Thermal Analysis of Dedicated Computer Based on ANSYS
2011 ◽
Vol 697-698
◽
pp. 277-281
Keyword(s):
After creating the three-dimensional models of dedicated computer, models can be smoothly put into ANSYS through interface between Pro/E and ANSYS. By selecting the grid cells, setting parameters of material properties, dividing grids, applying load and boundary conditions and post-processing, the temperature contours of the whole case and its key components are got. Compared with the test results, it was verified that the feasibility and rationality of carrying out thermal simulation by ANSYS software, providing a theoretical basis for the designers to optimize dedicated computer case.
2014 ◽
Vol 681
◽
pp. 100-105
Keyword(s):
2021 ◽
Vol 20
(7)
◽
pp. 48-61
2011 ◽
Vol 243-249
◽
pp. 6040-6043
Keyword(s):
2000 ◽
Vol 123
(1)
◽
pp. 47-51
◽
2013 ◽
Vol 462-463
◽
pp. 592-596
2015 ◽
Vol 713-715
◽
pp. 938-941