Characterization and performance of the planck-LFI flight model passive components

Precise tuning of geometry parameters is an important consideration in the design of modern microwave passive components. It is mandatory due to limitations of theoretical design methods unable to quantify certain phenomena that are important for the operation and performance of the devices (e.g., strong cross-coupling effects in miniaturized layouts). Consequently, the initial designs obtained using analytical or equivalent network models require further adjustment. For reliability reasons, it has to be conducted using electromagnetic (EM) simulation tools, which entails considerable computational expenses whenever conventional numerical optimization algorithms are employed. Accelerating EM-driven design procedures is therefore highly desirable. This work discusses a surrogate-based algorithm for fast design closure and dimension scaling of miniaturized microwave passives. Our approach involves a small database of previously obtained designs as well as two metamodels, an inverse one, employed to yield a high-quality initial design, and the forward surrogate that provides predictions of the system sensitivities. The second model is constructed at the level of response features, which enables a more accurate gradient estimation and leads to improved reliability and a faster convergence of the optimization process. The presented technique is validated using two compact microstrip couplers and benchmarked against the state-of-the-art warm-start optimization frameworks.

Download Full-text

Resistors for High Temperature Applications

Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) ◽

10.4071/2380-4491.2019.hiten.000099 ◽

2019 ◽

Vol 2019 (HiTen) ◽

pp. 000099-000106

Author(s):

Tom Morris

Keyword(s):

Thin Film ◽

High Temperature ◽

Temperature Coefficient ◽

Test Data ◽

Oil And Gas ◽

Tantalum Nitride ◽

Passive Components ◽

Oil And Gas Exploration ◽

And Performance ◽

Temperature Applications

Abstract The use and growth of high temperature electronics in a variety of applications (such as oil and gas exploration and production, automotive under the hood, aerospace and satellite/space to name a few), has necessitated a closer look at the technology used in passive components (such as resistors). A variety of resistor technologies may be suitable for high temperature applications. In the paper information, on thin film technologies (both nichrome and tantalum nitride thin film information is presented), thick film, and wire-wound construction is presented, with discussions regarding their respective characteristics that make them more or less suitable for high temperature and other excessive environments. This paper presents information on resistor construction details, material information and manufacturing processing, along with test data and performance summaries under short and long term high temperature conditions. Additionally, other pertinent test data through typical environmental tests is presented Although resistors and other passive components are often taken for granted, high temperature applications can tax the performance of many resistor types. The proper selection of resistive components will insure that the stability, temperature coefficient (and temperature coefficient tracking for resistor networks), and reliability is maintained to insure reliable circuit performance.

Download Full-text

Design and Performance of Polymeric Ultra-thin Substrates for use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles

MRS Proceedings ◽

10.1557/proc-783-b3.3 ◽

2003 ◽

Vol 783 ◽

Cited By ~ 1

Author(s):

John Andresakis ◽

Takuya Yamamoto ◽

Pranabes Pramanik ◽

Nick Buinno

Keyword(s):

High Speed ◽

Printed Circuit Board ◽

Dielectric Breakdown ◽

Breakdown Strength ◽

Circuit Board ◽

Electrical Performance ◽

Passive Components ◽

Embedded Capacitors ◽

Epoxy Material ◽

And Performance

As CPUs increase in performance, the numbers of passive components on the surface of the boards are increasing dramatically. To reduce the number of components, as well as improve the electrical performance (i.e. reduce inductance), designers are increasingly embedding capacitive layers in the Printed Circuit Board (PCB).The majority of the products in use today utilize reinforced epoxy laminates. These products are relatively easy to handle and provide good electrical performance, but a need exists for even better performance than a fiberglass-reinforced product can produce.Other materials are being developed that are thinner (and thus increase capacitance and reduce inductance), but either have problems with dielectric breakdown strength, handling or only marginal improvements over the reinforced epoxy material. A need exists for an ultra-thin (less than 25 micron) material that not only provides improved electrical performance, but can be readily manufactured using standard PCB processing.We will discuss the design criteria we used for developing our family of products, as well as the results. The design of the conductor (copper foil) has been determined to be as critical as the properties of the dielectric (polymer). Examination of the effect of loading the polymer with High Dk ferroelectric particles will also be examined.The products have been through both internal and external testing and are compared to existing and developing capacitor materials. We will describe the electrical as well as the processing characteristics in detail, and how these types of products can greatly improve performance of high-speed systems

