Effect of Curing Reaction Types on the Structures and Properties of Acetylene-Containing Thermosets: Towards Optimization of Curing Procedure

2021 ◽  
Author(s):  
Junli Zhu ◽  
Liquan Wang ◽  
Jiaping Lin ◽  
Lei Du ◽  
Qixin Zhuang
Keyword(s):  
High Temperature ◽  
Curing Process ◽  
Curing Reaction ◽  
Structures And Properties ◽  
Curing Procedure

High-temperature thermosets are usually prepared from resins containing alkynyl groups, and their properties depend much upon the curing process containing various types of curing reactions. However, how the curing process...

Preparation and Properties of Silicon-Containing Arylacetylene Resins with Octa(maleimidophenyl)silsesquioxane

2012 ◽  
Vol 557-559 ◽  
pp. 1152-1156
Author(s):  
Yan Zhou ◽  
Fu Wei Huang ◽  
Fa Rong Huang ◽  
Lei Du
Keyword(s):  
Thermal Stability ◽  
Dielectric Constant ◽  
Dielectric Properties ◽  
Thermal Polymerization ◽  
Curing Process ◽  
Thermal Stabilities ◽  
Curing Reaction ◽  
Air Atmosphere ◽  
Ft Ir ◽  
Dsc Analyses

Modified silicon-containing arylacetylene resins (DMSEPE-OMPS) were prepared from poly(dimethylsilyleneethynylenephenyleneethynylene) (DMSEPE) and Octa(maleimidophenyl)- silsesquioxane (OMPS). The curing reaction of DMSEPE-OMPS resin was studied by FT-IR and DSC techniques. Thermal stability and dielectric properties of cured DMSEPE-OMPS resins were determined. FT-IR and DSC analyses indicate that thermal polymerization of DMSEPE-OMPS resin occurs in the curing process. Thermal stabilities of cured DMSEPE-OMPS resins under N2 and air atmosphere decrease gradually with the increment of OMPS components. The incorporation of OMPS can obviously reduce dielectric constant of DMSEPE-OMPS resins.

Warpage Behaviors of System-in-Packages on a Substrate Strip

2018 ◽  
Vol 2018 (1) ◽  
pp. 000344-000348
Author(s):  
Eric Ouyang ◽  
Billy Ahn ◽  
SeonMo Gu ◽  
Jim Hsu ◽  
Yonghyuk Jeong ◽  
...  
Keyword(s):  
Material Characterization ◽  
Epoxy Resins ◽  
Curing Process ◽  
Molding Compound ◽  
Advanced Material ◽  
Curing Reaction ◽  
Different Types ◽  
The Impact ◽  
Compound Materials ◽  
Kinetics Of

Abstract In this paper, the impact of two different types of warpage, strip warpage and system-in-packages (SiP) module warpage, are considered and studied, both experimentally and numerically. An advanced material characterization method is also conducted to study the curing reaction and Pressure-Volume-Temperature-Cure (PVTC) kinetics of the packages. The curing reaction of epoxy resins, as a function of temperature and activation energies, is experimentally determined. During the curing process, the viscosity of epoxy resins change with temperature and conversion rate. The Castro-Macosko model is adopted to describe the rheological properties of epoxy resins. Experimentally, we have prepared substrate strip samples with different component density and molding compound materials. Each substrate strip contains eighteen system-in-packages. The warpages of all substrate strips and all the system-in-package modules were measured, compared, and correlated.

Study on the Transparent Electronic Isolation Layer Material - A Photoresist Composition which is Stable at High Temperature and Humidity

2020 ◽  
Vol 980 ◽  
pp. 44-57
Author(s):  
Wei Li ◽  
Da Hong Li ◽  
Jian Ping Cao ◽  
Xiang Jun Yun ◽  
Pawan Kunmar
Keyword(s):  
High Temperature ◽  
Uv Curing ◽  
Acid Value ◽  
Curing Process ◽  
Process Technology ◽  
Acrylic Copolymer ◽  
Isolation Layer ◽  
Temperature And Humidity ◽  
Bridge Pattern ◽  
Uv Curing Process

