Analysis of DC and analog/RF performance on Cyl-GAA-TFET using distinct device geometry

2017 ◽  
Vol 38 (7) ◽  
pp. 074003 ◽  
Author(s):  
S. K. Vishvakarma ◽  
Ankur Beohar ◽  
Vikas Vijayvargiya ◽  
Priyal Trivedi
2009 ◽  
Vol 1203 ◽  
Author(s):  
Paolo Calvani ◽  
Maria Cristina Rossi ◽  
Gennaro Conte ◽  
Stefano Carta ◽  
Ennio Giovine ◽  
...  

AbstractEpitaxial diamond films were deposited on polished single crystal Ib type HPHT diamond plates of (100) orientation by microwave CVD. The epilayers were used for the fabrication of surface channel MESFET structures having sub-micrometer gate length in the range 200-800 nm. Realized devices show maximum drain current and trasconductance values of about 190 mA/mm and 80 mS/mm, respectively, for MESFETs having 200 nm gate length. RF performance evaluation gave cut off frequency of about 14 GHz and maximum oscillation frequency of more than 26 GHz for the same device geometry.


2004 ◽  
Vol 44 (7) ◽  
pp. 1101-1107 ◽  
Author(s):  
L Yang ◽  
A Asenov ◽  
J.R Watling ◽  
M Boriçi ◽  
J.R Barker ◽  
...  

VLSI Design ◽  
1998 ◽  
Vol 8 (1-4) ◽  
pp. 313-317
Author(s):  
S. Babiker ◽  
A. Asenov ◽  
N. Cameron ◽  
S. P. Beaumont ◽  
J. R. Barker

In this paper we described a complete methodology to extract the RF performance of ‘real’ compound FETs from time domain Ensemble Monte-Carlo (EMC) simulations which can be used for practical device design. The methodology is based on transient finite element EMC simulation of realistic device geometry. The extraction of the terminal current is based on the Ramo-Shockley theorem. Parasitic elements like the gate and contact resistances are included in the RF analysis at the post-processing stage. Example of the RF analysis of pseudomorphic HEMTs illustrates our approach.


2011 ◽  
Vol 29 (8) ◽  
pp. 946-952 ◽  
Author(s):  
Letícia Fernandes de Oliveira ◽  
Jefferson Luiz Gomes Correa ◽  
Poliana Gaspar Tosato ◽  
Soraia Vilela Borges ◽  
José Guilherme L. F. Alves ◽  
...  

2004 ◽  
Vol 14 (03) ◽  
pp. 625-631 ◽  
Author(s):  
J. W. LAI ◽  
W. HAFEZ ◽  
M. FENG

We have fabricated the high-speed InP/InGaAs -based single heterojunction bipolar transistors (SHBTs) with current gain cutoff frequency, fT from 166GHz to over 500GHz by the approach of vertical scaling. Collector thickness is reduced from 3000Å to 750Å and the peak current density is increased up to 1300kA/cm2. In this paper, device rf performance has been compared with respect to materials with different vertical dimensions. The scaling limitation is also studied by analytical approach. The extracted physical parameters suggest that the parasitic emitter resistance is the major limit on further enhancing ultra-scaled HBT intrinsic speed due to the associated RECBC delay. The cut-off frequency of a 500Å collector SHBT has been measured and the results indicate a dramatic drop on fT, supporting the conclusion projected by model analysis. It is also commented that for deeply downscaled HBTs, impact ionization could be another degrading mechanism limits device bandwidth.


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