Evaluation of screen-printable type S (Pt-PtRh) thermocouples on different ceramic substrates

2016 ◽  
Vol 2016 (CICMT) ◽  
pp. 000053-000057
Author(s):  
Jaroslaw Kita ◽  
Sven Wiegärtner ◽  
Alistair Prince ◽  
Peter Weigand ◽  
Ralf Moos
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Screen Printing ◽  
Temperature Sensors ◽  
Electrical Characteristics ◽  
Buried Structures ◽  
Ceramic Substrates ◽  
Temperature Characteristics ◽  
Film Type ◽  
Thick Film Technology

Abstract The application of thermocouples as temperature sensors has been well known and has already been established for many years. However, for classical thick-film technology using screen-printing and firing, no standardized solutions exist. The here-presented newly developed PtRh thick-film compositions (90% Pt,10% Rh) allows to construct thick-film type S thermocouples (Pt/PtRh), following the IEC temperature characteristics. They can be fired in air, and therefore can be easily integrated into existing thick-film components and devices. In an earlier study, the new Pt-Rh composition was successfully tested on alumina substrates. Their electrical characteristics is equal with classical wire type S thermocouples. This study continues the investigations of thick-film thermocouples. We tested the newly developed pastes for high temperature applications on alumina substrates and evaluated the application of the new screen-printable type S thermocouples on LTCC ceramics. Three possible configurations were investigated: deposited on already fired LTCC substrates (post-fired), screen-printed and co-fired with LTCC tapes on the top surface as well as as buried structures. The paper presents the results of our evaluation and discusses further possible applications.

scholarly journals High temperature ultrasonic sensor for fission gas characterization in MTR harsh environment

2018 ◽  
Vol 170 ◽  
pp. 04008
Author(s):  
O. Gatsa ◽  
P. Combette ◽  
E. Rozenkrantz ◽  
D. Fourmentel ◽  
C. Destouches ◽  
...  
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Screen Printing ◽  
Bismuth Titanate ◽  
Elevated Temperatures ◽  
Ultrasonic Sensor ◽  
High Resistivity ◽  
Materials Testing ◽  
Coupling Coefficients ◽  
Film Fabrication

In the contemporary world, the measurements in hostile environment is one of the predominant necessity for automotive, aerospace, metallurgy and nuclear plant. The measurement of different parameters in experimental reactors is an important point in nuclear power strategy. In the near past, IES (Institut d’Électronique et des Systèmes) on collaboration with CEA (Commissariat à l’Energie Atomique et aux Energies Alternatives) have developed the first ultrasonic sensor for the application of gas quantity determination that has been tested in a Materials Testing Reactor (MTR). Modern requirements state to labor with the materials that possess stability on its parameters around 350°C in operation temperature. Previous work on PZT components elaboration by screen printing method established the new basis in thick film fabrication and characterization in our laboratory. Our trials on Bismuth Titanate ceramics showed the difficulties related to high electrical conductivity of fabricated samples that postponed further research on this material. Among piezoceramics, the requirements on finding an alternative solution on ceramics that might be easily polarized and fabricated by screen printing approach were resolved by the fabrication of thick film from Sodium Bismuth Titanate (NBT) piezoelectric powder. This material exhibits high Curie temperature, relatively good piezoelectric and coupling coefficients, and it stands to be a good solution for the anticipated application. In this paper, we present NBT thick film fabrication by screen printing, characterization of piezoelectric, dielectric properties and material parameters studies in dependence of temperature. Relatively high resistivity in the range of 1.1013 Ohm.cm for fabricated thick film is explained by Aurivillius structure in which a-and b-layers form perovskite structure between oxides of c-layer. Main results of this study are presented and discussed in terms of feasibility for an application to a new sensor device operating at high temperature level (400°). Piezoelectric parameters enhancement and loss reduction at elevated temperatures are envisaged to be optimized. Further sensor development and test in MTR are expected to be realized in the near future.

