Unlocking the full Potential of Lithography for Advanced Packaging

2018 ◽  
Vol 2018 (1) ◽  
pp. 000043-000050
Author(s):  
Jelle van der Voort ◽  
Michiel van der Stam
Keyword(s):  
High Throughput ◽  
High Speed ◽  
Low Cost ◽  
Full Potential ◽  
Cost Of Ownership ◽  
Imaging Results ◽  
The Future ◽  
Advanced Packaging ◽  
High Flexibility ◽  
Control Wafer

Abstract Advanced Packaging technologies and applications are developing rapidly in order to support the ever increasing demand for integrating functionality in small and thin devices with low power consumption, high bandwidth, low latency- all at low cost of ownership. Lithography is the key enabling technology for developing and manufacturing such devices. Advanced Packaging processes, in particular Fan-Out, drive towards redistribution patterns with smallest feature sizes of a few micron today and towards 1 micron in the future. These feature sizes must be realized in production processes with multiple layers stacked on top of each other which need to be accurately aligned. In order to meet economic boundary conditions, routine operation on 300 mm wafers (possibly strongly warped) is required with high throughput. Kulicke & Soffa Liteq B.V. developed together with key partners, a novel Lithography system which is focused specifically to meet the challenging requirements of Advanced Packaging, both for current and future applications. The high quality optics used is capable to project the optimally sized reticle field with lowest possible aberrations on the wafer. The system includes Reticle Masking blades (REMA), which delivers high flexibility and high speed for multi-pattern jobs. The magnification of the optics is adjustable for optimal intra-field overlay performance. The reticle is illuminated by a high power UV laser. This novel setup creates many advantages for imaging, Cost of Ownership and throughput. The illumination and projection optics is combined with modern mechatronics to handle warped wafers with minimal overhead times. The design has a strong focus on contamination control. Wafer Edge Processing functions are integrated in the system to support the use of state-of-the-art plating processes. The modularity of the system architecture makes it possible to extend functionality and performance into the future. In this paper we will introduce the novel LITEQ 500 projection stepper, present imaging results and demonstrate the flexibility and high throughput potential of reticle masking for complex multi-pattern jobs.

Enhanced Air-Gap Control for High-Speed Plasmonic Lithography Using Solid Immersion Lens With Sharp-Ridge Nanoaperture

2011 ◽  
Author(s):  
Hyunwoo Hwang ◽  
Won-Sup Lee ◽  
No-Cheol Park ◽  
Hyunseok Yang ◽  
Young-Pil Park ◽  
...  
Keyword(s):  
Surface Plasmon Resonance ◽  
Surface Plasmon ◽  
High Throughput ◽  
High Speed ◽  
Low Cost ◽  
Near Field ◽  
Nanometer Scale ◽  
Field Region ◽  
High Speeds ◽  
Gap Control

Recently, plasmonic nanolithography is studied by many researchers (1, 2 and 3). This presented a low-cost and high-throughput approach to maskless nanolithography technique that uses a metallic sharp-ridge nanoaperture with a high strong nanometer-sized optical spot induced by surface plasmon resonance. However, these nanometer-scale spots generated by metallic nanoapertures are formed in only the near-field region, which makes it very difficult to pattern above the photoresist surface at high-speeds.

scholarly journals Strategic manufacturing priorities for South African manufacturers: The need to shift emphasis and improve on current performance levels

1997 ◽  
Vol 28 (4) ◽  
pp. 138-146
Author(s):  
L. P. Kruger
Keyword(s):  
South African ◽  
High Speed ◽  
Business Performance ◽  
Low Cost ◽  
Performance Levels ◽  
Competitive Capabilities ◽  
High Dependability ◽  
High Flexibility ◽  
Manufacturing Priorities

The findings of an empirical research project show that the majority of so-called large South African manufacturers acknowledge that manufacturing-based strategies enhance the competitive capabilities and advantages of their firms and that this contributes to long-term, superior business performance and success. They also recognize that superior manufacturing capabilities will be prerequisites for the improvement on both their national and international competitive positions in the future. To better their positions in these markets, the manufacturers need to shift their emphasis (in order of priority) to: (1) high quality, low cost and high dependability, all of priority number (1); (2) high speed; and (3) high flexibility. they also need to improve on their current performance levels in all of these strategic manufacturing priorities by an average of between 20% and 30%.

scholarly journals Using high-throughput barcode sequencing to efficiently map connectomes

2017 ◽  
Author(s):  
Ian D Peikon ◽  
Justus M Kebschull ◽  
Vasily V Vagin ◽  
Diana I Ravens ◽  
Yu-Chi Sun ◽  
...  
Keyword(s):  
High Throughput ◽  
High Speed ◽  
Neural Circuit ◽  
Low Cost ◽  
Wiring Diagram ◽  
Widespread Application ◽  
High Throughput Dna Sequencing ◽  
Complex Circuits ◽  
Further Development ◽  
Barcode Sequencing

