Advanced Package Design: Inter-Domain Design Methodologies

2019 ◽  
Vol 2019 (1) ◽  
pp. 000284-000288
Author(s):  
Bill Acito ◽  
Keyword(s):  
Design Flow ◽  
Advanced Technology ◽  
System Level ◽  
Management Tool ◽  
Design System ◽  
System Management ◽  
Next Generation ◽  
Ic Design ◽  
Package Design ◽  
Ic Package

Abstract Just as we transitioned from simplistic lead frames to large ball grid arrays decades ago, we find ourselves again at another inflection point in design. Originally a derivative of PCB design, IC package design finds itself straddling both PCB-style design and traditional IC design. Dimensions have shrunk to place IC package design squarely in the same design dimensions as integrated circuits. Likewise, with Moore's law rapidly losing steam to support SoC's as a system integration vehicle, advanced package technologies have been asked to fill the system enablement gap. We now see advanced packaging technologies with silicon content as the system enabler in 2.5D, 3D and fanout wafer-level packaging. Because of the silicon and small geometries, IC design flows and signoff mechanisms are being used to design the next-generation of packaged systems. Package design now finds itself in the forefront of system-level design enablement. Where once system aggregation was done in a SoC at the silicon level, packaging is being used to build a system from technology-optimized die from each functional area (memory, processing, and interfaces). Silicon is no longer just a substrate material for IC manufacturing but a “package” substrate and functional integration vehicle. As such, package design teams find themselves adding IC-based design flows and methodologies. Package designers must look to the IC tools for routing, DRC, and signoff capabilities. Designers are looking for next-generation EDA tools to support these new integration and design challenges, including LVS-like validation checks and IC-based design rules. Rather than transitioning the design team from traditional packaging tools to IC tools entirely, we propose that users can leverage complete design flows that merge the best-in-class capabilities from each of their respective design domains. Is this regard, the best-in-class capabilities can remain in their respective domains, and a design flow can be created that relies on tight integration between both domains. These flows can also leverage a single point of entry for design capture and system level management. Flows based on the system management tool and the appropriate features in each of the domains can be created that enable and optimize complex designs that meet physical, signal integrity, cost and performance requirements. We will describe how capabilities can be leveraged from both domains in a tightly coupled flow, overseen by a design system-management tool, to address the challenges of advanced-technology and silicon-based system.

scholarly journals A Three-Dimensional Shock Loss Model Applied to an Aft-Swept, Transonic Compressor Rotor

1996 ◽  
Author(s):  
Steven L. Puterbaugh ◽  
William W. Copenhaver ◽  
Chunill Hah ◽  
Arthur J. Wennerstrom
Keyword(s):  
Flow Rate ◽  
Pressure Ratio ◽  
Three Dimensional ◽  
Numerical Results ◽  
Design Flow ◽  
Design System ◽  
Loss Model ◽  
Transonic Compressor ◽  
Compressor Rotor ◽  
Shock Loss

An analysis of the effectiveness of a three-dimensional shock loss model used in transonic compressor rotor design is presented. The model was used during the design of an aft-swept, transonic compressor rotor. The demonstrated performance of the swept rotor, in combination with numerical results, is used to determine the strengths and weaknesses of the model. The numerical results were obtained from a fully three-dimensional Navier-Stokes solver. The shock loss model was developed to account for the benefit gained with three-dimensional shock sweep. Comparisons with the experimental and numerical results demonstrated that shock loss reductions predicted by the model due to the swept shock induced by the swept leading edge of the rotor were exceeded. However, near the tip the loss model under-predicts the loss because the shock geometry assumed by the model remains swept in this region while the numerical results show a more normal shock orientation. The design methods and the demonstrated performance of the swept rotor is also presented. Comparisons are made between the design intent and measured performance parameters. The aft-swept rotor was designed using an inviscid axisymmetric streamline curvature design system utilizing arbitrary airfoil blading geometry. The design goal specific flow rate was 214.7 kg/sec/m2 (43.98 lbm/sec/ft2), the design pressure ratio goal was 2.042, and the predicted design point efficiency was 94.0. The rotor tip sped was 457.2 m/sec (1500 ft/sec). The design flow rate was achieved while the pressure ratio fell short by 0.07. Efficiency was 3 points below prediction, though at a very high 91 percent. At this operating condition the stall margin was 11 percent.