Improving Performance of Laser-Printed Conductive Silver Lines

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000377-000384
Author(s):  
Dustin Büttner ◽  
Klaus Krüger
Keyword(s):  
Thick Film ◽  
Screen Printing ◽  
Printed Electronics ◽  
Production Method ◽  
Silver Particles ◽  
Ceramic Substrates ◽  
High Speeds ◽  
Conductive Line ◽  
Ink Jet ◽  
Jet Printing

Within the last decade, large efforts were made to implement digital printing as a production method for printed electronics. Especially in production of thick-film electronics, innovation is pushed forward to overcome the lacks of established screen-printing regarding flexibility and tooling. Besides the numerous approaches in using ink-jet printing for printed electronics, researchers at Helmut Schmidt University already showed huge progress in applying electrophotography (“laser printing”) as a method to print conductive silver lines in order to form a conductive layout for thick-film circuits. Electrophotography is a solvent-free method, able to directly print silver toner onto ceramic substrates, forming a conductive line after firing. Benefits are high speeds and flexibility and a huge potential regarding precision. Now, after the feasibility of the method was proven and even functional conductive layouts like RFID coils were printed, the next steps have to be taken towards developing electrophotography to an applicable method in a thick-film production process. Thus, this paper describes the efforts in improving the method's performance. Different kinds of silver particles are tested towards their possibility of forming a silver toner. The resulting silver lines are examined regarding conductivity and printing precision. Also, surface treatment of substrates is considered as a method to reduce the number of required print cycles. Corresponding tests are performed. Furthermore, different firing profiles are tested towards their influence onto the resulting silver lines. Combining the results of these examinations, the performance of conductive silver lines could be improved significantly.

Design and Fabrication of an LTCC Structure for a Microceramic Combustor

2012 ◽  
Vol 9 (3) ◽  
pp. 120-125 ◽  
Author(s):  
Darko Belavic ◽  
Marko Hrovat ◽  
Gregor Dolanc ◽  
Kostja Makarovic ◽  
Marina Santo Zarnik
Keyword(s):  
Thick Film ◽  
High Pressures ◽  
Three Dimensional ◽  
Temperature Sensors ◽  
Ceramic Technology ◽  
Electronic Components ◽  
Buried Structures ◽  
Flow Rates ◽  
Points Of View ◽  
Harsh Conditions

Advanced microsystems or macrosystems are in some cases made with multilayer ceramic technology. Low-temperature cofired ceramic (LTCC) technology is considered to be one of the more suitable technologies for the fabrication of ceramic microsystems that integrate screen-printed, thick-film electronic components as well as three-dimensional buried structures, for example, cavities and channels. One of the applications is a ceramic combustor. The chemical energy of the fuel is converted into thermal energy in a chemical microcombustor through a burning process, while the accompanying high temperatures and, frequently, high pressures, impose harsh conditions on the combustor structure. Therefore, the combustor must be carefully designed not only from the functional, thermal, and chemical points of view, but also with respect to the mechanical strength. The combustor device was prepared by lamination of Du Pont 951PX LTCC green tapes. The fabricated 3D LTCC structures with buried cavities and channels including two inlets (for fuel and air), the evaporator for the fuel, the mixing system of the channels (for mixing the evaporated fuel and air), the distribution channels and eight microburners were realized. The main parts are eight microburners realized as buried cavities. In the burners, a platinum-based catalyst was deposited to assist the oxidation, that is, the burning, of the methanol with the air. Thick-film, platinum-based heaters and temperature sensors are incorporated within the structure. The device was tested with different flow rates of liquid methanol (1 mL/h to 5 mL/h) and air (7 L/h to 15 L/h). The temperatures obtained were between 250°C and 450°C.

Novel thermoelectric temperature sensors

2015 ◽  
Vol 2015 (CICMT) ◽  
pp. 000230-000233 ◽  
Author(s):  
L. Rebenklau ◽  
K. Irrgang ◽  
A. Wodtke ◽  
K. Augsburg ◽  
F. Bechtold ◽  
...  
Keyword(s):  
Thick Film ◽  
Material Flow ◽  
Temperature Sensors ◽  
The Novel ◽  
Circuit Boards ◽  
Pipe System ◽  
Pharmaceutical Production ◽  
Thermoelectric Temperature ◽  
Typical Temperature ◽  
Thick Film Technology

Nearly every industrial application needs temperature measurement. Typical temperature sensors are based on thermocouples or resistance elements. Nevertheless, these sensors are not always desired for every application. For example, temperature sensing of fluids or gases in pipes. A standard sensor inside such a material flow has an influence on the flow itself (flow resistance, turbulences) which would lead to incorrect temperature result. Additionally, application that need periodical cleaning of their pipe system (food or pharmaceutical production) can't use such sensors because of hygienically reasons. Novel thermoelectric temperature sensors, which could reduce the previously demonstrated problems have been developed as part of a research project. The basic idea of the novel sensor concept is to use thick film technology to enable novel sensor geometries. The typical use of thick film technology is realization of ceramic circuit boards, in which metal-based thick film pastes were screen printed and fired as conductive material. The sensor concept uses a combination of different commercially available metal-based pastes (platinum, silver, nickel, gold) to creates thermocouples based on the Seebeck effect.

