Electron Backscatter Diffraction Mapping of Microstructural Evolution of Pure Magnesium during Creep

2008 ◽  
Vol 39 (3) ◽  
pp. 688-695 ◽  
Author(s):  
Takanori Sato ◽  
Milo V. Kral
2009 ◽  
Vol 24 (8) ◽  
pp. 2617-2627 ◽  
Author(s):  
Huajie Yang ◽  
Yongbo Xu ◽  
Yasuaki Seki ◽  
Vitali F. Nesterenko ◽  
Marc André Meyers

The microstructural evolution inside adiabatic shear bands in Fe–Cr–Ni alloys dynamically deformed (strain rates > 104 s−1) by the collapse of an explosively driven, thick-walled cylinder under prescribed strain conditions was examined by electron backscatter diffraction. The observed structure within the bands consisted of both equiaxed and elongated grains with a size of ∼200 nm. These fine microstructures can be attributed to recrystallization; it is proposed that the elongated grains may be developed simultaneously with localized deformation (dynamic recrystallization), and the equiaxed grains may be formed subsequently to deformation (static recrystallization). These recrystallized structures can be explained by a rotational recrystallization mechanism.


2012 ◽  
Vol 217-219 ◽  
pp. 373-376 ◽  
Author(s):  
K.H. Jung ◽  
Yong Bae Kim ◽  
Byung Min Ahn ◽  
Sang Mok Lee ◽  
Jong Sup Lee ◽  
...  

In this study, the variation of workability of semi-continuously casted and extruded ZK60A magnesium alloy was investigated. To determine the deformation capability of two different billets, uniaxial compression tests were conducted at elevated temperatures and two different strain rates. In addition, the microstructural evolution was investigated using electron backscatter diffraction (EBSD) to compare the microstructure before and after the extrusion. The formability of ZK60A depending on the microstructure is discussed based on the experimental results obtained in this study, and is compared with earlier research in the literature.


Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.


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