scholarly journals Characterization of Surface and Sub- Surface Defects on Devices using Complimentary Techniques

2008 ◽  
Vol 16 (6) ◽  
pp. 18-20
Author(s):  
Vincent S. Smentkowski ◽  
Sara G. Ostrowski ◽  
Lauraine Denault ◽  
Charles G. Woychik

Being able to differentiate surface from bulk defects on devices requires the use of complimentary characterization tools. In this article, we show how light microscopy, scanning electron microscopy, energy dispersive X-ray analysis, and time of flight secondary ion mass spectrometry provides complimentary information about the surface and sub-surface composition, topography, and microstructure of a semiconductor device.To create a gamma-ray spectroscopy detector, electrical contacts consisting of a blanket coated cathode and a pixilated anode can be deposited directly on opposite faces of a cadmium zinc telluride (CZT) crystal. The contact metallization must adhere to the surfaces, and the streets between adjacent anode pads must be free of residual metal and contaminants to avoid excessive interpixel leakage currents. The analysis reported below was used to validate the structure and composition of the contact metal stack and to characterize the streets of the anode pad array.

Author(s):  
S.F. Corcoran

Over the past decade secondary ion mass spectrometry (SIMS) has played an increasingly important role in the characterization of electronic materials and devices. The ability of SIMS to provide part per million detection sensitivity for most elements while maintaining excellent depth resolution has made this technique indispensable in the semiconductor industry. Today SIMS is used extensively in the characterization of dopant profiles, thin film analysis, and trace analysis in bulk materials. The SIMS technique also lends itself to 2-D and 3-D imaging via either the use of stigmatic ion optics or small diameter primary beams.By far the most common application of SIMS is the determination of the depth distribution of dopants (B, As, P) intentionally introduced into semiconductor materials via ion implantation or epitaxial growth. Such measurements are critical since the dopant concentration and depth distribution can seriously affect the performance of a semiconductor device. In a typical depth profile analysis, keV ion sputtering is used to remove successive layers the sample.


Nanoscale ◽  
2017 ◽  
Vol 9 (44) ◽  
pp. 17571-17575 ◽  
Author(s):  
Paweł Piotr Michałowski ◽  
Piotr Gutowski ◽  
Dorota Pierścińska ◽  
Kamil Pierściński ◽  
Maciej Bugajski ◽  
...  

Non-uniform oxygen contamination in the superlattice region of a quantum cascade laser measured by secondary ion mass spectrometry.


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