A negative resist composition composed of an acrylic-copolymer-binder resin, a crosslinker, photoinitiators, some agents and solvents has been UV-cured and developed for OverCoat (OC)-Bridge of One Glass Solution (OGS) touch panel (TP) sensor, wherein acrylic-copolymer-binder resin as a key element consisting of N-Phenylmaleimide (N-Pm), Methacrylic acid (MA), Styrene (St) and Isobornyl methacrylate (iBMA) monomers, being designed and synthesized to control the acid value (90-110mgKOH/g), molecular weight (Mw:10,000-20,000) and approximate solubility parameter [10.67-11.05(cal/cm3)1/2]. Here,we demonstrate a OC photoresist applies between two ITO line-films by UV-curing process technology deveoled for OC-Bridge pattern with a kind of acrylic-copolymer-binder resin by ours. Acting as TP sensor, the OC patterns have adequate resistance to solvents, acids and alkalis, good thermal and humid stability, and with excellent transparency and insulation. This OC photoresist, coupled with the acrylic-copolymer-binder resins, provides an unprecedented approach to realize supporting high temperature and humidity OC-Bridge.

Curing Process and Heat-Resistance of Polyethersulfone Toughened Epoxy Resins

2017 ◽  
Vol 898 ◽  
pp. 2302-2308
Author(s):  
Jin Li Zhou ◽  
Shu Zhu ◽  
Wen Pin Jia ◽  
Chao Cheng ◽  
Elwathig A.M. Hassan ◽  
...  
Keyword(s):  
Heat Resistance ◽  
Epoxy Resin ◽  
Thermo Gravimetric Analysis ◽  
Exothermic Peak ◽  
Curing Temperature ◽  
Gravimetric Analysis ◽  
Curing Process ◽  
Thermo Gravimetric ◽  
Rich Phase ◽  
Curing Reaction

In order to improve the toughness of epoxy resin, hydroxyl-terminated polyethersulfone (PES) with various amounts (0 wt.%, 5 wt.%, 10 wt.%, 15 wt.%, 20 wt.%) were added to bisphenol A epoxy resin (DER331)/ curing agent DETDA (E100) systems, and the influence of PES contents on curing process and heat-resistance was studied. Non-isothermal DSC was used to determine the curing process of uncured DER331/E100/PES systems at heating rate of 2°C/min, 5°C/min, 7°C/min, 10°C/min and 15°C/min separately, and the apparent activation energy was calculated based on Kissinger method. The morphology of the etched cured DER331/E100/PES systems with different PES contents was observed by SEM. The heat-resistance of these systems was investigated by DSC and TGA. The results showed that with the increasing of PES content the curing exothermic peak, the heat of curing reaction, the initial and final curing temperature all decreased at the first and then increased, indicating that when the PES content was low (5 wt.%, 10 wt.%), PES can facilitate the curing process, while, when PES content up to 15 wt.%, PES can prevent or weaken the curing reaction. SEM results indicated that the phase structure changed drastically depending on the PES content. The systems with 5 wt.% and 10 wt.% PES were epoxy-rich phase, with 15 wt.% PES was co-continuity phase, and with 20 wt.% PES showed complete phase inversion (PES rich phase). The glass transition temperature and thermo gravimetric analysis demonstrated that the addition of PES can increase the heat resistance of cured DER331/E100/PES systems.

scholarly journals Curing Reaction Kinetics of the EHTPB-Based PBX Binder System and Its Mechanical Properties

Coatings ◽  
2020 ◽  
Vol 10 (12) ◽  
pp. 1266
Author(s):  
Xing Zhang ◽  
Yucun Liu ◽  
Tao Chai ◽  
Zhongliang Ma ◽  
Kanghui Jia
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Reaction Kinetics ◽  
Testing Machine ◽  
Curing Process ◽  
Binder System ◽  
Isophorone Diisocyanate ◽  
Scanning Calorimetry ◽  
Curing Reaction ◽  
Kinetics Of

