Enhancement of electrochemical and thermal bonding reliability by forming a Cu3Sn intermetallic compound using Cu and Sn–58Bi

2020 ◽  
pp. 157595
Author(s):  
Kyung Deuk Min ◽  
Kwang-Ho Jung ◽  
Choong-Jae Lee ◽  
Byeong-Uk Hwang ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Thermal Bonding

Dislocation Substructures Produced During Tensile, Creep, and Fatigue Deformation of Ti3Al at 700°C

1977 ◽  
Vol 35 ◽  
pp. 272-273
Author(s):  
S. M. L. Sastry
Keyword(s):  
Intermetallic Compound ◽  
Strain Rate ◽  
Tensile Creep ◽  
Slip Systems ◽  
Slip Vector ◽  
Superlattice Structure ◽  
Slip Activity ◽  
Dislocation Arrangement ◽  
Ordered Intermetallic ◽  
Tangled Dislocation

Ti3Al is an ordered intermetallic compound having the DO19-type superlattice structure. The compound exhibits very limited ductility in tension below 700°C because of a pronounced planarity of slip and the absence of a sufficient number of independent slip systems. Significant differences in slip behavior in the compound as a result of differences in strain rate and mode of deformation are reported here.Figure 1 is a comparison of dislocation substructures in polycrystalline Ti3Al specimens deformed in tension, creep, and fatigue. Slip activity on both the basal and prism planes is observed for each mode of deformation. The dominant slip vector in unidirectional deformation is the a-type (b) = <1120>) (Fig. la). The dislocations are straight, occur for the most part in a screw orientation, and are arranged in planar bands. In contrast, the dislocation distribution in specimens crept at 700°C (Fig. lb) is characterized by a much reduced planarity of slip, a tangled dislocation arrangement instead of planar bands, and an increased incidence of nonbasal slip vectors.

Atomic structure of interface of intermetallic compound TiAl and nitride Ti2AIN using HREM and image processing

1991 ◽  
Vol 49 ◽  
pp. 570-571
Author(s):  
E. Sukedai ◽  
H. Mabuchi ◽  
H. Hashimoto ◽  
Y. Nakayama
Keyword(s):  
Mechanical Properties ◽  
Image Processing ◽  
Composite Material ◽  
Intermetallic Compound ◽  
Side Surface ◽  
High Resolution Electron Microscopy ◽  
Hexagonal Structure ◽  
Second Phase ◽  
Resolution Electron ◽  
Compound Tial

In order to improve the mechanical properties of an intermetal1ic compound TiAl, a composite material of TiAl involving a second phase Ti2AIN was prepared by a new combustion reaction method. It is found that Ti2AIN (hexagonal structure) is a rod shape as shown in Fig.1 and its side surface is almost parallel to the basal plane, and this composite material has distinguished strength at elevated temperature and considerable toughness at room temperature comparing with TiAl single phase material. Since the property of the interface of composite materials has strong influences to their mechanical properties, the structure of the interface of intermetallic compound and nitride on the areas corresponding to 2, 3 and 4 as shown in Fig.1 was investigated using high resolution electron microscopy and image processing.

Direct observation of Fe-Al-Zn ternary intermetallic compound and its transformation during the early stage of hot-dip galvanizing

1993 ◽  
Vol 51 ◽  
pp. 1116-1117
Author(s):  
C. S. Lin ◽  
W. A. Chiou ◽  
M. Meshii
Keyword(s):  
Intermetallic Compound ◽  
Reaction Rate ◽  
Diffusion Rate ◽  
Early Stage ◽  
Zinc Bath ◽  
Steel Sheets ◽  
Direct Observations ◽  
Solid Iron ◽  
Iron And Zinc ◽  
Ternary Intermetallic Compound

The galvannealed steel sheets have received ever increased attention because of their excellent post-painting corrosion resistance and good weldability. However, its powdering and flaking tendency during press forming processes strongly impairs its performance. In order to optimize the properties of galvanneal coatings, it is critical to control the reaction rate between solid iron and molten zinc.In commercial galvannealing line, aluminum is added to zinc bath to retard the diffusion rate between iron and zinc by the formation of a thin layer of Al intermetallic compound on the surface of steel at initial hot-dip galvanizing. However, the form of this compound and its transformation are still speculated. In this paper, we report the direct observations of this compound and its transformation.The specimens were prepared in a hot-dip simulator in which the steel was galvanized in the zinc bath containing 0.14 wt% of Al at a temperature of 480 °C for 5 seconds and was quenched by liquid nitrogen.

