10 kV, 10 A Bipolar Junction Transistors and Darlington Transistors on 4H-SiC

2010 ◽  
Vol 645-648 ◽  
pp. 1025-1028 ◽  
Author(s):  
Qing Chun Jon Zhang ◽  
Robert Callanan ◽  
Anant K. Agarwal ◽  
Albert A. Burk ◽  
Michael J. O'Loughlin ◽  
...  
Keyword(s):  
Breakdown Voltage ◽  
Voltage Drop ◽  
Current Gain ◽  
Bipolar Junction Transistors ◽  
Collector Current ◽  
Forward Voltage ◽  
Collector Voltage ◽  
Forward Voltage Drop ◽  
Chip Size ◽  
Dc Current

4H-SiC Bipolar Junction Transistors (BJTs) and hybrid Darlington Transistors with 10 kV/10 A capability have been demonstrated for the first time. The SiC BJT (chip size: 0.75 cm2 with an active area of 0.336 cm2) conducts a collector current of 10 A (~ 30 A/cm2) with a forward voltage drop of 4.0 V (forced current gain βforced: 20) corresponding to a specific on-resistance of ~ 130 mΩ•cm2 at 25°C. The DC current gain, β, at a collector voltage of 15 V is measured to be 28 at a base current of 1 A. Both open emitter breakdown voltage (BVCBO) and open base breakdown voltage (BVCEO) of ~10 kV have been achieved. The 10 kV SiC Darlington transistor pair consists of a 10 A SiC BJT as the output device and a 1 A SiC BJT as the driver. The forward voltage drop of 4.5 V is measured at 10 A of collector current. The DC forced current gain at the collector voltage of 5.0 V was measured to be 440 at room temperature.

1000 V, 30 A SiC Bipolar Junction Transistors and Integrated Darlington Pairs

2005 ◽  
Vol 483-485 ◽  
pp. 901-904 ◽  
Author(s):  
Sumi Krishnaswami ◽  
Anant K. Agarwal ◽  
Craig Capell ◽  
Jim Richmond ◽  
Sei Hyung Ryu ◽  
...  
Keyword(s):  
Room Temperature ◽  
Voltage Drop ◽  
Active Area ◽  
Current Gain ◽  
Bipolar Junction Transistors ◽  
Collector Current ◽  
Bipolar Junction Transistor ◽  
Forward Voltage Drop ◽  
Junction Transistor ◽  
A Current

1000 V Bipolar Junction Transistor and integrated Darlington pairs with high current gain have been developed in 4H-SiC. The 3.38 mm x 3.38 mm BJT devices with an active area of 3 mm x 3 mm showed a forward on-current of 30 A, which corresponds to a current density of 333 A/cm2, at a forward voltage drop of 2 V. A common-emitter current gain of 40 was measured on these devices. A specific on-resistance of 6.0 mW-cm2 was observed at room temperature. The onresistance increases at higher temperatures, while the current gain decreases to 30 at 275°C. In addition, an integrated Darlington pair with an active area of 3 mm x 3 mm showed a collector current of 30 A at a forward drop of 4 V at room temperature. A current gain of 2400 was measured on these devices. A BVCEO of 1000 V was measured on both of these devices.

1600 V, 5.1 mΩ●cm2 4H-SiC BJT with a High Current Gain of β=70

2008 ◽  
Vol 600-603 ◽  
pp. 1155-1158 ◽  
Author(s):  
Jian Hui Zhang ◽  
Petre Alexandrov ◽  
Jian Hui Zhao
Keyword(s):  
High Performance ◽  
Voltage Drop ◽  
High Gain ◽  
Current Gain ◽  
High Current ◽  
Large Area ◽  
Collector Current ◽  
Forward Voltage Drop ◽  
Ac Current ◽  
Dc Current

This paper reports a newly achieved best result on the common emitter current gain of 4H-SiC high power bipolar junction transistors (BJTs). A fabricated 1600 V – 15 A 4H-SiC power BJT with an active area of 1.7 mm2 shows a high DC current gain (b) of 70, when it conducts 9.8 A collector current at a base current of only 140 mA. The maximum AC current gain (DIC/DIB) is up to 78. This high performance BJT has an open base collector-to-emitter blocking voltage (VCEO) of over 1674 V with a leakage current of 1.6 μA, and a specific on-resistance (RSP-ON) of 5.1 mW.cm2 when it conducts 7.0 A (412 A/cm2) at a forward voltage drop of VCE = 2.1 V. A large area 4H-SiC BJT with a footprint of 4.1 mm x 4.1 mm has also shown a DC current gain over 50. These high-gain, high-voltage and high-current 4H-SiC BJTs further support a promising future for 4H-SiC BJT applications.

