A Study of Double Sided Polishing Process for Ultra-Smooth Surface of Silicon Wafer

2006 ◽  
Vol 532-533 ◽  
pp. 472-475 ◽  
Author(s):  
Wei Li ◽  
Xiao Dong Hu ◽  
Yang Fu Jin ◽  
Gang Xiang Hu ◽  
Xiao Zhen Hu

Double sided polishing process has become a main machining method for silicon wafer finishing process, but it is difficult to get ultra-smooth surface with the very stringent machining conditions. In this paper, the mechanism of ultra-smooth surface machining process was studied, the main parameters affecting the surface quality of silicon wafer, such as the polishing pad and carrier rotation speed, polishing press, polishing slurries etc. , were discussed and optimized, then ultra-smooth surface of silicon wafer with Ra 0.4nm has been obtained based on the above study. A new double sided polishing machine with computer control system equipped with a digital controlled press valve was developed, and the ultra-smooth machining process of silicon wafer was established in this paper.

2014 ◽  
Vol 608-609 ◽  
pp. 19-22
Author(s):  
Ping Xu ◽  
Jian Gang Yi

Hydraulic descaling system is the key device to ensure the surface quality of billet. However, traditional control methods lead to the stability problem in hydraulic descaling system. To solve the problem, the construction of the hydraulic descaling computer control system is studied, the working principle of the system is analyzed, and the high pressure water bench of hydraulic descaling is designed. Based on it, the corresponding computer control software is developed. The application shows that the designed system is stable in practice, which is helpful for enterprise production.


Author(s):  
Sachin Singh ◽  
M Ravi Sankar

The finishing operation completes the manufacturing cycle of a component. Depending on the level of finish (micro and nano) required on the component surface, different finishing processes are employed. Several components employed in medical, automotive and chemical industries use different types of passages for the flow of fluid. The surface roughness of such passages decides the functionality of the component. Drug-eluting stents are one of the recent advancements in the medical industry. They possess microholes for release of the drugs to the point of cure. Microholes are mostly fabricated by thermal-based micromachining processes that generate metallurgically destroyed surface layers with high surface roughness. Later, these are polished using chemical or electrochemical polishing techniques, which chemically destroy the quality of the surface. These metallurgically and chemically modified (destroyed/changed) rough surfaces on the microhole wall can cause contamination of the drug. So in this article, microholes of diameter 850 ± 30 µm are fabricated in surgical stainless steel (SS 316L) workpieces using the electric discharge micromachining process. Machined microholes are finished by employing a non-traditional finishing process called the abrasive flow finishing process. Instead of using a commercially available expensive abrasive flow finishing medium, the economic medium is fabricated in-house, and its rheological study is carried out. Machining process produces microholes with a surface roughness of about 1.40 ± 0.10 µm. Later, by finishing of microholes with the abrasive flow finishing process, the surface roughness is reduced to 150 nm (percentage surface roughness improvement of about 88.53%). Therefore, the abrasive flow finishing process is a viable alternative to chemical-based polishing processes as it removes the recast layer and achieves nanosurface roughness.


2008 ◽  
Vol 389-390 ◽  
pp. 61-66
Author(s):  
Takeshi Tanaka

The purpose of this study is to fabricate a wheel using fullerenes with nano-scaled particles, and to investigate the polishing performance of fullerene wheel. A super smooth surface was formed on a silicon wafer by polishing the wafer with metal-bonded diamond wheels using a diamond abrasive grit of 0-0.125 μm and fullerenes with a diameter of 0.7 nm. We used two kinds of metal-bonded diamond wheels for pre-polishing and a metal-bonded fullerene wheel for the finishing process. Though the surface roughness after polishing with the fullerene wheel was almost equal to that obtained by polishing with the metal-bonded diamond wheel using diamond abrasive grit of 0-0.125 μm, the chemical-mechanical polishing process was clarified by AFM (atomic force microscope) observation when we used a metal-bonded fullerene wheel with 5wt% KOH (potassium hydroxide) solution. The greater number of smoothed portions on the surface of the silicon wafer indicated that the fullerenes provided the same polishing ability as that of the abrasive grit.


2010 ◽  
Vol 135 ◽  
pp. 69-72
Author(s):  
Jian Ming Zhan ◽  
Si Hai Yu

Generally, aspheric surfaces require extra high accuracy and roughness and need to be polished further after being shaped. Because the interaction between tool and work-piece in polishing process is compliant, rather than the kind of rigid cutting, the machining quality and machining process are closely allied to the physical properties of the work-piece material. A new three-degree-of-freedom hybrid position/force servo polishing system, which is based on universal CNC Lathe, is developed, and the effect of work-piece materials on the polishing process and processing quality of aspheric surfaces is studied after aspheric parts are compliantly polished in accordance with the Preston removal regulation in this paper.


2013 ◽  
Vol 339 ◽  
pp. 762-765
Author(s):  
Kyoung Jin Kim

In the silicon wafer polishing process, the mounting of wafer on the polishing head could be greatly influential in final quality of finished wafers. This paper focuses on the waxless wafer mounting technique which could replace the traditional wax wafer mounting. Mounting of wafers on the carrier block using a wetted porous template provides a simple way of securing wafer on polishing head for precision wafer polishing. Demounting of wafers from the porous pad is carried out by using the water jet impingement which takes only a couple of seconds for wafer demounting. A series of wafer polishing tests of 8 inch silicon wafers using the present wafer mounting system found that the developed waxless wafer mounting could be quite suitable for producing the wafers of the excellent surface qualities by meeting industry standard such as SBIR, LLS, and production yield.