Direct imaging of order-disorder and antiphase domain structures in Ti3Al intermetallic compound

1990 ◽  
Vol 48 (4) ◽  
pp. 480-481
Author(s):  
H. Q. Ye ◽  
T.S. Xie ◽  
D. Li
Keyword(s):  
Intermetallic Compound ◽  
Volume Fraction ◽  
Fundamental Problem ◽  
Antiphase Domain ◽  
Atomic Scale ◽  
Orientation Relationships ◽  
Domain Structures ◽  
Α Phase ◽  
Diffraction Patterns ◽  
Two Phases

The Ti3Al intermetallic compound has long been recognized as potentially useful structural materials. It offers attractive strength to weight and elastic modulus to weight ratios. Recent work has established that the addition of Nb to Ti3Al ductilized this compound. In this work the fundamental problem of this alloy, i.e. order-disorder and antiphase domain structures was investigated at the atomic scale.The Ti3Al+10at%Nb alloys used in this study were treated at 1060°C and then aged at 700°C for 2 hours. The specimens suitable for TEM were prepared by standard jet electrolytic-polishing technique. A JEM-200CX electron microscope with an interpretable resolution of about 0.25 nm was used for HREM.The [100] and [001] projections of the α2 phase were shown in Fig.l.The alloy obtained consist of at least two phases-α2(Ti3Al) and β0 structures. Moreover, a disorder α phase with small volume fraction was also observed. Fig.2 gives [100] and [001] diffraction patterns of the α2 phase. Since lattice parameters of the ordered α2 (a=0.579, c=0.466 nm) and disorder α phase (a0=0.294≈a/2, c0=0.468 nm) are almost the same, their diffraction patterns are difficult to be distinguished when they are overlapped with epitaxial orientation relationships.

A CHANGE IN MAGNETIC PROPERTIES OF Ho2Co7 INTERMETALLIC COMPOUND UPON HYDROGEN ABSORPTION

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-517-C2-518 ◽  
Author(s):  
A. Apostolov ◽  
L. Bozukov ◽  
N. Stanev ◽  
T. Mydlarz
Keyword(s):  
Magnetic Properties ◽  
Intermetallic Compound ◽  
Hydrogen Absorption

INCO ALLOY MS 250

Alloy Digest ◽  
1987 ◽  
Vol 36 (11) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Intermetallic Compound ◽  
Yield Strength ◽  
Physical Properties ◽  
Tensile Properties ◽  
Heat Treating ◽  
Low Carbon ◽  
Martensitic Matrix ◽  
Inco Alloy ◽  
Heat Treated

Abstract INCO Alloy MS 250 is a cobalt-free managing steel with nominal yield strength of 250,000 psi, fully heat-treated. Strengthening results from intermetallic-compound precipitation in a low-carbon martensitic matrix. It has excellent weldability. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: SA-426. Producer or source: Inco Alloys International Inc..

Copper to Aluminum Bonding: IMC Characterization through New Mechanical Sectioning Methods

2010 ◽  
Author(s):  
Lucas Copeland ◽  
Mukul Saran
Keyword(s):  
Intermetallic Compound ◽  
Imaging Study ◽  
Thermal Ageing ◽  
Initial Model ◽  
Growth Morphology ◽  
Intermetallic Formation ◽  
Imaging Parameters ◽  
Bonded Interface ◽  
Bond Interface ◽  
Sem Imaging

Abstract This paper presents a mechanical cross-sectioning approach that produces an image clarity not yet demonstrated in published literature. It demonstrates how a critical sequence of polishing, basic slurry optimization and staining, in conjunction with correct imaging parameters can be used to highlight the growth morphology of the intermetallic compound (IMCs). Utilizing this approach, the paper describes the results of a SEM imaging study of the intermetallic formation and growth at the Cu-Al bond interface during thermal ageing for up to 4000hrs at 150 deg C. The paper uses direct SEM imaging to catalog observations which are used to create an initial model for IMC and void growth at the wire bonded interface. It examines the effect of aluminum splash and concludes that growth of intermetallics at the Cu-Al interface is rapid into the bond-pad aluminum than into the Cu-ball, but the growth thickness uniformity is much higher into the Cu-ball.

The Influence of Mechanical Activation on Hydrogen Absorption by Intermetallic Compound LaNi2.5Co2.4Mn0.1

2020 ◽  
Vol 94 (5) ◽  
pp. 1007-1010
Author(s):  
P. A. Konik ◽  
E. A. Berdonosova ◽  
E. V. Meshcheryakova ◽  
S. N. Klyamkin
Keyword(s):  
Intermetallic Compound ◽  
Mechanical Activation ◽  
Hydrogen Absorption
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