Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications

2019 ◽  
Vol 2019 (1) ◽  
pp. 000584-000590
Author(s):  
Dave Saums ◽  
Tim Jensen ◽  
Carol Gowans ◽  
Seth Homer ◽  
Ron Hunadi
Keyword(s):  
Performance Test ◽  
Thermal Interface Materials ◽  
Test Procedures ◽  
Thermal Interface ◽  
Semiconductor Test ◽  
New Material ◽  
And Performance ◽  
And Control ◽  
Interface Materials

Abstract Very challenging requirements exist for thermal interface materials (TIMs) for demanding applications I semiconductor testing. Reliability requirements and multiple contact cycling requirements are substantially different and do not exist in traditional applications for TIMs. Developing new material types to meet these very exacting and unusual requirements has been a long-term goal and requires development of an unusual series of test procedures to demonstrate whether the desired reliability goals have been met. Use of a servo-driven, commercial test stand that has unique features for operation and control is described as the basis for a reliability and performance test program developed for these new materials in three phases, with new data for a fourth test phase added, and comparative values for material performance.

Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000613-000618
Author(s):  
Dave Saums ◽  
Tim Jensen ◽  
Carol Gowans ◽  
Seth Homer ◽  
Ron Hunadi
Keyword(s):  
Thermal Performance ◽  
Mechanical Performance ◽  
Device Under Test ◽  
Thermal Interface Materials ◽  
Reliability Testing ◽  
Mechanical Reliability ◽  
Thermal Interface ◽  
Cycling Test ◽  
Semiconductor Test ◽  
Interface Materials

Abstract Semiconductor test and burn-in requirements for thermal interface materials (TIMs) are challenging, with difficult mechanical reliability requirements that are not found in other types of applications for these materials. To demonstrate the ability of certain newly-developed TIMs to not only provide suitable thermal performance for the device under test and meet these mechanical requirements, a contact cycling test has been devised in three phases for evaluating TIM mechanical performance and durability.

Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging—A Critical Review

2018 ◽  
Vol 15 (2) ◽  
pp. 63-74
Author(s):  
Dinesh P. R. Thanu ◽  
Boxi Liu ◽  
Marco Aurelio Cartas
Keyword(s):  
Integrated Circuit ◽  
Semiconductor Industry ◽  
Thermal Dissipation ◽  
System Level ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Field Programmable ◽  
Increasing Demand ◽  
And Performance ◽  
Interface Materials

The ever increasing demand for fast computing has led to heterogeneous integration of packages as can be seen in the latest Xeon family segments in the market. Microprocessors are now adjacent to memory chips, transceivers, field-programmable gate arrays, and even other microprocessors within a single substrate. These complex designs have instigated an increase in cooling demand for microprocessors, and hence, there has been an increased focus within the semiconductor industry on developing advance thermal solutions. From the packaging level, thermal interface materials (TIMs) play a key role in thermally connecting various components within the package and helps reduce the thermal resistance between the die surfaces and integrated heat spreaders. From the system level, cooling technology is critical to attain the desired overall thermal dissipation and performance. In this review, progress made in the area of TIMs and system cooling solutions are presented. The focus is on the evolution of TIMs and cooling technologies and their challenges in the integrated circuit packaging. Merits and demerits of various TIM materials available in the commercial market are also discussed. The article will be concluded with some directions for the future that would be potentially very beneficial.

Effective Thermophysical Properties of Thermal Interface Materials: Part II — Experiments and Data

2003 ◽  
Author(s):  
I. Savija ◽  
J. R. Culham ◽  
M. M. Yovanovich
Keyword(s):  
Thermal Conductivity ◽  
Thermophysical Properties ◽  
External Loading ◽  
Interface Temperature ◽  
Thermal Interface Materials ◽  
Test Results ◽  
Test Procedures ◽  
Thermal Interface ◽  
Interface Materials ◽  
Resistance Data

A new method for determining effective thermal conductivity and Young’s modulus in thermal interface materials is demonstrated. The method denoted as the Bulk Resistance Method (BRM) uses empircal thermal resistance data and analytical modeling to accurately predict thermophysical properties that account for insitu changes in material thickness due to external loading and thermal expansion. The BRM is demonstrated using commercially available sheets of Grafoil GTA. Tests were performed on thermal joints consisting of two Al 2024 machined surfaces with layers of Grafoil GTA in the interface. Test conditions included a vacuum environment, 0.2–6.5 MPa contact pressure, a nominal 50°C mean interface temperature and a continuous loading and unloading cycle. Test results indicated that the BRM consistently predicted thermal conductivity independent of the number of layers tested and that the predicted results were significantly lower than values reported using conventional ASTM test procedures.

Advanced Thermal Interface Materials for Thermal Management

2018 ◽  
Author(s):  
Wei Yu ◽  
◽  
Changqing Liu ◽  
Lin Qiu ◽  
Ping Zhang ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

scholarly journals Carbon Nanotube Films for Energy Applications

Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1890
Author(s):  
Monika Rdest ◽  
Dawid Janas
Keyword(s):  
Carbon Nanotube ◽  
Mechanical Energy ◽  
Research Community ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Conductive Coatings ◽  
Storage Devices ◽  
Energy Applications ◽  
Wide Range ◽  
Interface Materials

This perspective article describes the application opportunities of carbon nanotube (CNT) films for the energy sector. Up to date progress in this regard is illustrated with representative examples of a wide range of energy management and transformation studies employing CNT ensembles. Firstly, this paper features an overview of how such macroscopic networks from nanocarbon can be produced. Then, the capabilities for their application in specific energy-related scenarios are described. Among the highlighted cases are conductive coatings, charge storage devices, thermal interface materials, and actuators. The selected examples demonstrate how electrical, thermal, radiant, and mechanical energy can be converted from one form to another using such formulations based on CNTs. The article is concluded with a future outlook, which anticipates the next steps which the research community will take to bring these concepts closer to implementation.

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