Modeling and Optimization of Bond Wires as Transmission Lines and Integrated Antennas at RF/Microwave Frequencies

2010 ◽  
Vol 2010 (1) ◽  
pp. 000881-000885
Author(s):  
Ivan Ndip ◽  
Christian Tschoban ◽  
Stefan Schmitz ◽  
Andreas Ostmann ◽  
Martin Schneider-Ramelow ◽  
...  

In this contribution, we present a systematic approach for optimizing the RF performance of bond wires. First of all, a comparative analysis between two of the most commonly used bond wire signal configurations, the two-conductor and coplanar configurations, is done. Our results reveal that although the partial self-inductance of the signal wires is the same in both configurations, the partial mutual inductance of the coplanar configuration is higher, resulting in a smaller loop inductance. Consequently, the return and insertion losses are smaller. By reducing the distance between the signal and return currents, we further reduced the loop inductance, and significantly optimized the coplanar configuration. For example, considering a 1 mm long bond wire with a diameter of 25 μm, we successfully kept the power lost through the coplanar configuration below 10% at 15 GHz, in comparison to the 70% power lost through the two-conductor configuration at the same frequency. However, more than 30% of the entire power is lost through the optimized coplanar configuration at 40 GHz. At such frequencies where bond wires are unsuitable to be used as transmission lines, we demonstrate that they are very efficient as antennas by designing a half-loop integrated bond wire antenna having a bandwidth of 3 GHz. For experimental verification, test samples were designed, fabricated and measured. An excellent correlation was obtained between simulation and measurement.

2011 ◽  
Vol 2011 (1) ◽  
pp. 000914-000920
Author(s):  
Ivan Ndip ◽  
Abdurrahman Öz ◽  
Christian Tschoban ◽  
Stefan Schmitz ◽  
Martin Schneider-Ramelow ◽  
...  

Due to the multitude of advantages bond wire antennas have over conventional planar antennas (especially on-chip planar antennas), they have received much research attention within the last four years. The focus of the contributions made so far has been on exploiting different configurations of single-element and array bond wire antennas for short-range applications at RF/microwave frequencies. However, the effects of process tolerances of bond wires on the radiation characteristics of bond wire antennas have not been studied in published literature. Therefore in this paper, we investigate the impact of up to 20% fluctuations in the parameters of bond wires on the performance of 42 GHz and 60 GHz bond wire antennas. Our results reveal that the length and radius of bond wires are the most and least sensitive parameters, respectively. Furthermore, the severity of the impact of process tolerances depends on the impedance bandwidth of the original antenna, before considering the tolerances. For example, a 10% change in the length of a bond wire causes the resonance frequency of a 42 GHz antenna to be shifted out of the specified 3GHz bandwidth (40.5 GHz–43.5 GHz) required for point-to-point communication. However, although a 10% change in length of a bond wire yields a 2.5 GHz shift in the resonance frequency of a 60 GHz bond wire antenna, it doesn’t completely detune the antenna because of the original 6 GHz bandwidth available, prior to the fluctuation. Therefore, to prevent the impact of process tolerances from severely degrading the performance bond wire antennas, these antennas should be designed to have larger bandwidths than specified. For experimental verification, a bond wire antenna was designed, fabricated and measured. Very good correlation was obtained between measurement and simulation.


2019 ◽  
Vol 2019 (1) ◽  
pp. 000235-000237
Author(s):  
Ivan Ndip ◽  
Thi Huyen Le ◽  
Martin Schneider-Ramelow ◽  
Klaus-Dieter Lang

Abstract Emerging wireless communication and radar sensing systems require large channel bandwidths to meet the requirements of some key applications. Antennas used for the development of these systems must be designed to enable these large bandwidths. In this work, we present the characteristics of a quasi-half loop bond wire antenna (QHL-BWA) which enable large bandwidths and high gains at mmWave frequencies. The antenna was modelled and simulated using Ansys HFSS. Test samples were designed and measured. Very good correlation was obtained between measurement and simulation results.


Author(s):  
Carl Nail

Abstract To overcome the obstacles in preparing high-precision cross-sections of 'blind' bond wires in integrated circuits, this article proposes a different technique that generates reliable, repeatable cross-sections of bond wires across most or all of their lengths, allowing unencumbered and relatively artifact-free analysis of a given bond wire. The basic method for cross-sectioning a 'blind' bond wire involves radiographic analysis of the sample and metallographic preparation of the sample to the plane of interest. This is followed by tracking the exact location of the plane on the original radiograph using a stereomicroscope and finally darkfield imaging in which the wire is clearly visible with good resolution.


2011 ◽  
Vol 3 (5) ◽  
pp. 509-520 ◽  
Author(s):  
Montserrat Fernández-Bolaños Badía ◽  
Pierre Nicole ◽  
Adrian Mihai Ionescu

This paper reports on the potential of RF-MEMS technology based on aluminum nitride capacitive dielectric and nickel-suspended membranes to provide RF circuit functions in reconfigurable front-end radios. The RF performance of capacitive switches, distributed MEMS transmission lines (DMTLs) phase shifters for beam steering and tunable filters, including center frequency and bandwidth tuning of bandpass and band-stop filters are presented. Detailed characterization based on S-parameter data demonstrates very promising figures of merit of all fabricated demonstrators from 5 to 40 GHz.


2013 ◽  
Vol 61 (9) ◽  
pp. 4839-4843 ◽  
Author(s):  
Yugang Ma ◽  
Kenichi Kawasaki ◽  
Hisashi Masuda

Author(s):  
Kevin Berger ◽  
Sultan Ali Lilani

Abstract The Aerospace and Defense (A&D) markets are starting to use plastic packages more significantly for Space and Military ruggedized applications. But plastic packages are also inherently less reliable than ceramic devices for A&D applications. The key to the successful use of plastic devices in A&D application is to qualify the devices for the intended application using industry accepted plastic encapsulated microcircuit (PEM) qualification techniques. This paper briefly recaps the test techniques known to be effective in assessing plastic part reliability. But more importantly, it presents actual PEM qualification data gathered over the last 15 years involving over 400 individual PEM Qual lots. The paper also shows the failures modes associated with plastic packages and Cu bond wires. SEM, X-Ray, and Acoustic Microscope images were obtained for the failure modes associated with plastic packages and Cu bond wire.


Author(s):  
Navid Asadizanjani ◽  
Domenic Forte ◽  
Mark Tehranipoor

Abstract Bond pull testing, a well-known method in the failure analysis community, is used to evaluate the integrity of an electronic microchip as well as to detect counterfeit ICs. Existing bond pull tests require that the microchip be de-capsulated in order to obtain physical access to the bond wires in the IC package. Bond pull analysis based on simulation and finite element methods also exists but relies on the original model for a bond wire from a CAD design. In this work, we introduce X-ray tomography imaging with 700nm imaging resolution to acquire the 3D geometry details of bond wires non-destructively. Such information can be used to develop more accurate models for finite element analysis based on real size and structure. Therefore, one can test the bond wire strength as a proof of concept for virtual mechanical testing and counterfeit detection in microchips.


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