Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000613-000618
Author(s):  
Dave Saums ◽  
Tim Jensen ◽  
Carol Gowans ◽  
Seth Homer ◽  
Ron Hunadi
Keyword(s):  
Thermal Performance ◽  
Mechanical Performance ◽  
Device Under Test ◽  
Thermal Interface Materials ◽  
Reliability Testing ◽  
Mechanical Reliability ◽  
Thermal Interface ◽  
Cycling Test ◽  
Semiconductor Test ◽  
Interface Materials

Abstract Semiconductor test and burn-in requirements for thermal interface materials (TIMs) are challenging, with difficult mechanical reliability requirements that are not found in other types of applications for these materials. To demonstrate the ability of certain newly-developed TIMs to not only provide suitable thermal performance for the device under test and meet these mechanical requirements, a contact cycling test has been devised in three phases for evaluating TIM mechanical performance and durability.

Characterizing Bulk Thermal Conductivity and Interface Contact Resistance Effects of Thermal Interface Materials in Electronic Cooling Applications

2003 ◽  
Author(s):  
Vadim Gektin ◽  
Sai Ankireddi ◽  
Jim Jones ◽  
Stan Pecavar ◽  
Paul Hundt
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Contact Resistance ◽  
Thermal Performance ◽  
Electronic Cooling ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Contact ◽  
Interface Materials ◽  
Bulk Thermal Conductivity

Thermal Interface Materials (TIMs) are used as thermally conducting media to carry away the heat dissipated by an energy source (e.g. active circuitry on a silicon die). Thermal properties of these interface materials, specified on vendor datasheets, are obtained under conditions that rarely, if at all, represent real life environment. As such, they do not accurately portray the material thermal performance during a field operation. Furthermore, a thermal engineer has no a priori knowledge of how large, in addition to the bulk thermal resistance, the interface contact resistances are, and, hence, how much each influences the cooling strategy. In view of these issues, there exists a need for these materials/interfaces to be characterized experimentally through a series of controlled tests before starting on a thermal design. In this study we present one such characterization for a candidate thermal interface material used in an electronic cooling application. In a controlled test environment, package junction-to-case, Rjc, resistance measurements were obtained for various bondline thicknesses (BLTs) of an interface material over a range of die sizes. These measurements were then curve-fitted to obtain numerical models for the measured thermal resistance for a given die size. Based on the BLT and the associated thermal resistance, the bulk thermal conductivity of the TIM and the interface contact resistance were determined, using the approach described in the paper. The results of this study permit sensitivity analyses of BLT and its effect on thermal performance for future applications, and provide the ability to extrapolate the results obtained for the given die size to a different die size. The suggested methodology presents a readily adaptable approach for the characterization of TIMs and interface/contact resistances in the industry.

Mechanical Insertion and Reliability Testing of Thermal Interface Materials for Semiconductor Test and Burn-in Applications

2019 ◽  
Vol 2019 (1) ◽  
pp. 000584-000590
Author(s):  
Dave Saums ◽  
Tim Jensen ◽  
Carol Gowans ◽  
Seth Homer ◽  
Ron Hunadi
Keyword(s):  
Performance Test ◽  
Thermal Interface Materials ◽  
Test Procedures ◽  
Thermal Interface ◽  
Semiconductor Test ◽  
New Material ◽  
And Performance ◽  
And Control ◽  
Interface Materials

Abstract Very challenging requirements exist for thermal interface materials (TIMs) for demanding applications I semiconductor testing. Reliability requirements and multiple contact cycling requirements are substantially different and do not exist in traditional applications for TIMs. Developing new material types to meet these very exacting and unusual requirements has been a long-term goal and requires development of an unusual series of test procedures to demonstrate whether the desired reliability goals have been met. Use of a servo-driven, commercial test stand that has unique features for operation and control is described as the basis for a reliability and performance test program developed for these new materials in three phases, with new data for a fourth test phase added, and comparative values for material performance.

