Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration

2009 ◽  
Author(s):  
W.H. Teh ◽  
R. Caramto ◽  
S. Arkalgud ◽  
T. Saito ◽  
K. Maruyama ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Through Silicon Vias ◽  
Capacitively Coupled ◽  
Wafer Scale ◽  
Capacitively Coupled Plasma ◽  
Silicon Vias

Reduction of particle generation in capacitively coupled plasma etching reactor

2007 ◽  
Author(s):  
Kotaro Horikoshi ◽  
Taichi Hayamizu ◽  
Motohiro Hirano ◽  
Ko Sasaki ◽  
Makoto Nagano ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Capacitively Coupled ◽  
Particle Generation ◽  
Capacitively Coupled Plasma

Erosion of focus rings in capacitively coupled plasma etching reactors

2021 ◽  
Vol 39 (6) ◽  
pp. 063002
Author(s):  
Xifeng Wang ◽  
Hyunjae Lee ◽  
Sang Ki Nam ◽  
Mark J. Kushner
Keyword(s):  
Plasma Etching ◽  
Capacitively Coupled ◽  
Capacitively Coupled Plasma

Effect of Process Gases on Fabricating Tapered Through-Silicon vias by Continuous SF6/O2/Ar Plasma Etching

2012 ◽  
Vol 1 (3) ◽  
pp. P107-P116 ◽  
Author(s):  
Pradeep Dixit ◽  
Sami Vähänen ◽  
Jaakko Salonen ◽  
Philippe Monnoyer
Keyword(s):  
Plasma Etching ◽  
Through Silicon Vias ◽  
Process Gases ◽  
Ar Plasma ◽  
Silicon Vias
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