Photosynthetic plasticity allows blueberry (Vaccinium corymbosum L.) plants to compensate for yield loss under conditions of high sink demand

2020 ◽  
Vol 174 ◽  
pp. 104031 ◽  
Author(s):  
Antonios Petridis ◽  
Jeroen van der Kaay ◽  
Julie Sungurtas ◽  
Susan R. Verrall ◽  
Susan McCallum ◽  
...  
HortScience ◽  
2017 ◽  
Vol 52 (8) ◽  
pp. 1073-1079 ◽  
Author(s):  
Mary Helen Ferguson ◽  
Christopher A. Clark ◽  
Barbara J. Smith

Xylella fastidiosa Wells et al. causes disease in a number of plants in the southeastern United States, including southern highbush blueberry (Vaccinium corymbosum interspecific hybrids), but little was known concerning its potential impact in rabbiteye blueberry (Vaccinium virgatum Aiton syn. Vaccinium ashei Reade). In a naturally infected orchard in Louisiana, mean yields of X. fastidiosa–positive plants were 55% and 62% less than those of X. fastidiosa–negative plants in 2013 and 2014, respectively. Average berry weight was also lower in X. fastidiosa–positive plants. Within 3 years of testing positive for X. fastidiosa, four of nine X. fastidiosa–positive plants appeared dead. However, plants that were X. fastidiosa–negative in 2013 remained so until 2015, indicating that the bacterium did not spread rapidly in this established orchard during this time. Other factors, including soil chemistry variables, Phytophthora cinnamomi, ring nematode, and ringspot symptoms, were also investigated to determine if one of these might predispose plants to infection with X. fastidiosa or be partly responsible for observed yield loss. In most cases, interactions were not found, but associations with soil Cu and Zn suggest a need for further research on whether these elements predispose rabbiteye blueberry to X. fastidiosa infection and thereby contribute to yield losses. Researchers, extension workers, and growers should be aware of X. fastidiosa as a potential yield- and survival-impacting factor in rabbiteye blueberry.


Planta Medica ◽  
2016 ◽  
Vol 81 (S 01) ◽  
pp. S1-S381
Author(s):  
MD López ◽  
P Jara ◽  
S Fischer ◽  
R Wilckens ◽  
H Serri ◽  
...  

TAPPI Journal ◽  
2013 ◽  
Vol 12 (10) ◽  
pp. 33-41 ◽  
Author(s):  
BRIAN N. BROGDON

This investigation evaluates how higher reaction temperatures or oxidant reinforcement of caustic extraction affects chlorine dioxide consumption during elemental chlorine-free bleaching of North American hardwood pulps. Bleaching data from the published literature were used to develop statistical response surface models for chlorine dioxide delignification and brightening sequences for a variety of hardwood pulps. The effects of higher (EO) temperature and of peroxide reinforcement were estimated from observations reported in the literature. The addition of peroxide to an (EO) stage roughly displaces 0.6 to 1.2 kg chlorine dioxide per kilogram peroxide used in elemental chlorine-free (ECF) bleach sequences. Increasing the (EO) temperature by Δ20°C (e.g., 70°C to 90°C) lowers the overall chlorine dioxide demand by 0.4 to 1.5 kg. Unlike what is observed for ECF softwood bleaching, the presented findings suggest that hot oxidant-reinforced extraction stages result in somewhat higher bleaching costs when compared to milder alkaline extraction stages for hardwoods. The substitution of an (EOP) in place of (EO) resulted in small changes to the overall bleaching cost. The models employed in this study did not take into account pulp bleaching shrinkage (yield loss), to simplify the calculations.


Author(s):  
Satish Kodali ◽  
Chen Zhe ◽  
Chong Khiam Oh

Abstract Nanoprobing is one of the key characterization techniques for soft defect localization in SRAM. DC transistor performance metrics could be used to identify the root cause of the fail mode. One such case report where nanoprobing was applied to a wafer impacted by significant SRAM yield loss is presented in this paper where standard FIB cross-section on hard fail sites and top down delayered inspection did not reveal any obvious defects. The authors performed nanoprobing DC characterization measurements followed by capacitance-voltage (CV) measurements. Two probe CV measurement was then performed between the gate and drain of the device with source and bulk floating. The authors identified valuable process marginality at the gate to lightly doped drain overlap region. Physical characterization on an inline split wafer identified residual deposits on the BL contacts potentially blocking the implant. Enhanced cleans for resist removal was implemented as a fix for the fail mode.


Author(s):  
Wing Chiu Tam ◽  
Osei Poku ◽  
R. D. (Shawn) Blanton

Abstract Systematic defects due to design-process interactions are a dominant component of integrated circuit (IC) yield loss in nano-scaled technologies. Test structures do not adequately represent the product in terms of feature diversity and feature volume, and therefore are unable to identify all the systematic defects that affect the product. This paper describes a method that uses diagnosis to identify layout features that do not yield as expected. Specifically, clustering techniques are applied to layout snippets of diagnosis-implicated regions from (ideally) a statistically-significant number of IC failures for identifying feature commonalties. Experiments involving an industrial chip demonstrate the identification of possible systematic yield loss due to lithographic hotspots.


Author(s):  
J. N. C. de Luna ◽  
M. O. del Fierro ◽  
J. L. Muñoz

Abstract An advanced flash bootblock device was exceeding current leakage specifications on certain pins. Physical analysis showed pinholes on the gate oxide of the n-channel transistor at the input buffer circuit of the affected pins. The fallout contributed ~1% to factory yield loss and was suspected to be caused by electrostatic discharge or ESD somewhere in the assembly and test process. Root cause investigation narrowed down the source to a charged core picker inside the automated test equipment handlers. By using an electromagnetic interference (EMI) locator, we were able to observe in real-time the high amplitude electromagnetic pulse created by this ESD event. Installing air ionizers inside the testers solved the problem.


Author(s):  
J. Douglass ◽  
T. D. Myers ◽  
F. Tsai ◽  
R. Ketcheson ◽  
J. Errett

Abstract This paper describes how the authors used a combination of focused ion beam (FIB) microprobing, transmission electron microscopy (TEM), and data and process analysis to determine that localized water residue was causing a 6% yield loss at die sort.


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