AbstractThe function of a neural circuit is determined by the details of its synaptic connections. At present, the only available method for determining a neural wiring diagram with single synapse precision—a “connectome”—is based on imaging methods that are slow, labor-intensive and expensive. Here we present SYNseq, a method for converting the connectome into a form that can exploit the speed and low cost of modern high-throughput DNA sequencing. In SYNseq, each neuron is labeled with a unique random nucleotide sequence—an RNA “barcode”—which is targeted to the synapse using engineered proteins. Barcodes in pre- and postsynaptic neurons are then associated through protein-protein crosslinking across the synapse, extracted from the tissue, and then joined into a form suitable for sequencing. Although at present the inefficiency in our hands of barcode joining precludes the widespread application of this approach, we expect that with further development SYNseq will enable tracing of complex circuits at high speed and low cost.

The Role of Extreme Agitation in Accelerating the Removal Rate of Advanced Packaging Photoresists

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001389-001416
Author(s):  
Mani Sobhian
Keyword(s):  
High Throughput ◽  
High Speed ◽  
Removal Rate ◽  
Wafer Surface ◽  
Main Challenge ◽  
Wide Range ◽  
Advanced Packaging ◽  
Low Exposure ◽  
Exposure Energy ◽  
Dry Film

Negative Dry Film and Negative Spin-On photoresists are widely adopted as the prime choice in wafer-scale packaging processes such as bumping, TSV, and copper pillars. High transparency of negative resist produces vertical profiles with no footing at low exposure energy, resulting in a robust, high throughput lithography process (Doki, 2005). In plating applications, the 3-D cross-linking of negative resist provides good adhesion to wide range of substrates, enabling high-current ECD processes with high throughput. The main challenge of negative photoresist has always been its removal difficulty. Aggressive remover chemistries consisting of DMSO, NMP, and TMAH have been used to cleave, swell, and dissolve the material (Moore, 2002). This paper demonstrates the capabilities of a novel immersion-based strip technology that maintains a constant boundary layer at the wafer surface by providing high-speed agitation to each individual wafer. Results show an acceleration of the removal process, while reduced exposure to remover chemistries reduces risks of bump corrosion. Removal rates of negative dry film and negative spin-on resist materials have been studied across variety of commercially available strip chemistries.

scholarly journals Simple Absorbance-Based Assays for Ultra-High Throughput Screening

2001 ◽  
Vol 6 (1) ◽  
pp. 3-9 ◽  
Author(s):  
Patrick Lavery ◽  
Murray J.B. Brown ◽  
Andrew J. Pope
Keyword(s):  
High Throughput ◽  
High Throughput Screening ◽  
High Speed ◽  
Low Cost ◽  
High Density ◽  
Pharmaceutical Companies ◽  
Fluorescence Techniques ◽  
Enzyme Systems ◽  
Assay Performance ◽  
Standard Assay

In order to accommodate the predicted increase in screening required of successful pharmaceutical companies, miniaturized, high-speed HTS formats are necessary. Much emphasis has been placed on sensitive fluorescence techniques, but some systems, particularly enzymes interconverting small substrates, are likely to be refractory to such approaches. We show here that simple absorbance-based assays can be miniaturized to 10-,.d volumes in 1536- well microplates compatible with the requirements for ultra-high throughput screening. We demonstrate that, with low-cost hardware, assay performance is wholly predictable from the 2-fold decrease in pathlength for fully filled 1536-well plates compared to 96- and 384-well microplates. A number of enzyme systems are shown to work in this high-density format, and the inhibition parameters determined are comparable with those in standard assay formats. We also demonstrate the utility of kinetics measurements in miniaturized format with improvements in assay quality and the ability to extract detailed mechanistic information about inhibitors.

Integrated Decoupling Capacitors using Pb(Zr,Ti)O3 Thin Films

1996 ◽  
Vol 433 ◽  
Author(s):  
D. Dimos ◽  
S.J. Lockwood ◽  
T.J. Garino ◽  
H.N. Al-Shareef ◽  
R.W. Schwartz
Keyword(s):  
Thin Film ◽  
High Speed ◽  
Series Resistance ◽  
Low Cost ◽  
Solution Deposition ◽  
Decoupling Capacitors ◽  
Thin Film Capacitors ◽  
Pt Electrodes ◽  
Speed Performance ◽  
Advanced Packaging

AbstractThin-film decoupling capacitors based on ferroelectric (Pb,La)(Zr,Ti)O3 films are being developed for use in advanced packaging applications. The increased integration that can be achieved by replacing surface-mount capacitors should lead to decreased package volume and improved high-speed performance. For this application, chemical solution deposition is an appropriate fabrication technique since it is a low-cost, high-throughput process. The use of relatively thick Pt electrodes (˜1 μm) to minimize series resistance and inductance is a unique aspect to fabricating these devices. In addition, the important electrical properties are discussed, with particular emphasis on lifetime measurements, which suggest that resistance degradation will not be a severe limitation on device performance. Finally, some of the work being done to develop methods of integrating these thin-film capacitors with ICs and MCMs is presented.

