scholarly journals Nondestructive testing method for a new generation of electronics

2018 ◽  
Vol 143 ◽  
pp. 04007
Author(s):  
Anton Azin ◽  
Andrey Zhukov ◽  
Anton Narikovich ◽  
Sergey Ponomarev ◽  
Sergey Rikkonen ◽  
...  
Keyword(s):  
Acoustic Emission ◽  
Nondestructive Testing ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
X Ray ◽  
Printed Circuit ◽  
Critical Design ◽  
Testing Method ◽  
Nondestructive Testing Method ◽  
Design Defects

The implementation of the Smart City system needs reliable and smoothly operating electronic equipment. The study is aimed at developing a nondestructive testing method for electronic equipment and its components. This method can be used to identify critical design defects of printed circuit boards (PCB) and to predict their service life, taking into account the nature of probable operating loads. The study uses an acoustic emission method to identify and localize critical design defects of printed circuit boards. Geometric dimensions of detected critical defects can be determined by the X-ray tomography method. Based on the results of the study, a method combining acoustic emission and X-ray tomography was developed for nondestructive testing of printed circuit boards. The stress-strain state of solder joints containing detected defects was analyzed. This paper gives an example of using the developed method for estimating the degree of damage to joints between PCB components and predicting the service life of the entire PCB.

Printed Circuit Board Propagating Faults

2004 ◽  
Author(s):  
Daren T. Slee
Keyword(s):  
Printed Circuit Boards ◽  
Printed Circuit Board ◽  
Fault Tree Analysis ◽  
Circuit Board ◽  
Circuit Boards ◽  
Visual Examination ◽  
X Ray ◽  
Printed Circuit ◽  
Root Cause ◽  
X Ray Imaging

Abstract This paper is a review of propagating faults in printed circuit boards (PCBs) from the perspective of using the resulting burn and melted copper patterns to identify likely locations of fault initiation. Visual examination and x-ray imaging are the main techniques for examining PCB propagating faults. Once the likely fault initiation location has been identified, fault tree analysis can be used to determine the root cause for fault initiation. The paper discusses the mechanisms by which PCB propagating faults occur. The method of determining the likely area of initiation of the fault using visual examination of the PCB burn pattern, x-ray imaging, and the layout artwork for the PCB is discussed. The paper then goes on to discuss possible root-causes for the initiation of PCB propagating faults and some of their considerations.

Non-Destructive PCB Reverse Engineering Using X-Ray Micro Computed Tomography

2015 ◽  
Author(s):  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Mark Tehranipoor ◽  
Domenic Forte
Keyword(s):  
Reverse Engineering ◽  
Printed Circuit Boards ◽  
Advanced Characterization ◽  
Fault Isolation ◽  
Lessons Learned ◽  
Circuit Boards ◽  
Micro Computed Tomography ◽  
X Ray ◽  
Printed Circuit ◽  
Non Destructive

Abstract Reverse engineering of electronics systems is performed for various reasons ranging from honest ones such as failure analysis, fault isolation, trustworthiness verification, obsolescence management, etc. to dishonest ones such as cloning, counterfeiting, identification of vulnerabilities, development of attacks, etc. Regardless of the goal, it is imperative that the research community understands the requirements, complexities, and limitations of reverse engineering. Until recently, the reverse engineering was considered as destructive, time consuming, and prohibitively expensive, thereby restricting its application to a few remote cases. However, the advents of advanced characterization and imaging tools and software have counteracted this point of view. In this paper, we show how X-ray micro-tomography imaging can be combined with advanced 3D image processing and analysis to facilitate the automation of reverse engineering, and thereby lowering the associated time and cost. In this paper, we demonstrate our proposed process on two different printed circuit boards (PCBs). The first PCB is a four-layer custom designed board while the latter is a more complex commercial system. Lessons learned from this effort can be used to both develop advanced countermeasures and establish a more efficient workflow for instances where reverse engineering is deemed necessary. Keywords: Printed circuit boards, non-destructive imaging, X-ray tomography, reverse engineering.

In-Situ Thermal Chamber 3D X-Ray Computed Tomography for Non-Destructive Detection of Submicron Via-Crack in Printed Circuit Boards

2020 ◽  
Author(s):  
Daechul Choi ◽  
Sooyoung Ji ◽  
Jaelim Choi ◽  
Miyang Kim ◽  
Eunju Yang ◽  
...  
Keyword(s):  
Computed Tomography ◽  
Printed Circuit Boards ◽  
Fault Isolation ◽  
Circuit Boards ◽  
X Ray ◽  
Printed Circuit ◽  
Thermal Chamber ◽  
X Ray Computed ◽  
Non Destructive

Abstract In this paper, we demonstrate a case for non-destructive detection of submicron wide via-crack in printed circuit boards (PCBs) by using in-situ thermal chamber 3D x-ray computed tomography. The defect location is verified by a PFA (Physical Failure Analysis), and good agreement was made. This fault isolation method is proposed as a possible solution for identifying submicron cracks in PCB substrates during challenging investigations.