High Temperature Characterization of 4H-SiC Bipolar Junction Transistors

2006 ◽  
Vol 527-529 ◽  
pp. 1437-1440 ◽  
Author(s):  
Sumi Krishnaswami ◽  
Anant K. Agarwal ◽  
Jim Richmond ◽  
Craig Capell ◽  
Sei Hyung Ryu ◽  
...  
Keyword(s):  
High Temperature ◽  
Leakage Current ◽  
Current Gain ◽  
Bipolar Junction Transistors ◽  
Linear Region ◽  
Collector Voltage ◽  
Avalanche Behavior ◽  
Dc Current ◽  
Recent Demonstration

This paper summarizes the recent demonstration of 3200 V, 10 A BJT devices with a high common emitter current gain of 44 in the linear region, and a specific on-resistance of 8.1 mΩ- cm2 (10 A at 0.90 V with a base current of 350 mA and an active area of 0.09 cm2). The onresistance increases to 40 mΩ-cm2 at 350°C, while the DC current gain decreases to 30. A sharp avalanche behavior was observed with a leakage current of 10 μA at a collector voltage of 3.2 kV.

The Impact of Schottky Barrier Tunneling on SiC-JBS Performance

2009 ◽  
Vol 615-617 ◽  
pp. 667-670 ◽  
Author(s):  
Gary M. Dolny ◽  
Richard L. Woodin ◽  
T. Witt ◽  
J. Shovlin
Keyword(s):  
Electric Field ◽  
Breakdown Voltage ◽  
Voltage Drop ◽  
Forward Voltage ◽  
Trade Off ◽  
Practical Applications ◽  
Forward Voltage Drop ◽  
Surface Electric Field ◽  
The Impact ◽  
Barrier Tunneling

The impact of barrier tunneling on SiC-JBS performance is studied both experimentally and theoretically. We show that although the pinch-off effects associated with the JBS structure can significantly suppress the surface electric field, barrier tunneling still dominates the reverse behavior. Barrier tunneling determines the apparent breakdown voltage, as well as the apparent breakdown voltage vs. forward voltage drop trade-off of the JBS diode in practical applications.

Influence of Trench Design on the Electrical Properties of 650V 4H-SiC JBS Diodes

2019 ◽  
Vol 963 ◽  
pp. 549-552
Author(s):  
Oleg Rusch ◽  
Jonathan Moult ◽  
Tobias Erlbacher
Keyword(s):  
Electrical Properties ◽  
Leakage Current ◽  
Breakdown Voltage ◽  
Voltage Drop ◽  
Electrical Characteristics ◽  
Electrical Field ◽  
Forward Voltage ◽  
Voltage Drops ◽  
Forward Voltage Drop ◽  
Trench Structure

This work presents a design study of customized p+ arrays having influence on the electrical properties of manufactured 4H-SiC Junction Barrier Schottky (JBS) diodes with designated electrical characteristics of 5 A forward and 650 V blocking capabilities. The effect of the Schottky area consuming p+ grid on the forward voltage drop, the leakage current and therefore the breakdown voltage was investigated. A recessed p+ implantation, realized through trench etching before implanting the bottom of the trenches, results in a more effective shielding of the electrical field at the Schottky interface and therefore reduces the leakage current. Customizing the p+ grid array in combination with the trench structure, various JBS diode variants with active areas of 1.69 mm2 were fabricated whereas forward voltage drops of 1.58 V @ 5 A with blocking capabilities up to 1 kV were achieved.

