Coupled Fluid-solid Heat Transfer of A Gas and Liquid Cooling PMSM Including Rotor Rotation

2021 ◽  
pp. 1-1
Author(s):  
Likun Wang ◽  
Yuan Li ◽  
Fabrizio Marignetti ◽  
Aldo Boglietti
Keyword(s):  
Heat Transfer ◽  
Liquid Cooling ◽  
Rotor Rotation

scholarly journals Effect of liquid cooling on PCR performance with the parametric study of cross-section shapes of microchannels

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Yousef Alihosseini ◽  
Mohammad Reza Azaddel ◽  
Sahel Moslemi ◽  
Mehdi Mohammadi ◽  
Ali Pormohammad ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Cross Section ◽  
Cross Sections ◽  
Heat Sink ◽  
Evaluation Criteria ◽  
Circular Cross Section ◽  
Microchannel Heat Sink ◽  
Liquid Cooling ◽  
Maximum Heat ◽  
Maximum Heat Transfer

AbstractIn recent years, PCR-based methods as a rapid and high accurate technique in the industry and medical fields have been expanded rapidly. Where we are faced with the COVID-19 pandemic, the necessity of a rapid diagnosis has felt more than ever. In the current interdisciplinary study, we have proposed, developed, and characterized a state-of-the-art liquid cooling design to accelerate the PCR procedure. A numerical simulation approach is utilized to evaluate 15 different cross-sections of the microchannel heat sink and select the best shape to achieve this goal. Also, crucial heat sink parameters are characterized, e.g., heat transfer coefficient, pressure drop, performance evaluation criteria, and fluid flow. The achieved result showed that the circular cross-section is the most efficient shape for the microchannel heat sink, which has a maximum heat transfer enhancement of 25% compared to the square shape at the Reynolds number of 1150. In the next phase of the study, the circular cross-section microchannel is located below the PCR device to evaluate the cooling rate of the PCR. Also, the results demonstrate that it takes 16.5 s to cool saliva samples in the PCR well, which saves up to 157.5 s for the whole amplification procedure compared to the conventional air fans. Another advantage of using the microchannel heat sink is that it takes up a little space compared to other common cooling methods.

The Effectiveness of the Unit Cell Method in Numerically Modeling and Designing Liquid Cooled Heatsinks

2019 ◽  
Vol 11 (6) ◽  
Author(s):  
Ali C. Kheirabadi ◽  
Dominic Groulx
Keyword(s):  
Heat Transfer ◽  
Wall Temperature ◽  
Parametric Design ◽  
Unit Cell ◽  
Liquid Cooling ◽  
Cell Method ◽  
Numerical Predictions ◽  
Finite Element Package ◽  
Parametric Studies ◽  
Relative Differences

This study compares two numerical strategies for modeling flow and heat transfer through mini- and microchannel heatsinks, the unit cell approximation, and the full 3D model, with the objective of validating the former approach. Conjugate heat transfer and laminar flow through a 2 × 2 cm2 copper–water heatsink are modeled using the finite element package COMSOL Multiphysics 5.0. Parametric studies showed that as the heatsink channels’ widths were reduced, and the total number of channels increased, temperature and pressure predictions from both models converged to similar values. Relative differences as low as 5.4% and 1.6% were attained at a channel width of 0.25 mm for maximum wall temperature and channel pressure drop, respectively. Due to its computational efficiency and tendency to conservatively overpredict temperatures relative to the full 3D method, the unit cell approximation is recommended for parametric design of heatsinks with channels’ widths smaller than 0.5 mm, although this condition only holds for the given heatsink design. The unit cell method is then used to design an optimal heatsink for server liquid cooling applications. The heatsink has been fabricated and tested experimentally, and its thermal performance is compared with numerical predictions. The unit cell method underestimated the maximum wall temperature relative to experimental results by 3.0–14.5% as the flowrate rose from 0.3 to 1.5 gal/min (1.1–5.7 l/min).

Study on Copper Cold Plate Designs for Electronics Liquid Cooling System

2006 ◽  
Author(s):  
Yi. Feng ◽  
Y. Wang ◽  
C. Y. Huang
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Cooling System ◽  
Pure Copper ◽  
Cold Plate ◽  
Performance Limits ◽  
Liquid Cooling ◽  
Cold Plates ◽  
Management Approaches ◽  
Liquid Cooling System

The increasing power consumption of microelectronic systems and the dense layout of semiconductor components leave very limited design spaces with tight constraints for the thermal solution. Conventional thermal management approaches, such as extrusion, fold-fin, and heat pipe heat sinks, are somehow reaching their performance limits, due to the geometry constraints. Currently, more studies have been carried out on the liquid cooling technologies, as the flexible tubing connection of liquid cooling system makes both the accommodation in constrained design space and the simultaneous cooling of multi heating sources feasible. To significantly improve the thermal performance of a liquid cooling system, heat exchangers with more liquid-side heat transfer area with acceptable flow pressure drop are expected. This paper focuses on the performance of seven designs of source heat exchanger (cold plate). The presented cold plates are all made in pure copper material using wire cutting, soldering, brazing, or sintering process. Enhanced heat transfer surfaces such as micro channel and cooper mesh are investigated. Detailed experiments have been conducted to understand the performance of these seven cooper cold plates. The same radiators, fan, and water pump were connected with each cooper cold plate to investigate the overall thermal performance of liquid cooling system. Water temperature readings at the inlets and outlets of radiators, pump, and colder plate have been taken to interpret the thermal resistance distribution along the cooling loop.