Download Full-text

Development and Performance Validation of Thermal Control Subsystem for Earth Observation Small Satellite Flight Model

Journal of the Korean Society for Aeronautical & Space Sciences ◽

10.5139/jksas.2008.36.12.1222 ◽

2008 ◽

Vol 36 (12) ◽

pp. 1222-1228

Keyword(s):

Thermal Control ◽

Earth Observation ◽

Small Satellite ◽

Control Subsystem ◽

And Performance ◽

Performance Validation ◽

Flight Model

Download Full-text

MIRI-JWST spectrometer main optics flight model realization and performance test results

10.1117/12.858825 ◽

2010 ◽

Author(s):

Gabby Kroes ◽

Ad Oudenhuysen ◽

Menno de Haan ◽

Rieks Jager ◽

Evert Pauwels

Keyword(s):

Performance Test ◽

Test Results ◽

And Performance ◽

Flight Model

Download Full-text

Transmission Scanning Electron Microscopy and Energy Analysis with the Siemens ELMISKOP 101

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100095509 ◽

1972 ◽

Vol 30 ◽

pp. 450-451

Author(s):

H. M. Thieringer

Keyword(s):

Objective Lens ◽

Transmission Microscopy ◽

Image Recording ◽

Mode Of Operation ◽

Scanning Transmission ◽

Electron Microscopes ◽

And Performance ◽

Convergent Beam ◽

Ray Path ◽

Beam Diffraction

It has repeatedly been show that with conventional electron microscopes very fine electron probes can be produced, therefore allowing various micro-techniques such as micro recording, X-ray microanalysis and convergent beam diffraction. In this paper the function and performance of an SIEMENS ELMISKOP 101 used as a scanning transmission microscope (STEM) is described. This mode of operation has some advantages over the conventional transmission microscopy (CTEM) especially for the observation of thick specimen, in spite of somewhat longer image recording times.Fig.1 shows schematically the ray path and the additional electronics of an ELMISKOP 101 working as a STEM. With a point-cathode, and using condensor I and the objective lens as a demagnifying system, an electron probe with a half-width ob about 25 Å and a typical current of 5.10-11 amp at 100 kV can be obtained in the back focal plane of the objective lens.

Download Full-text

Angular Resolved Electron Spectroscopy with Parallel Recording

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100135459 ◽

1990 ◽

Vol 48 (2) ◽

pp. 370-371

Author(s):

Huang Min ◽

P.S. Flora ◽

C.J. Harland ◽

J.A. Venables

Keyword(s):

Electron Spectroscopy ◽

Low Voltage ◽

Solid Angle ◽

Detection System ◽

Voltage Electron ◽

Cylindrical Mirror ◽

Inner Radius ◽

Channel Plate ◽

And Performance ◽

Type Detector

A cylindrical mirror analyser (CMA) has been built with a parallel recording detection system. It is being used for angular resolved electron spectroscopy (ARES) within a SEM. The CMA has been optimised for imaging applications; the inner cylinder contains a magnetically focused and scanned, 30kV, SEM electron-optical column. The CMA has a large inner radius (50.8mm) and a large collection solid angle (Ω > 1sterad). An energy resolution (ΔE/E) of 1-2% has been achieved. The design and performance of the combination SEM/CMA instrument has been described previously and the CMA and detector system has been used for low voltage electron spectroscopy. Here we discuss the use of the CMA for ARES and present some preliminary results.The CMA has been designed for an axis-to-ring focus and uses an annular type detector. This detector consists of a channel-plate/YAG/mirror assembly which is optically coupled to either a photomultiplier for spectroscopy or a TV camera for parallel detection.