Thermal and Mechanical Properties of Silicone Thermal Interface Materials With Varying Cross-Link Densities

2005 ◽  
Author(s):  
Arun Gowda ◽  
Annita Zhong ◽  
Sandeep Tonapi ◽  
Kaustubh Nagarkar ◽  
K. Srihari
Keyword(s):  
Mechanical Properties ◽  
Thermal Performance ◽  
Cross Linking ◽  
Thermal Interface Materials ◽  
Material System ◽  
Thermal And Mechanical Properties ◽  
Thermal Impedance ◽  
Operating Life ◽  
Thermal Interface ◽  
Interface Materials

Thermal Interface Materials (TIMs) play a key role in the thermal management of microelectronics by providing a path of low thermal impedance between the heat generating devices and the heat dissipating components (heat spreader/sink). In addition, TIMs need to reliably maintain this low thermal resistance path throughout the operating life of the device. Currently, several different TIM material solutions are employed to dissipate heat away from semiconductor devices. Thermal greases, adhesives, gels, pads, and phase change materials are among these material solutions. Each material system has its own advantages and associated application space. While thermal greases offer excellent thermal performance, their uncured state makes them susceptible to pump-out and other degradation mechanisms. On the other hand, adhesives offer structural support but offer a higher heat resistance path. Gels are designed to provide a level of cross-linking to allow the thermal performance of greases and prevent premature degradation. However, the degree of crosslinking can have a significant effect of the behavior of gels. In this research, TIMs with varying cross-linking densities are studied and their thermal and mechanical properties reported. The base resin systems and fillers were maintained constant, while slight compositional alternations were made to induce different degrees of cross-linking.

Durability of Low Melt Alloys as Thermal Interface Materials

2016 ◽  
Vol 138 (1) ◽  
Author(s):  
Chandan K. Roy ◽  
Sushil Bhavnani ◽  
Michael C. Hamilton ◽  
R. Wayne Johnson ◽  
Roy W. Knight ◽  
...  
Keyword(s):  
Thermal Performance ◽  
Performance Testing ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
High Performing ◽  
Accelerated Life ◽  
Significant Performance ◽  
Interface Materials ◽  
Temperature Aging

This study investigates the reliability of low melt alloys (LMAs) containing gallium (Ga), indium (In), bismuth (Bi), and tin (Sn) for the application as Thermal interface materials (TIMs). The analysis described herein involved the in situ thermal performance of the LMAs as well as performance evaluation after accelerated life cycle testing, which included high temperature aging at 130 °C and thermal cycling from −40 °C to 80 °C. Three alloys (75.5Ga & 24.5In, 100Ga, and 51In, 32.5Bi & 16.5Sn) were chosen for testing the thermal performance. Testing methodologies used follow ASTM D5470 protocols and the performance of LMAs is compared with some high-performing commercially available TIMs. Results show that LMAs can offer extremely low (<0.01 cm2 °C/W) thermal resistance compared to any commercial TIMs. The LMA–substrate interactions were explored using different surface treatments (copper and tungsten). Measurements show that depending on the substrate–alloy combinations, the proposed alloys survive 1500 hrs of aging at 130 °C and 1000 cycles from −40 °C to 80 °C without significant performance degradation. The obtained results indicate the LMAs are very efficient as TIMs.

Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Hayden Carlton ◽  
Dustin Pense ◽  
David Huitink
Keyword(s):  
Thermal Performance ◽  
Structural Integrity ◽  
Void Formation ◽  
Conductivity Measurement ◽  
Cyclic Stress ◽  
Thermal Interface Materials ◽  
Interfacial Resistance ◽  
Thermal Interface ◽  
Mechanical Cycling ◽  
Interface Materials

