Structural Changes in Nickel Silicide Thin Films under the Presence of Al and Ga
2010 ◽
Vol 638-642
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pp. 2938-2943
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Keyword(s):
Thin Ni/Al and Ni/Ga layers of different atomic ratios were codeposited onto Si(001) at room temperature followed by subsequent annealing. Influence of annealing temperature on morphology and composition of ternary disilicide NiSi2-xAlx and NiSi2-xGax layers was investigated by transmission electron microscopy. Addition of Al or Ga leads to a decrease of the disilicide formation temperature from 700°C down to at least 500°C. Depending on the composition closed, uniformly oriented NiSi2-xAlx and NiSi2-xGax layers were observed after annealing at 900°C, whereas reaction of a pure Ni film with Si leads to the island formation with a mixture of A- and B-type orientations.
2009 ◽
Vol 65
(6)
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pp. 694-698
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2002 ◽
Vol 17
(2)
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pp. 479-486
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1997 ◽
Vol 12
(7)
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pp. 1734-1740
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