2021 ◽  
Vol 7 (2) ◽  
pp. 77-80
Author(s):  
Sven Simeunovic ◽  
Christiane Jung ◽  
Dominik Mory ◽  
Daniel Seiler ◽  
Michael de Wild

Abstract With the introduction of novel automated polishing methods, more attention has recently been paid to postprocessing methods of metallic implants. One such method is the polishing process known as DryLyte®. The most significant difference to previous electropolishing methods is the use of solid organic polymer particles activated with sulfonic acid acting as the electrolyte. The solid particle electrolyte raises new question in terms of polishing results for small features as well as overall polishing quality of metallic surfaces. The aim of this study was to determine the quality of the polishing process for titanium rods with different initial surface roughness and with tapped holes in three different orientations (0°, 45°, 90°) by subjecting them to the DryLyte® polishing process for 30 min. In addition, the influence of the process parameters voltage and the anodic time T2 during the treatment on the resulting surface quality and the polishing efficiency was determined. In conclusion, the dry electrochemical finishing process has shown great smoothing capabilities for titanium even with small, tapped holes. The Ra values were lowered significantly throughout all titanium samples after 30 min polishing time.


Author(s):  
Xin Li ◽  
Yuliang Zhang ◽  
Jianping Yu ◽  
Xiaolei Deng

Background: Cutter abnormal vibration occurs frequently during the spiral surface machining process, and it results in low quality of finished surface. In order to suppress cutter abnormal vibration effectively, it is necessary to detect abnormal vibration as soon as possible, but the analysis and processing of the cutter abnormal vibration signal in spiral surface machining are difficult because of its complicated components and non-linear non-stationary characteristics. In this paper, a detection method of abnormal vibration signal based on empirical mode decomposition (EMD) and Hilbert–Huang transform (HHT) is proposed to be applied in spiral surface machining. Method: First, EMD of the cutter vibration signal in the spiral surface machining is performed to obtain a series of intrinsic mode function (IMF) components in different frequency bands. Then, the variation in the energy of each IMF component in the frequency domain and the correlation with the original signal are analyzed to obtain the IMF component with the largest amount of information on abnormal vibration symptom. Finally, Hilbert transform is conducted on the IMF component to extract the symptom features of abnormal vibration. Results: Experimental results show that the EMD–HHT based method to analyze the cutter vibration signal in the spiral surface machining can extract the symptom of abnormal vibration quickly and effectively and detect the abnormal vibration of the cutter rapidly. Conclusion: The proposed method based on HHT in this paper could be successfully used in abnormal vibration detection, and which could also provide basis and guarantee for the subsequent suppression of abnormal vibration.


2013 ◽  
Vol 589-590 ◽  
pp. 447-450 ◽  
Author(s):  
Wen Hua Zhou ◽  
Wei Feng Yao ◽  
Ming Feng ◽  
Bing Hai Lv ◽  
Qian Fa Deng

The surface quality of cylindrical rollers has a great influence on the working life of rolling bearings. In the paper, double-side lapping machine and flannelette pads are applied to polish the cylindrical surface of rollers. After 20 min polishing, rollers with smooth surface are obtained and the roundness of the rollers have a improvement of about 0.3 μm, which means that the polishing process based on double-side lapping method can effectively improve the surface quality and geometric accuracy of cylindrical rollers.


2014 ◽  
Vol 889-890 ◽  
pp. 282-287
Author(s):  
Lin Lin Zeng ◽  
Li Ping Zhou ◽  
Xiao Ying Liu

Control valve is the key element for a thermal power unit. As the core component of the valve assembly, the machining quality of valve bodys mating part is an important factor to restrict the performance of valve, so during the machining process, the demands for dimensional accuracy and surface quality of mating surface are quite high. Firstly, set the cutting tool, cutting parameters and other initial conditions according to enterprises actual requirements of body machining. The Deform 3D which is metal cutting finite element software was used to simulate the boring finishing process of mating surface of the valve body, can effectively analyze the changing rule of cutting force and cutting temperature with time. Then, the single factor analysis method was used to analyze the deformation of boring cutter due to cutting force, temperature and abrasion under the condition of different cutting parameters, which influence the quality and precision of valve bodys machining surface. The analysis results obtained in this paper will provide reference for the choice of cutting parameters in the process of actual valve body finish machining.


2013 ◽  
Vol 797 ◽  
pp. 135-139 ◽  
Author(s):  
Lei Sun ◽  
Wei Gang Guo ◽  
Ju Long Yuan ◽  
Qian Fa Deng ◽  
Ming Feng ◽  
...  

The Quartz substrates are widely used in various fields, and the requirement for the surface quality of quartz substrate is higher than ever before. This paper focuses on the ultra-precision polishing technology for the quartz substrates, and the material removal mechanism in the process of ultra-precision polishing is discussed. The results showed that an extremely smooth surface of quartz substrate was obtained in the ultra-precision polishing process, and the best surface roughness reached Ra 0.82nm. Meanwhile, the thickness can be controlled very well.


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