Time-Resolved Measurement of Charging on Hole Bottoms of SiO2Wafer Exposed to Plasma Etching in a Pulsed Two-Frequency Capacitively Coupled Plasma

Japanese Journal of Applied Physics ◽

10.1143/jjap.44.l1105 ◽

2005 ◽

Vol 44 (No. 35) ◽

pp. L1105-L1108 ◽

Author(s):

Takeshi Ohmori ◽

Takeshi Kamata Goto ◽

Takeshi Kitajima ◽

Toshiaki Makabe

Keyword(s):

Plasma Etching ◽

Time Resolved ◽

Capacitively Coupled ◽

Capacitively Coupled Plasma

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The time-resolved two-dimensional profile of a radiofrequency capacitively coupled plasma

Journal of Physics D Applied Physics ◽

10.1088/0022-3727/30/12/015 ◽

1997 ◽

Vol 30 (12) ◽

pp. 1783-1789 ◽

Author(s):

T Kitajima ◽

M Izawa ◽

N Nakano ◽

T Makabe

Keyword(s):

Two Dimensional ◽

Time Resolved ◽

Capacitively Coupled ◽

Capacitively Coupled Plasma

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Reduction of particle generation in capacitively coupled plasma etching reactor

2007 International Symposium on Semiconductor Manufacturing ◽

10.1109/issm.2007.4446859 ◽

2007 ◽

Author(s):

Kotaro Horikoshi ◽

Taichi Hayamizu ◽

Motohiro Hirano ◽

Ko Sasaki ◽

Makoto Nagano ◽

...

Keyword(s):

Plasma Etching ◽

Capacitively Coupled ◽

Particle Generation ◽

Capacitively Coupled Plasma

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Negative charge injection to a positively charged SiO2 hole exposed to plasma etching in a pulsed two-frequency capacitively coupled plasma in CF4/Ar

Applied Physics Letters ◽

10.1063/1.1630163 ◽

2003 ◽

Vol 83 (22) ◽

pp. 4637-4639 ◽

Author(s):

T. Ohmori ◽

T. K. Goto ◽

T. Kitajima ◽

T. Makabe

Keyword(s):

Plasma Etching ◽

Negative Charge ◽

Charge Injection ◽

Capacitively Coupled ◽

Capacitively Coupled Plasma ◽

Positively Charged

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Erosion of focus rings in capacitively coupled plasma etching reactors

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ◽

10.1116/6.0001225 ◽

2021 ◽

Vol 39 (6) ◽

pp. 063002

Author(s):

Xifeng Wang ◽

Hyunjae Lee ◽

Sang Ki Nam ◽

Mark J. Kushner

Keyword(s):

Plasma Etching ◽

Capacitively Coupled ◽

Capacitively Coupled Plasma

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Infinitely high etch selectivity during CH2F2/H2 dual-frequency capacitively coupled plasma etching of silicon nitride to chemical vapor-deposited a-C

Journal of Vacuum Science & Technology A Vacuum Surfaces and Films ◽

10.1116/1.3430551 ◽

2010 ◽

Vol 28 (4) ◽

pp. 755-760 ◽

Author(s):

J. S. Kim ◽

B. S. Kwon ◽

W. Heo ◽

C. R. Jung ◽

J. S. Park ◽

...

Keyword(s):

Silicon Nitride ◽

Plasma Etching ◽

Chemical Vapor ◽

Dual Frequency ◽

Capacitively Coupled ◽

Chemical Vapor Deposited ◽

Capacitively Coupled Plasma

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Effect of high-frequency variation on ArF photoresist deformation during superimposed dual frequency (DFS) capacitively coupled plasma etching

Digest of Papers. 2004 International Microprocesses and Nanotechnology Conference, 2004. ◽

10.1109/imnc.2004.245789 ◽

2004 ◽

Author(s):

D.H. Kim ◽

S.H. Cho ◽

N.-E. Lee

Keyword(s):

Plasma Etching ◽

High Frequency ◽

Frequency Variation ◽

Dual Frequency ◽

Capacitively Coupled ◽

Capacitively Coupled Plasma

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Magnetically-enhanced capacitively-coupled plasma etching for 300 mm wafer-scale fabrication of Cu through-silicon-vias for 3D logic integration

2009 IEEE International Interconnect Technology Conference ◽

10.1109/iitc.2009.5090338 ◽

2009 ◽

Author(s):

W.H. Teh ◽

R. Caramto ◽

S. Arkalgud ◽

T. Saito ◽

K. Maruyama ◽

...

Keyword(s):

Plasma Etching ◽

Through Silicon Vias ◽

Capacitively Coupled ◽

Wafer Scale ◽

Capacitively Coupled Plasma ◽

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Auto-Masked Surface Texturing of Kerf-Loss Free Silicon Wafers Using Hexafluoroisopropanol in a Capacitively Coupled Plasma Etching System

ECS Journal of Solid State Science and Technology ◽

10.1149/2.0091904jss ◽

2019 ◽

Vol 8 (4) ◽

pp. Q76-Q79

Author(s):

Suhyun Kim ◽

Jin-Su Park ◽

Jun-Hyun Kim ◽

Chang-Koo Kim ◽

Jihyun Kim

Keyword(s):

Plasma Etching ◽

Surface Texturing ◽

Silicon Wafers ◽

Capacitively Coupled ◽

Free Silicon ◽

Capacitively Coupled Plasma ◽

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Time-Resolved Electron Energy Distributions and Plasma Characteristics in a Pulsed Capacitively Coupled Plasma

IEEE Transactions on Plasma Science ◽

10.1109/tps.2011.2132743 ◽

2011 ◽

Vol 39 (11) ◽

pp. 2542-2543 ◽

Author(s):

Sang-Heon Song ◽

Mark J. Kushner

Keyword(s):

Electron Energy ◽

Energy Distributions ◽

Time Resolved ◽

Capacitively Coupled ◽

Plasma Characteristics ◽

Capacitively Coupled Plasma

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Dust transport phenomena in a capacitively coupled plasma reactor

Journal of Applied Physics ◽

10.1063/1.1285843 ◽

2001 ◽

Vol 89 (1) ◽

pp. 34-41 ◽

Author(s):

Heon Chang Kim ◽

Vasilios I. Manousiouthakis

Keyword(s):

Plasma Reactor ◽

Transport Phenomena ◽

Capacitively Coupled ◽

Dust Transport ◽

Capacitively Coupled Plasma

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