In this research, differential scanning calorimetry (DSC) was employed to compare the curing reaction kinetics of the epoxidized hydroxyl terminated polybutadiene-isophorone diisocyanate (EHTPB-IPDI) and hydroxyl terminated polybutadiene-isophorone diisocyanate (HTPB-IPDI) binder systems. Glass transition temperature (Tg) and mechanical properties of the EHTPB-IPDI and HTPB-IPDI binder systems were determined using the DSC method and a universal testing machine, respectively. For the EHTPB-IPDI binder system, the change of viscosity during the curing process in the presence of dibutyltin silicate (DBTDL) and tin 2-ethylhexanoate (TECH) catalysts was studied, and the activation energy was estimated. The results show that the activation energies (Ea) of the curing reaction of the EHTPB-IPDI and HTPB-IPDI binder systems are 53.8 and 59.1 kJ·mol−1, respectively. While their average initial curing temperatures of the two systems are 178.2 and 189.5 °C, respectively. The EHTPB-IPDI binder system exhibits a higher reactivity. Compared with the HTPB-IPDI binder system, the Tg of the EHTPB-IPDI binder system is increased by 5 °C. Its tensile strength and tear strength are increased by 12% and 17%, respectively, while its elongation at break is reduced by 10%. Epoxy groups and isocyanates react to form oxazolidinones, thereby improving the mechanical properties and thermal stability of polyurethane materials. These differences indicate that the EHTPB-IPDI binder system has better thermal stability and mechanical properties. During the EHTPB-IPDI binder system’s curing process, the DBTDL catalyst may ensure a higher viscosity growth rate, indicating a better catalytic effect, consistent with the prediction results obtained using the non-isothermal kinetic analysis method.

Fabrication of SiCf/SiC Composite by the PIP Process with Electron Beam Curing Method

2007 ◽  
Vol 124-126 ◽  
pp. 1071-1074
Author(s):  
Ji Yeon Park ◽  
Chang Hyun Woo ◽  
Weon Ju Kim ◽  
Woo Seog Ryu
Keyword(s):  
Electron Beam ◽  
High Temperature ◽  
Temperature Stability ◽  
Curing Process ◽  
Pyrolysis Process ◽  
High Temperature Stability ◽  
Curing Method ◽  
Electron Beam Curing ◽  
Polymer Impregnation

In the polymer impregnation and pyrolysis (PIP) process for the fabrication of SiCf/SiC composite, the curing process should be included to increase the conversion yields. During the curing process, unintended oxygen is introduced. Control of this oxygen is very important to obtain composites with a good high temperature stability. Using the electron beam curing process with full doses of 2~10 MGy and the pyrolysis process at 1300~1500oC, composites with an oxygen contents of less than 1 wt% could be obtained.

Studies on Curing Kinetics Parameter of TDI-PPG-MOCA Polyurethane by FTIR

2011 ◽  
Vol 328-330 ◽  
pp. 966-969 ◽  
Author(s):  
Qing Zhen Wen ◽  
Chao Yu ◽  
Jin Hua Zhu ◽  
Tian Yu Liu
Keyword(s):  
Reaction Rate ◽  
Curing Kinetics ◽  
Crosslinking Reaction ◽  
Curing Process ◽  
Second Order Reaction ◽  
Reaction Rate Constants ◽  
Curing Reaction ◽  
Different Temperatures ◽  
Measured Effect ◽  
Kinetics Parameter

The curing process of polyurethanes was investigated with FTIR method. The curves of conversion (α)VS curing reaction time (t) at different temperatures were obtained .The curing reaction of the system was found to be second order reaction. The reaction rate constants and activation energy had been measured. Effect of the use lever of curing agent and temperatures on curing reaction was discussed. The results showed that when the mole ratio of NCO/OH is smaller than 1, the crosslinking reaction take place at high temperature.

Study on Viscosity Evaluation of Foamed Epoxy Asphalt

2014 ◽  
Vol 1082 ◽  
pp. 424-428
Author(s):  
Ming Huang ◽  
Xue Jun Wen ◽  
Xu Jian ◽  
Xiao Guang Zheng ◽  
Wei Dong Huang
Keyword(s):  
Construction Material ◽  
Curing Process ◽  
Viscosity Change ◽  
Curing Conditions ◽  
Curing Reaction ◽  
Epoxy Asphalt ◽  
Content Variation ◽  
Curing Agents

Foamed epoxy asphalt, which is a kind of epoxy asphalt with a brand-new curing system, has excellent construction performance. Based on the change of viscosity-temperature curves, several mixing amounts of new anhydride curing agents used in B-component of epoxy asphalt have been proposed. Through adjusting the content variation of B component to make the viscosity meet curing conditions. Meanwhile, the curing system formula has been improved by monitoring the viscosity change in the curing process, which can effectively slow down the curing reaction, make the performance of foamed epoxy asphalt achieve the construction requirements, and also provide enough time to complete mixing, paving and rolling in the process of construction. Material A1, A2, N1, and American ChemCo epoxy asphalt was studied by viscosity tests.

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