Prospect of Emerging Nonvolatile Memories

2004 ◽  
Vol 830 ◽  
Author(s):  
Hongsik Jeong ◽  
Kinam Kim
Keyword(s):  
High Speed ◽  
Low Cost ◽  
Random Access ◽  
Random Access Memory ◽  
High Density ◽  
Access Memory ◽  
Flash Memories ◽  
Nonvolatile Memories ◽  
Critical Technology ◽  
The Future

ABSTRACTConventional nonvolatile memories such as Flash and EEPROM memory have successfully evolved toward high density and low cost. Especially, the market and density of flash memories has grown rapidly which leads semiconductor technology. However, there have been concerns about whether this successful progress can be maintained in the future nano era and can satisfy the requirement of diversified future IT market. Flash memories have the advantage of high density with small cell size and by contraries the disadvantage of slow writing speed and limited endurance. This slow writing speed and limited endurance is not aligned with the trend of high speed and reliability for future semiconductor memories.The future for these conventional nonvolatile memories forces many research groups and companies to develop alternative memories with ideal memory characteristics such as non-volatility, high density, high speed, and low power, which none of the conventional memories can satisfy at the same time.In this article, I will evaluate the characteristics of future nonvolatile memories such as ferroelectric random access memory (FRAM), magnetoresistive random access memory (MRAM) and phase change random access memory (PRAM). These memories have been recently evaluated because of the possibility that they can overcome the challenges that conventional memories are facing. Finally we will review critical technology barriers in developing future memory and predict the promising technology to overcome the barriers in conventional and emerging new memories, which will be technology guidelines for future memory development.

Scalable Plasmonic Nanolithography: Prototype System Design and Construction

2016 ◽  
Author(s):  
Yuan Wang ◽  
Mohamed E. Saad ◽  
Kang Ni ◽  
Yen Chi Chang ◽  
Cheng-Wei Chen ◽  
...  
Keyword(s):  
High Throughput ◽  
High Speed ◽  
Low Cost ◽  
Cost Effective ◽  
Prototype System ◽  
Cost Effective Approach ◽  
Nanoscale Metrology ◽  
And Control ◽  
Next Generation Lithography ◽  
Plasmonic Nanolithography

Maskless nanolithography is an agile and cost effective approach if their throughputs can be scaled for mass production purposes. Using plasmonic nanolithography (PNL) approach, direct pattern writing was successfully demonstrated with around 20 nm half-pitch at high speed. Here, we report our recent efforts of implementing a high-throughput PNL prototype system with unique metrology and control features, which are designed to use an array of plasmonic lenses to pattern sub-100 nm features on a rotating substrate. Taking the advantage of air bearing surface techniques, the system can expose the wafer pixel by pixel with a speed of ∼10 m/s, much faster than any conventional scanning based lithography system. It is a low-cost, high-throughput maskless approach for the next generation lithography and also for the emerging nanotechnology applications, such as nanoscale metrology and imaging.

Development and production experience of the multilayer curtain-coated linerboard of Ji’an PM No. 3,

TAPPI Journal ◽  
2014 ◽  
Vol 13 (2) ◽  
pp. 17-25
Author(s):  
JUNMING SHU ◽  
ARTHAS YANG ◽  
PEKKA SALMINEN ◽  
HENRI VAITTINEN
Keyword(s):  
Titanium Dioxide ◽  
High Speed ◽  
Food Packaging ◽  
Production Efficiency ◽  
Positive Impact ◽  
Low Cost ◽  
Board Structure ◽  
Flexographic Printing ◽  
Curtain Coating ◽  
Coating Formulations

The Ji’an PM No. 3 is the first linerboard machine in China to use multilayer curtain coating technology. Since successful startup at the end of 2011, further development has been carried out to optimize running conditions, coating formulations, and the base paper to provide a product with satisfactory quality and lower cost to manufacture. The key challenges include designing the base board structure for the desired mechanical strength, designing the surface properties for subsequent coating operations, optimizing the high-speed running of the curtain coater to enhance production efficiency, minimizing the amount of titanium dioxide in the coating color, and balancing the coated board properties to make them suitable for both offset and flexographic printing. The pilot and mill scale results show that curtain coating has a major positive impact on brightness, while smoothness is improved mainly by the blade coating and calendering conditions. Optimization of base board properties and the blade + curtain + blade concept has resulted in the successful use of 100% recycled fiber to produce base board. The optical, mechanical, and printability properties of the final coated board meet market requirements for both offset and flexographic printing. Machine runnability is excellent at the current speed of 1000 m/min, and titanium dioxide has been eliminated in the coating formulations without affecting the coating coverage. A significant improvement in the total cost of coated white liner production has been achieved, compared to the conventional concept of using virgin fiber in the top ply. Future development will focus on combining low cost with further quality improvements to make linerboard suitable for a wider range of end-use applications, including frozen-food packaging and folding boxboard.

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