scholarly journals Development of the Latest High-performance Acid Copper Plating Additives for Via-Filling & PTH

2012 ◽  
Vol 19 (4) ◽  
pp. 39-43 ◽  
Author(s):  
Shingo Nishiki
Keyword(s):  
High Performance ◽  
Copper Plating ◽  
Plating Additives

scholarly journals Preparation of tin coating on the surface of copper-coated carbon fiber and its effect on the microstructures and properties of the composite coating

2021 ◽  
Author(s):  
Wendong Xu ◽  
Guanglong Li ◽  
Yingdong Qu ◽  
Wei Zhang ◽  
Qiwen Zhou ◽  
...  
Keyword(s):  
Carbon Fiber ◽  
Composite Coating ◽  
High Performance ◽  
Fiber Surface ◽  
Copper Coating ◽  
Copper Plating ◽  
Tin Coating ◽  
Bonding Force ◽  
Coated Carbon ◽  
Plating Layer

Abstract In order to prevent the copper coating on the carbon fiber surface from oxidizing and falling off, the tin coating is plated on the surface of copper-coated carbon fiber. In this paper, the copper-tin composite coating with different thicknesses of tin coatings were successfully prepared by electroless plating. The results show that with the increasing of electroless tin plating time, the thickness of the copper-tin composite coating increases. The test results of the bonding force between the composite coating and the carbon fiber show that the coating bonding force is the best when the thickness of composite coating is between 1.31 μm and 1.55 μm. This is due to the formation of copper-tin intermetallic compounds preventes direct contact between the copper coating and oxygen, which can effectively inhibit the oxidation of the copper plating layer, thereby making the plating layer less likely to fall off. However, the excessively thick tin coating would increase the internal stress of the coating, and promote the generation of cracks on the surface of the composite coating, which would cause the composite coating to fall off. This research will provide new ideas for the preparation of high-performance copper plating on the surface of carbon fiber, and provide an important theoretical and practical basis for the application of copper coatings.

scholarly journals Enhancing the electrical properties of inkjet-printed silver ink by electrolyte sintering, photonic sintering, and electroless plating

2021 ◽  
Vol 53 (1) ◽  
pp. 119-126
Author(s):  
Yusuke Mukai ◽  
Minyoung Suh
Keyword(s):  
Electrical Properties ◽  
Inkjet Printing ◽  
High Performance ◽  
Electrical Performance ◽  
Wearable Electronics ◽  
Copper Plating ◽  
Electroless Copper Plating ◽  
Silver Ink ◽  
Electroless Copper ◽  
Photonic Sintering

Conductive inkjet printing is an emerging rapid manufacturing technology in the field of smart clothing and wearable electronics. The current challenge in conductive inkjet printing includes upgrading of electrical performance of printed inks to the equivalent level to traditional conductors such as bulk silver and copper, especially for high-performance electronic applications such as flexible antennas and circuits. Post-treatments are commonly employed to enhance the electrical conduction of inkjet-printed tracks. This research discusses the effects of electrolyte sintering, photonic sintering and electroless copper plating on the DC electrical resistance and resistivity of inkjet-printed silver nanoparticles. From experimental results and measurements, it was found that all the post-treatment methods effectively improved the electrical properties of printed silver ink, but in different ways. The lowest resistance of 4.5 ? (in 0.1 mm ? 10 mm) and thickest (4.5 ?m) conductor were achieved by electroless copper plating, whereas the lowest resistivity (7.5?10-8 ??m) and thinnest (1.0 ?m) conductor were obtained by photonic sintering.

Effect of azo compounds on structure and mechanical properties of copper coating electrodeposited on oxidized aluminum alloys

2021 ◽  
Vol 6 ◽  
pp. 40-59
Author(s):  
D. V. Belov ◽  
◽  
M. V. Maximov ◽  
S. N. Belyaev ◽  
T. I. Devyatkina ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Aluminum Alloys ◽  
Azo Dye ◽  
High Performance ◽  
Physical And Mechanical Properties ◽  
Copper Coating ◽  
Azo Compounds ◽  
Methyl Red ◽  
Copper Plating ◽  
Adhesive Properties

This article discusses a new method for producing copper electrolytic coatings with high performance properties applied to oxidized aluminum alloys. The purpose of this work is to reveal the effect of the azo compound additive, methyl red (MR), on the structure and physicomechanical properties of copper coatings deposited on oxidized aluminum. To achieve this goal, the following tasks were solved: the microstructure and adhesive properties of the copper coating formed on oxidized aluminum alloys were determined, and the physical and mechanical properties of the copper coating (microhardness, open porosity, adhesion) were connected with the action of an azo dye in the copper plating electrolyte. Samples of aluminum alloys AD1M and AMg6BM were subjected to anodic treatment under the same conditions in two oxidation electrolytes of various compositions. The process of applying a copper coating to samples of oxidized aluminum alloys was carried out using a standard copper plating electrolyte. The comparison was carried out with a copper plating electrolyte of the same composition, in which an additive of azo dye, methyl red (MR). The use of this technology will not only increase the reliability and durability of machine parts and mechanisms, but also restore old ones, which is an important and relevant scientific and technical task.

A High Performance Energy Analyzer for Use in Electron Scanning Microscopy

1969 ◽  
Vol 27 ◽  
pp. 14-15
Author(s):  
A. V. Crewe ◽  
M. Isaacson ◽  
D. Johnson
Keyword(s):  
High Performance ◽  
Vertical Plane ◽  
Median Plane ◽  
Electron Gun ◽  
Uniform Field ◽  
Loss Mechanism ◽  
Electron Scanning Microscopy ◽  
Sector Type ◽  
Double Focusing ◽  
Electron Energy Loss

A double focusing magnetic spectrometer has been constructed for use with a field emission electron gun scanning microscope in order to study the electron energy loss mechanism in thin specimens. It is of the uniform field sector type with curved pole pieces. The shape of the pole pieces is determined by requiring that all particles be focused to a point at the image slit (point 1). The resultant shape gives perfect focusing in the median plane (Fig. 1) and first order focusing in the vertical plane (Fig. 2).

Vacuum System to Minimize the Specimen Contamination of High-Performance EM

1977 ◽  
Vol 35 ◽  
pp. 68-69
Author(s):  
N. Yoshimura ◽  
K. Shirota ◽  
T. Etoh
Keyword(s):  
Electron Microscope ◽  
High Speed ◽  
High Performance ◽  
High Vacuum ◽  
Vacuum System ◽  
Pump System ◽  
Pumping System ◽  
Diffusion Pump ◽  
Almost All ◽  
Cascade Type

One of the most important requirements for a high-performance EM, especially an analytical EM using a fine beam probe, is to prevent specimen contamination by providing a clean high vacuum in the vicinity of the specimen. However, in almost all commercial EMs, the pressure in the vicinity of the specimen under observation is usually more than ten times higher than the pressure measured at the punping line. The EM column inevitably requires the use of greased Viton O-rings for fine movement, and specimens and films need to be exchanged frequently and several attachments may also be exchanged. For these reasons, a high speed pumping system, as well as a clean vacuum system, is now required. A newly developed electron microscope, the JEM-100CX features clean high vacuum in the vicinity of the specimen, realized by the use of a CASCADE type diffusion pump system which has been essentially improved over its predeces- sorD employed on the JEM-100C.

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