Reliability of Solder Joints on CBGA Packaging under Temperature Cycling Condition

2020 ◽  
Author(s):  
Tao ZHANG ◽  
Peng WU ◽  
Pei Feng HU ◽  
Feng LU
Keyword(s):  
Solder Joints ◽  
Temperature Cycling ◽  
Reliability Of Solder Joints ◽  
Cycling Condition

Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints

2010 ◽  
Vol 97-101 ◽  
pp. 3963-3966
Author(s):  
Yong Cheng Lin ◽  
Jing Hong Lu ◽  
Jun Zhang
Keyword(s):  
Thermal Fatigue ◽  
Flip Chip ◽  
Solder Joints ◽  
Element Model ◽  
Temperature Cycling ◽  
Stress Strain ◽  
Reliability Of Solder Joints ◽  
Distribution Of Stress ◽  
Underfill Material ◽  
Cycling Condition

Fatigue failure of solder joints is a serious reliability concern in area array technologies. A non-linear finite element model was made to study the effects of underfill material and substrate flexibility on solder joint thermal fatigue. Accelerated temperature cycling loading was imposed to evaluate the reliability of solder joints in test flip chip assembly. The results show that the underfill material and substrate flexibility can improve the distribution of stress/strain and reduce the magnitude of stress/strain in the solder joints. Therefore, the reliability of solder joints under thermal cycling condition can be enhanced by applying underfill material and selecting the Flex substrates during temperature cycling.

Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly

2005 ◽  
Vol 127 (4) ◽  
pp. 466-473 ◽  
Author(s):  
B. L. Chen ◽  
X. Q. Shi ◽  
G. Y. Li ◽  
K. H. Ang ◽  
Jason P. Pickering
Keyword(s):  
Solder Joints ◽  
Reliability Assessment ◽  
Ball Grid Array ◽  
Temperature Cycling ◽  
Rapid Temperature ◽  
Reliability Of Solder Joints ◽  
Solder Joint Fatigue ◽  
Time Required ◽  
Failure Location

In this study, a thermoelectric cooler-based rapid temperature cycling (RTC) testing method was established and applied to assess the long term reliability of solder joints in tape ball grid array (TBGA) assembly. This RTC testing methodology can significantly reduce the time required to determine the reliability of electronic packaging components. A three-parameter Weibull analysis characterized with a parameter of failure free time was used for assembly reliability assessment. It was found that the RTC not only speedily assesses the long-term reliability of solder joints within days, but also has the similar failure location and failure mode observed in accelerated temperature cycling (ATC) test. Based on the RTC and ATC reliability experiments and the modified Coffin-Manson equation, the solder joint fatigue predictive life can be obtained. The simulation results were found to be in good agreement with the test results from the RTC. As a result, a new reliability assessment methodology was established as an alternative to ATC for the evaluation of long-term reliability of electronic packages.

scholarly journals Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Jianguo Cui ◽  
Keke Zhang ◽  
Di Zhao ◽  
Yibo Pan
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Solder Joints ◽  
High Reliability ◽  
Sharp Decrease ◽  
Thermal Shock Test ◽  
Shear Properties ◽  
Equivalent Time ◽  
Ultrasonic Assisted ◽  
Reliability Of Solder Joints

AbstractThrough ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and − 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile–brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.

Reinforced Solder Technology for Increased Reliability

2017 ◽  
Vol 2017 (1) ◽  
pp. 000641-000645
Author(s):  
Tim Jensen ◽  
Sunny Neoh ◽  
Adam Murling
Keyword(s):  
Melting Point ◽  
Solder Joint ◽  
Solder Joints ◽  
Reliability Of Solder Joints ◽  
Impact Reliability ◽  
Selection Of

Abstract The reliability of solder joints have been studied for many years. The selection of a solder for a particular application is often limited based on melting point requirements. This limits the number of options that are available for use. When alloy selection options are limited, people look to process changes to try and improve the reliability. Two such areas that have been identified that can impact reliability are bondline control and void reduction. This paper analyzes a new reinforced solder technology to maintain a consistent solder joint bondline. Experiments were also conducted to determine how best to design these preforms to minimize voiding.