System of System Based Sociotechnical Complexity Challenges in Product and Process Design

2011 ◽  
Author(s):  
Zulfiqar Ali-Qureshi
Keyword(s):  
Product Design ◽  
Process Design ◽  
Product Life Cycle ◽  
Process Development ◽  
Physical Structure ◽  
System Level ◽  
Design System ◽  
Assembly Process ◽  
Product And Process ◽  
Physical Elements

Unique characteristic of system of system based product life cycle challenges evolves different level of systems. This means the product design system and process level system consideration are very important besides the system level issues for product and process development which are part of systems of system. These core issues include the physical elements, assembly process and its related cognitive elements of component to that particular assembly and its process at Sub system level which are fundamental of System of system in holistic perspective of new product and process design. Any system level change or variety affects the next adjacent system in the same product as a member of same family of a system of system. In this paper the aspect of Hybrid electric car battery has been explored to reduce the system of system level sociotecnical complexity in product design. In this context, the affect of changeability in the assembly system level has been explored and DFA analysis and the complexity Index of the product at physical structure, assembly process and cognitive system level been discussed to draw analogy for making an understanding of similar nature of the system in platform based product and process family development.

Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm

Volume 4 ◽  
2004 ◽  
Author(s):  
Hamid A. Hadim ◽  
Tohru Suwa
Keyword(s):  
Genetic Algorithm ◽  
Thermal Strain ◽  
System Level ◽  
Multidisciplinary Design ◽  
Design Stage ◽  
Computational Time ◽  
Design Parameters ◽  
Package Design ◽  
Early Design Stage ◽  
Design And Optimization

A new multidisciplinary design and optimization methodology in electronics packaging is presented. A genetic algorithm combined with multi-disciplinary design and multi-physics analysis tools are used to optimize key design parameters. This methodology is developed to improve the electronic package design process by performing multidisciplinary design and optimization at an early design stage. To demonstrate its capability, the methodology is applied to a Ball Grid Array (BGA) package design. Multidisciplinary criteria including thermal, thermal strain, electromagnetic leakage, and cost are optimized simultaneously. A simplified routability analysis criterion is treated as a constraint. The genetic algorithm is used for systematic design optimization while reducing the total computational time. The present methodology can be applied to any electronics product design at any packaging level from the chip level to the system level.

The Potential Impact of Utilizing Advanced Engine Technology for a Combat Capable Unmanned Air Vehicle (UAV)

2000 ◽  
Author(s):  
Greg B. Bruening ◽  
James R. Snyder ◽  
Raymond E. Fredette
Keyword(s):  
Life Cycle ◽  
Performance Comparison ◽  
Advanced Technology ◽  
System Level ◽  
Life Cycle Costs ◽  
Air Defense ◽  
Unmanned Air Vehicle ◽  
Air Vehicle ◽  
Potential Impact ◽  
The Cost

This paper evaluates the potential impact of utilizing advanced engine technology for a limited life, combat capable, unmanned air vehicle (UAV) application. A study was conducted to define payoffs in terms of mission capability and system level life cycle costs (LCC) associated with implementing three different engine development approaches into a combat capable UAV design. The three different approaches considered were: a new, advanced technology engine; an existing (off-the-shelf) engine; and a derivative of an existing engine with limited technology insertion. A detailed vehicle configuration design was developed to conduct this assessment, including a low observable (LO), highly integrated engine/airframe layout for survivability and mission adaptable considerations. The vehicle is designed with multi-role mission capability such as suppression of enemy air defense (SEAD), close air support (CAS), and battlefield air interdiction (BAI). A system level performance comparison is assessed with the three different engine approaches, specifically for the SEAD-type mission. For the cost analysis, the multi-role mission capability is reflected in the overall assumptions such as in the number of aircraft needed to meet the mission requirements. A system level assessment such as in this study is essential in determining whether the additional costs associated with the development of a new, advanced engine is worth the investment. The results of this study suggest that advanced engine technology insertion can provide significant benefits in terms of mission range capability, vehicle weight/size, and overall life cycle costs versus an existing engine.

The Impact of Process Architecture on Equilibrium Stability in Distributed Design

2011 ◽  
Vol 133 (10) ◽  
Author(s):  
Erich Devendorf ◽  
Kemper Lewis
Keyword(s):  
Solution Process ◽  
System Stability ◽  
System Level ◽  
Design System ◽  
Distributed Design ◽  
General Process ◽  
Architecture Model ◽  
The Stability ◽  
Process Architecture ◽  
The Impact

In distributed design processes, individual design subsystems have local control over design variables and seek to satisfy their own individual objectives, which may also be influenced by some system level objectives. The resulting network of coupled subsystems will either converge to a stable equilibrium or diverge in an unstable manner. In this paper, we study the dependence of system stability on the solution process architecture. The solution process architecture describes how the design subsystems are ordered and can be either sequential, parallel, or a hybrid that incorporates both parallel and sequential elements. In this paper, we demonstrate that the stability of a distributed design system does indeed depend on the solution process architecture chosen, and we create a general process architecture model based on linear systems theory. The model allows the stability of equilibrium solutions to be analyzed for distributed design systems by converting any process architecture into an equivalent parallel representation. Moreover, we show that this approach can accurately predict when the equilibrium is unstable and the system divergent when previous models suggest that the system is convergent.

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