Compact Lateral Thermal Resistance Model of TSVs for Fast Finite-Difference Based Thermal Analysis of 3-D Stacked ICs

Author(s):  
Zao Liu ◽  
Sahana Swarup ◽  
Sheldon X.-D Tan ◽  
Hai-Bao Chen ◽  
Hai Wang
2020 ◽  
Vol 15 ◽  
pp. 155892501990083
Author(s):  
Xintong Li ◽  
Honglian Cong ◽  
Zhe Gao ◽  
Zhijia Dong

In this article, thermal resistance test and water vapor resistance test were experimented to obtain data of heat and humidity performance. Canonical correlation analysis was used on determining influence of basic fabric parameters on heat and humidity performance. Thermal resistance model and water vapor resistance model were established with a three-layered feedforward-type neural network. For the generalization of the network and the difficulty of determining the optimal network structure, trainbr was chosen as training algorithm to find the relationship between input factors and output data. After training and verification, the number of hidden layer neurons in the thermal resistance model was 12, and the error reached 10−3. In the water vapor resistance model, the number of hidden layer neurons was 10, and the error reached 10−3.


2018 ◽  
Vol 2018 (HiTEC) ◽  
pp. 000028-000031 ◽  
Author(s):  
Fumiki Kato ◽  
Hiroki Takahashi ◽  
Hidekazu Tanisawa ◽  
Kenichi Koui ◽  
Shinji Sato ◽  
...  

Abstract In this paper, we demonstrate that the structural degradation of a silicon carbide (SiC) power module corresponding to thermal cycles can be detected and tracked non-destructively by transient thermal analysis method. The purpose of this evaluation is to analyze the distribution of the thermal resistance in the power module and to identify the structure deterioration part. The power module with SiC-MOSFET were assembled using ZnAl eutectic solder as device under test. The individual thermal resistance of each part such as the SiC-die, the die-attachment, the AMCs, and the baseplate was successfully evaluated by analyzing the structure function graph. A series of thermal cycle test between −40 and 250°C was conducted, and the power modules were evaluated their thermal resistance taken out from thermal cycle test machine at 100, 200, 500 and 1000 cycles. We confirmed the increase in thermal resistance between AMCs and base plate in each thermal cycle. The portion where the thermal resistance increased is in good agreement with the location of the structural defect observed by scanning acoustic tomography (SAT) observation.


Author(s):  
Y Rasihhan ◽  
F J Wallace

A simple, effective and computationally economical piston-liner thermal resistance model for diesel engine simulation is described. In the model, the detailed shape of the piston and its axial movement and interaction with liner nodes are all taken into account. An imaginary node within the piston provides the necessary temperature difference between the piston and the liner nodes for conductive heat transfer, which is expected to reverse its direction with liner insulation. In the liner, an axially symmetric two-dimensional heat-transfer model is used. Later the piston-liner model is tuned for the experimental single cylinder, direct injection, Petter PH 1W engine used at Bath University, against the experimental piston temperature and liner temperature distribution.


2020 ◽  
Vol 32 (4) ◽  
pp. 241-246
Author(s):  
Krzysztof Jakub Stojek ◽  
Jan Felba ◽  
Johann Nicolics ◽  
Dominik Wołczyński

Purpose This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated for non-metallized and metalized semiconductor surfaces. Heat transfer efficiency depends on thermal conductivity; radiation was used to perform thermographic analysis; the convection is energy loss, so its removing might improve measurements accuracy. Design/methodology/approach Investigation of thermal joints analysis method was focused on determination of convection impact on thermal resistance thermographic analysis method. Measuring samples placed in vacuum chamber with lowered pressure requires transparent window for infrared radiation that is used for thermographic analysis. Impact of infrared window and convection on temperature measurements and thermal resistance were referred. Findings The results showed that the silicon window allowed to perform thermal analysis through, and the convection was heat transfer mode which create 15% energy loss. Originality/value It is possible to measure thermal resistance for silver-based thermal joints with convection eliminated to improve measurements accuracy.


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