4.5 kV SiC Junction Barrier Schottky Diodes with Low Leakage Current and High Forward Current Density

2017 ◽  
Vol 897 ◽  
pp. 427-430 ◽  
Author(s):  
Johannes Schoeck ◽  
Jonas Buettner ◽  
Mathias Rommel ◽  
Tobias Erlbacher ◽  
Anton J. Bauer
Keyword(s):  
Leakage Current ◽  
Breakdown Voltage ◽  
Current Density ◽  
Voltage Drop ◽  
Schottky Diodes ◽  
Low Leakage ◽  
Forward Current ◽  
Low Leakage Current ◽  
Forward Voltage Drop ◽  
Chip Size

High-voltage 4H-SiC Junction Barrier Schottky diodes with a reverse breakdown voltage of over 4.5 kV and a turn-on voltage below 1 V have been fabricated. They achieved a forward current of 5 A at a forward voltage drop of 1.8 V and 20 A at 4.2 V. A low reverse leakage current of 0.3 μA at 1.2 kV and 37 μA at 3.3 kV was measured. The chip size was 7.3 mm x 7.3 mm, the active area 0.25 cm2 and the diode was able to handle a repetitive pulse current density of over 300 A/cm2 without degradation. Floating field rings in combination with a field-stop ring were used as edge termination to reach 73 % of the theoretical breakdown voltage. The epitaxial layer was 32 μm thick, with a nitrogen doping concentration of 1 x 1015 cm-3. The JBS diodes have been manufactured in a 100 mm SiC prototyping line, using well established processing technology, to achieve cost-efficient devices.

scholarly journals Mobility Models Based on Forward Current-Voltage Characteristics of P-type Pseudo-Vertical Diamond Schottky Barrier Diodes

Micromachines ◽  
2020 ◽  
Vol 11 (6) ◽  
pp. 598
Author(s):  
Min-Woo Ha ◽  
Ogyun Seok ◽  
Hojun Lee ◽  
Hyun Ho Lee
Keyword(s):  
Schottky Barrier ◽  
Breakdown Voltage ◽  
Doping Concentration ◽  
Voltage Drop ◽  
Mobility Model ◽  
Mobility Models ◽  
Schottky Barrier Diodes ◽  
Forward Voltage ◽  
Forward Voltage Drop ◽  
P Type

Compared with silicon and silicon carbide, diamond has superior material parameters and is therefore suitable for power switching devices. Numerical simulation is important for predicting the electric characteristics of diamond devices before fabrication. Here, we present numerical simulations of p-type diamond pseudo-vertical Schottky barrier diodes using various mobility models. The constant mobility model, based on the parameter μconst, fixed the hole mobility absolutely. The analytic mobility model resulted in temperature- and doping concentration-dependent mobility. An improved model, the Lombard concentration, voltage, and temperature (CVT) mobility model, considered electric field-dependent mobility in addition to temperature and doping concentration. The forward voltage drop at 100 A/cm2 using the analytic and Lombard CVT mobility models was 2.86 and 5.17 V at 300 K, respectively. Finally, we used an empirical mobility model based on experimental results from the literature. We also compared the forward voltage drop and breakdown voltage of the devices, according to variations in p- drift layer thickness and cathode length. The device successfully achieved a low specific on-resistance of 6.8 mΩ∙cm2, a high breakdown voltage of 1190 V, and a high figure-of-merit of 210 MW/cm2.

Development of 1200 V, 3.7 mΩ-cm2 4H-SiC DMOSFETs for Advanced Power Applications

2012 ◽  
Vol 717-720 ◽  
pp. 1059-1064 ◽  
Author(s):  
Sei Hyung Ryu ◽  
Lin Cheng ◽  
Sarit Dhar ◽  
Craig Capell ◽  
Charlotte Jonas ◽  
...  
Keyword(s):  
Threshold Voltage ◽  
Room Temperature ◽  
Voltage Drop ◽  
Drain Current ◽  
Subthreshold Swing ◽  
Active Area ◽  
Gate Bias ◽  
Forward Voltage ◽  
Recent Developments ◽  
Forward Voltage Drop

We present our recent developments in 4H-SiC power DMOSFETs. 4H-SiC DMOSFETs with a room temperature specific on-resistance of 3.7 mΩ-cm2 with a gate bias of 20 V, and an avalanche voltage of 1550 V with gate shorted to source, was demonstrated. A threshold voltage of 3.5 V was extracted from the power DMOSFET, and a subthreshold swing of 200 mV/dec was measured. The device was successfully scaled to an active area of 0.4 cm2, and the resulting device showed a drain current of 377 A at a forward voltage drop of 3.8 V at 25oC.

Comparison of the Forward Voltage Drop of Si and SiC High Voltage Diodes

2014 ◽  
Vol 64 (7) ◽  
pp. 223-236 ◽  
Author(s):  
T. Gachovska ◽  
J. L. Hudgins
Keyword(s):  
High Voltage ◽  
Voltage Drop ◽  
Forward Voltage ◽  
Forward Voltage Drop
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