Interaction of thermal cycling and electric current on reliability of solder joints in different solder balls

2019 ◽  
Vol 6 (10) ◽  
pp. 106302 ◽  
Author(s):  
Yufeng Jiao ◽  
Kittisak Jermsittiparsert ◽  
Aleksandr Yu Krasnopevtsev ◽  
Qahtan A Yousif ◽  
Mohammad Salmani
Keyword(s):  
Thermal Cycling ◽  
Electric Current ◽  
Solder Joints ◽  
Solder Balls ◽  
Reliability Of Solder Joints

Analysis of Solder Joint Breakdown Life in Electronic Device Mounted in Vehicle

2004 ◽  
Author(s):  
Qiang Yu ◽  
Masaki Shiratori ◽  
Kimimasa Murayama ◽  
Kazuhiro Igarashi ◽  
Takashi Nakanishi
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Time Estimation ◽  
Initial Crack ◽  
Fatigue Reliability ◽  
Electric Device ◽  
Long Time ◽  
Reliability Of Solder Joints ◽  
Improve Reliability

In recent years many electric equipments have come to be used for cars. Solder joints in electric device utilizing car are exposed to harder environment and required higher reliability than that in electric household appliances. Because of this reason, thermal fatigue reliability of solder joints has become one of the most important issues in car electronics. Generally thermal fatigue reliability is estimated by thermal cycle examination, but it needs long time. Estimation by FEM enables it to improve reliability and to reduce time. Analysis of solder life generally can predict only initial crack. But it is important to predict crack propagation and solder joints break down, considering that a function of solder joints is electric connection. In this study, the authors proposed a method to predict break down life by analytical approach.

scholarly journals Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition

Materials ◽  
2019 ◽  
Vol 12 (24) ◽  
pp. 4240
Author(s):  
Qingfeng Wang ◽  
Hong Chen ◽  
Fengjiang Wang
Keyword(s):  
Interfacial Reaction ◽  
Thermal Aging ◽  
Solder Joints ◽  
Depressing Effect ◽  
Aging Condition ◽  
Obvious Effect ◽  
Cu Substrate ◽  
Zn Addition ◽  
Reliability Of Solder Joints ◽  
Interfacial Evolution

Excessive growth of intermetallic compounds (IMCs) during service affects the reliability of solder joints, so how to suppress the growth of IMC thickness at the interface in solder joints becomes a widespread concern. In this work, the interfacial reaction between Sn-10Bi solder and Cu substrate after thermal aging was investigated. Moreover, to depress the IMC growth at the interface, trace amounts of Zn was added into the Sn-10Bi solder, and the interfacial reactions of Sn-10Bi-xZn solders (x = 0.2, 0.5) and Cu substrate after thermal aging were studied in this paper. Compounds such as Cu6(Sn, Zn)5 and Cu5Zn8 were formed at the interface after adding trace amounts of Zn. The addition of 0.2 and 0.5 wt% Zn significantly inhibited the thickness growth of IMCs and the formation of Cu3Sn IMC at the interface of Sn-10Bi-0.2Zn/Cu and Sn-10Bi-0.5Zn/Cu during thermal aging. Therefore, the addition of trace Zn had an obvious effect on the interfacial reaction of Sn-10Bi/Cu solder joint. Interestingly, the evolution of IMC thickness in Sn-10Bi-0.5Zn/Cu solder joints was completely different from that in Sn-10Bi or Sn-10Bi-0.2Zn solder joints, in which the spalling of IMCs occurred. In order to explore the mechanisms on the depressing effect from the addition of trace Zn, the activation energy Q in solder joints during aging was calculated.

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