Abstract Due to the inherently low adhesive strength and structural integrity of polymer thermal interface materials (TIMs), they present a likely point of failure when succumbed to thermomechanical stresses in electronics packaging. Herein, we present a methodology to quantify TIM degradation through an accelerated and repeatable mechanical cycling technique. The testing apparatus incorporated a steady-state thermal conductivity measurement system, consistent with ASTM 5470-06, with added displacement actuation and force sensing to provide controlled cyclic loading between −20 N and 20 N. Additionally, a novel optical technique was utilized to observe void formation, pump-out, and dry-out behavior during cycling, in order to correlate the thermal performance with physical behaviors of different TIMs under cyclic stress. Of the two different pastes analyzed, cyclic testing was found to degrade the thermal performance of the less viscous TIM by increasing its interfacial resistance. Optical qualitative measurements revealed the breakdown of the TIM structure at the interface, which indicated the formation of voids due to TIM degradation. Applying this testing method for future TIM development could help in optimizing TIM structure for particular package applications.

Thermo-Mechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis

2019 ◽  
Author(s):  
Dustin Pense ◽  
Hayden Carlton ◽  
David Huitink
Keyword(s):  
Thermal Performance ◽  
Structural Integrity ◽  
Mechanical Degradation ◽  
Thermal Interface Materials ◽  
Interfacial Resistance ◽  
Thermal Reliability ◽  
Thermal Interface ◽  
Static Test ◽  
Mechanical Cycling ◽  
Interface Materials

Abstract Thermal interface materials (TIMs) comprise an important role in the thermal management of a myriad of electronic devices, and their ability to ensure both enhanced thermal conductance and reliable adhesion at thermal interfaces is paramount to the reliability of electronics packaging. Like most aspects of a typical electronics package, on/off cycles undergone during a device’s operation induce thermo-mechanical stresses that can negatively affect the integrity of the package. Due to the inherently low adhesive strength and structural integrity of polymer TIMs, they present a likely point of failure when succumbed to these interfacial stresses. Methods for quantifying TIM degradation during mechanical cycling have been quite infrequent in literature; an accelerated and repeatable method for measuring the thermal reliability of TIMs would prove to be beneficial. Herein, we present a methodology to quantify the thermal reliability of TIMs during mechanical cycling using a custom-built steady-state thermal conductivity tester. Additionally, an optical technique was utilized to observe void formation, pump-out, and dry-out behavior during cycling, in order to correlate the thermal performance with physical behaviors of the TIM under cyclic stress. After an initial long-term static test, cyclic testing was found to degrade the thermal performance of the TIM through increasing its interfacial resistance. Optical qualitative measurements revealed the breakdown of the TIM structure at the interface, which indicated the formation of voids due to TIM degradation. Applying this testing method for future TIM development could help in optimizing TIM structure for particular package applications.

scholarly journals Reliability Investigation of a Carbon Nanotube Array Thermal Interface Material

Energies ◽  
2019 ◽  
Vol 12 (11) ◽  
pp. 2080 ◽  
Author(s):  
Andreas Nylander ◽  
Josef Hansson ◽  
Majid Kabiri Samani ◽  
Christian Chandra Darmawan ◽  
Ana Borta Boyon ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Thermal Performance ◽  
Photoelectron Spectroscopy ◽  
Thermal Contact ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Thermal Interface Resistance ◽  
Further Development ◽  
Interface Materials

As feature density increases within microelectronics, so does the dissipated power density, which puts an increased demand on thermal management. Thermal interface materials (TIMs) are used at the interface between contacting surfaces to reduce the thermal resistance, and is a critical component within many electronics systems. Arrays of carbon nanotubes (CNTs) have gained significant interest for application as TIMs, due to the high thermal conductivity, no internal thermal contact resistances and an excellent conformability. While studies show excellent thermal performance, there has to date been no investigation into the reliability of CNT array TIMs. In this study, CNT array TIMs bonded with polymer to close a Si-Cu interface were subjected to thermal cycling. Thermal interface resistance measurements showed a large degradation of the thermal performance of the interface within the first 100 cycles. More detailed thermal investigation of the interface components showed that the connection between CNTs and catalyst substrate degrades during thermal cycling even in the absence of thermal expansion mismatch, and the nature of this degradation was further analyzed using X-ray photoelectron spectroscopy. This study indicates that the reliability will be an important consideration for further development and commercialization of CNT array TIMs.

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