Materials and Processes for High Functionality Hybrid Circuit Packages

1987 ◽  
Vol 108 ◽  
Author(s):  
Donald Jaffe
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Polymeric Materials ◽  
Ceramic Substrates ◽  
Thin Film Technology ◽  
Hybrid Circuit ◽  
Thick Film Technology

ABSTRACTMaterials and processes used for high functionality hybrid circuit packages based on ceramic substrates are described. Emphasis is on hybrid circuits used for telecommunications and related applications. Examples include packages utilizing thin film technology, thick film technology and combinations of the two technologies. Various thick and thin multilayer approaches to achieve high interconnection density are discussed. These employ a variety of metal conducting systems in conjunction with glasses and/or polymeric materials as dielectric insulating layers.

scholarly journals Enamelled Steel Substrates for Printed Circuits

1983 ◽  
Vol 10 (2-3) ◽  
pp. 177-183
Author(s):  
R. Kužel ◽  
J. Broukal
Keyword(s):  
Thick Film ◽  
Firing Temperature ◽  
Ceramic Coatings ◽  
Basic Material ◽  
Ceramic Substrates ◽  
Printed Circuits ◽  
Steel Substrates ◽  
Thick Film Technology ◽  
Thermally Treated

The preparation of steel substrates coated with intermediate ground and final ceramic coatings is described. The basic material for the preparation of both coatings is the same kind of special glass. The coatings were thermally treated up to 960℃. The resulting substrates were tested for the usage in thick film technology by applying ruthenium resistor compositions designed for use on ceramic substrates. The resistors were fired up to 900℃ and their resistance and TCR were measured. They showed almost the same dependence on firing temperature as the resistors printed on alumina substrates. The TCR was only shifted towards more positive values.

scholarly journals Advances in Low Cost Silver-Containing Thick Film Conductors

1981 ◽  
Vol 9 (1) ◽  
pp. 67-85 ◽  
Author(s):  
Barry E. Taylor ◽  
John J. Felten ◽  
Samuel J. Horowitz ◽  
John R. Larry ◽  
Richard M. Rosenberg
Keyword(s):  
High Temperature ◽  
Integrated Circuits ◽  
Thick Film ◽  
High Speed ◽  
High Performance ◽  
Low Cost ◽  
High Volume ◽  
Film Material ◽  
Advantages And Disadvantages ◽  
Thick Film Technology

Extensive use of thick film materials to manufacture resistor networks and hybrid integrated circuits has come about because of economic, processing and functional advantages over other technologies in the high volume production of miniaturized circuits. Inherent in the adoption of thick film technology for increasingly diverse applications has been the ability of thick film material suppliers to provide progressive performance improvements at lower cost concurrent with circuit manufacturer's needs. Since the first major commercial thick film adoption in the early sixties, when IBM adopted platinum gold conductors and palladium silver resistors in their 360 computers, rapid technological advances over the last decade have produced an increasing variety of hybrid circuits and networks. The wide adoption of thick film technology in all segments of the electronic industry has placed increasing demands on performance and processing latitude. This paper outlines the development of low cost silver-bearing conductors and describes the evolution of technology improvements to present day systems. The initial segment reviews the deficiencies of early Pd/Ag conductors, particularly solder leach resistance and degradation of soldered adhesion following high temperature storage, and focuses on the first Pd/Ag system which overcame these problems. Extension of this technology and subsequent improvements in both binders and vehicles to fulfill adhesion requirements to Al2O3substrates of varying chemistries and to meet demands for high speed printing are also described. The second segment gives an overview of the present understanding of thick film conductor composites from a mechanistic point of view. The various types of binder systems commonly employed in conductors are discussed in terms of how they effect a bond between the sintered metal and the substrate, and the advantages and disadvantages of each type. Metallurgical aspects of conductor/solder connections are considered and their effects on bond reliability following exposure to high temperature discussed. Rheological considerations of paste design are presented and related to printing performance. The final segment focuses on newer low cost, high performance material systems that have evolved over the past two years. The technologies of each system are reviewed in terms of metallurgy, binder and vehicle. Important functional properties are presented to illustrate cost/performance tradeoffs. Special emphasis is given to recently developed high Ag containing conductors which have outstanding soldered adhesion even after 1000 hours of storage at 150℃.

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