Download Full-text

Novel epoxy/anhydride alternatives for biological electron microscopy: Physical and performance characteristis of embed 812 and LX 112 in combination with NSA/NMA/DMAE

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100156985 ◽

1989 ◽

Vol 47 ◽

pp. 1000-1001

Author(s):

Joe A. Mascorro ◽

Gerald S. Kirby

Keyword(s):

Electron Microscopy ◽

Flow Rate ◽

Succinic Anhydride ◽

Volume Flow Rate ◽

Mass Density ◽

Uranyl Acetate ◽

Volume Flow ◽

Base Resin ◽

And Performance ◽

Acid Anhydrides

Embedding media based upon an epoxy resin of choice and the acid anhydrides dodecenyl succinic anhydride (DDSA), nadic methyl anhydride (NMA), and catalyzed by the tertiary amine 2,4,6-Tri(dimethylaminomethyl) phenol (DMP-30) are widely used in biological electron microscopy. These media possess a viscosity character that can impair tissue infiltration, particularly if original Epon 812 is utilized as the base resin. Other resins that are considerably less viscous than Epon 812 now are available as replacements. Likewise, nonenyl succinic anhydride (NSA) and dimethylaminoethanol (DMAE) are more fluid than their counterparts DDSA and DMP- 30 commonly used in earlier formulations. This work utilizes novel epoxy and anhydride combinations in order to produce embedding media with desirable flow rate and viscosity parameters that, in turn, would allow the medium to optimally infiltrate tissues. Specifically, embeding media based on EmBed 812 or LX 112 with NSA (in place of DDSA) and DMAE (replacing DMP-30), with NMA remaining constant, are formulated and offered as alternatives for routine biological work.Individual epoxy resins (Table I) or complete embedding media (Tables II-III) were tested for flow rate and viscosity. The novel media were further examined for their ability to infilftrate tissues, polymerize, sectioning and staining character, as well as strength and stability to the electron beam and column vacuum. For physical comparisons, a volume (9 ml) of either resin or media was aspirated into a capillary viscocimeter oriented vertically. The material was then allowed to flow out freely under the influence of gravity and the flow time necessary for the volume to exit was recored (Col B,C; Tables). In addition, the volume flow rate (ml flowing/second; Col D, Tables) was measured. Viscosity (n) could then be determined by using the Hagen-Poiseville relation for laminar flow, n = c.p/Q, where c = a geometric constant from an instrument calibration with water, p = mass density, and Q = volume flow rate. Mass weight and density of the materials were determined as well (Col F,G; Tables). Infiltration schedules utilized were short (1/2 hr 1:1, 3 hrs full resin), intermediate (1/2 hr 1:1, 6 hrs full resin) , or long (1/2 hr 1:1, 6 hrs full resin) in total time. Polymerization schedules ranging from 15 hrs (overnight) through 24, 36, or 48 hrs were tested. Sections demonstrating gold interference colors were collected on unsupported 200- 300 mesh grids and stained sequentially with uranyl acetate and lead citrate.

Download Full-text

Trace nanoanalysis

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100172437 ◽

1994 ◽

Vol 52 ◽

pp. 940-941

Author(s):

D. E. Newbury ◽

R. D. Leapman

Keyword(s):

High Performance ◽

Secondary Ion Mass Spectrometry ◽

Detection Efficiency ◽

Volume Element ◽

And Performance ◽

Trace Constituents ◽

Secondary Ion ◽

Concentration Levels ◽

Structure Properties

Trace constituents, which can be very loosely defined as those present at concentration levels below 1 percent, often exert influence on structure, properties, and performance far greater than what might be estimated from their proportion alone. Defining the role of trace constituents in the microstructure, or indeed even determining their location, makes great demands on the available array of microanalytical tools. These demands become increasingly more challenging as the dimensions of the volume element to be probed become smaller. For example, a cubic volume element of silicon with an edge dimension of 1 micrometer contains approximately 5×1010 atoms. High performance secondary ion mass spectrometry (SIMS) can be used to measure trace constituents to levels of hundreds of parts per billion from such a volume element (e. g., detection of at least 100 atoms to give 10% reproducibility with an overall detection efficiency of 1%, considering ionization, transmission, and counting).

Download Full-text