Electrochemical Migration Behaviours of Low Silver Content Solder Alloy SAC 0307 on Printed Circuit Boards (PCBs) in NaCl Solution

2016 ◽  
Vol 846 ◽  
pp. 3-12 ◽  
Author(s):  
Norinsan Kamil Othman ◽  
Koh Yunn Teng ◽  
Azman Jalar ◽  
Fakhrozi Che Ani ◽  
Zamri Samsudin
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Device ◽  
Silver Content ◽  
Corrosion Behaviour ◽  
Main Element ◽  
Variable Pressure ◽  
Electrochemical Migration ◽  
Circuit Boards ◽  
X Ray ◽  
Printed Circuit

Electrochemical migration (ECM) of solder joining can result in the growth of a metal deposit with dendrite structure from cathode to anode. In electronic device, this phenomenon potentially leads to the incompetence or failure of whole devices. In this paper, the ECM behaviour of printed circuit boards (PCBs) with SAC 0307, one of the low-cost lead-free solder alloys with less silver content, has been studied. The corrosion behaviour of SAC 0307 has been investigated by using sodium chloride solution in different concentrations which is between 0.01 M to 1.0 M as a medium. A Water Drop Test (WDT) was carried out and the time-to-failure of each sample has been recorded. After WDT test, the dendrite phase was identified using Variable Pressure Scanning Electron Microscope (VPSEM) with Energy Dispersive X-ray Spectroscopy (EDX) and X-ray Photoelectron Spectroscopy (XPS) to investigate its surface morphology and corrosion products. As results, it has been found that the corrosion susceptibility of SAC 0307 is greatly influenced by the concentration of the medium solution used. The voltage drop occurred was due to the dendrite grew at the cathode electrode on the PCBs and expanded to the anode electrode, indicating a significant effect of aggressive behaviour of the medium used. The rate of the dendrite growth was affected by the concentration of the medium used. The main element found in the dendrites on the SAC 0307 on PCBs was Tin as it is more mobile than Cu.

Studies on leaching characteristics of electronic waste for metal recovery using inorganic and organic acids and base

2020 ◽  
pp. 0734242X2093192
Author(s):  
Debarati Das ◽  
Siddhartha Mukherjee ◽  
Mahua Ghosh Chaudhuri
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Waste ◽  
Circuit Boards ◽  
X Ray Diffraction ◽  
Aqua Regia ◽  
X Ray ◽  
Printed Circuit ◽  
Inorganic Acids ◽  
Acid And Base ◽  
Before And After

In this paper, we report leaching of precious and scattered metals such as gold (Au), copper (Cu), nickel (Ni), zinc (Zn), iron (Fe), and lead (Pb) from printed circuit boards of scrap mobile phones by hydrometallurgical process using inorganic acid, organic acid and base. The amount of metals leached by different leachants are quantified using atomic absorption spectroscopy. Among various inorganic acids, aqua regia (mixture of nitric acid (HNO3) and hydrochloric acid) is found to be the strongest leachant for most of the metals such as Zn (2.04 wt %), Fe (17.90 wt %), Ni (0.66 wt %), Pb (5.86 wt %) and Au (0.04 wt %). The basic leachant, ammonium thiosulphate is found to be very effective in leaching of Au (0.03125 wt %). The dissolution of Cu in HNO3 gives the highest amount of Cu in the solvent, that is, ∼ 7.52 wt %. The metallic phases present in the electronic waste before and after leaching are identified by X-ray diffraction analysis. The microscopic structure has been studied using a scanning electron microscope which depicts erosion of the structure after leaching.

Experimental Study on Impact Mechanical Properties of Waste Printed Circuit Boards

2010 ◽  
Vol 113-116 ◽  
pp. 1123-1127
Author(s):  
Nian Xin Zhou ◽  
Ya Qun He ◽  
Chen Long Duan ◽  
Shu Ai Wang
Keyword(s):  
Mechanical Properties ◽  
Printed Circuit Boards ◽  
Impact Load ◽  
Circuit Board ◽  
Circuit Boards ◽  
X Ray ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards ◽  
The Impact ◽  
Scanning Electron

Comminution is a key part of the reutilization of discarded circuit board. In order to find out the most appropriate method of crushing, the characteristics of the materials and the mechanical properties of resistance impact of discarded circuit boards were studied. The substrate of circuit boards, slots of ISA and PCI were adopted as the specimen. The scanning electron microscope (SEM) and energy disperse X-ray spectroscopy (EDX) were used to characterize and analyze the combined state of the fracturing materials on the specimen surfaces after comminution. Results showed that the metals and nonmetals in the slots were crushed and dissociated easily.At the same time, the metal and nonmetal combined interfaces in the substrate have a trend to be broken and separated under the impact effect, which means the crushing circuit board has a favorable break effect under impact load.

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