon surface area and the surface area of a single crystal silicon, and the depth of amorphous silicon layer increases with the increasing of wire speed. This indicates that more amorphous silicon is generated. There is both compressive stress and tensile stress on the surface layer of the silicon wafer. The residual tensile stress is between 0 and 200 MPa, and the compressive stress is between 0 and 300 MPa for the experimental results of this paper. Moreover, the residual stress increases with the increase of wire speed, indicating more amorphous silicon generated as well.

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