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

2019 ◽  
Vol 141 (4) ◽  
Author(s):  
Bharath Ramakrishnan ◽  
Yaser Hadad ◽  
Sami Alkharabsheh ◽  
Paul R. Chiarot ◽  
Bahgat Sammakia
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Thermal Resistance ◽  
High Heat ◽  
High Heat Flux ◽  
Cold Plate ◽  
Liquid Cooling ◽  
Maximum Heat ◽  
Effective Heat ◽  
Cold Plates

Data center energy usage keeps growing every year and will continue to increase with rising demand for ecommerce, scientific research, social networking, and use of streaming video services. The miniaturization of microelectronic devices and an increasing demand for clock speed result in high heat flux systems. By adopting direct liquid cooling, the high heat flux and high power demands can be met, while the reliability of the electronic devices is greatly improved. Cold plates which are mounted directly on to the chips facilitate a lower thermal resistance path originating from the chip to the incoming coolant. An attempt was made in the current study to characterize a commercially available cold plate which uses warm water in carrying the heat away from the chip. A mock package mimicking a processor chip with an effective heat transfer area of 6.45 cm2 was developed for this study using a copper block heater arrangement. The thermo-hydraulic performance of the cold plates was investigated by conducting experiments at varying chip power, coolant flow rates, and coolant temperature. The pressure drop (ΔP) and the temperature rise (ΔT) across the cold plates were measured, and the results were presented as flow resistance and thermal resistance curves. A maximum heat flux of 31 W/cm2 was dissipated at a flow rate of 13 cm3/s. A resistance network model was used to calculate an effective heat transfer coefficient by revealing different elements contributing to the total resistance. The study extended to different coolant temperatures ranging from 25 °C to 45 °C addresses the effect of coolant viscosity on the overall performance of the cold plate, and the results were presented as coefficient of performance (COP) curves. A numerical model developed using 6SigmaET was validated against the experimental findings for the flow and thermal performance with minimal percentage difference.

Application of Micro-Channel Fin for Cold Plate of Liquid Cooling System and Vapor Chamber

2009 ◽  
Author(s):  
Koichi Mashiko ◽  
Masataka Mochizuki ◽  
Yuji Saito ◽  
Yasuhiro Horiuchi ◽  
Thang Nguyen ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Cooling System ◽  
Cold Plate ◽  
Micro Channel ◽  
Vapor Chamber ◽  
Liquid Cooling ◽  
Liquid Cooling System ◽  
Heat Spreading

Recently energy saving is most important concept for all electric products and production. Especially, in Data-Center cooling system, power consumption of current air cooling system is increasing. For not only improving thermal performance but also reducing electric power consumption of this system, liquid cooling system has been developed. This paper reports the development of cold plate technology and vapor chamber application by using micro-channel fin. In case of cold plate application, micro-channel fin technology is good for compact space design, high thermal performance, and easy for design and simulation. Another application is the evaporating surface for vapor chamber. The well-known devices for effective heat transfer or heat spreading with the lowest thermal resistance are heat pipes and vapor chamber, which are two-phase heat transfer devices with excellent heat spreading and heat transfer characteristics. Normally, vapor chamber is composed of sintered power wick. Vapor chamber container is mechanically supported by stamped pedestal or wick column or solid column, but the mechanical strength is not enough strong. So far, the application is limited in the area of low strength assembly. Sometime the mechanical supporting frame is design for preventing deformation. In this paper, the testing result of sample is described that thermal resistance between the heat source and the ambient can be improved approximately 0.1°C/W by using the micro-channel vapor chamber. Additionally, authors presented case designs using vapor chamber for cooling computer processors, and proposed ideas of using micro-channel vapor chamber for heat spreading to replace the traditional metal plate heat spreader.

Bubble Injection to Enhance Heat Transfer in Microchannel Heat Sinks

2009 ◽  
Author(s):  
Amy Rachel Betz ◽  
Daniel Attinger
Keyword(s):  
Heat Transfer ◽  
Nusselt Number ◽  
Single Phase ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Segmented Flow ◽  
Liquid Cooling ◽  
Microchannel Heat Sinks ◽  
Convective Resistance ◽  
Parallel Microchannels

Liquid cooling is an efficient way to remove heat fluxes with magnitude of 1 to 10,000 W/cm2. One limitation of current single-phase microchannel heat sinks is the relatively low Nusselt number, because of laminar flow. In this work, we experimentally investigate how to enhance the Nusselt number in the laminar regime with the periodic injection of non-condensable bubbles in a water-filled array of microchannels in a segmented flow pattern. We designed a polycarbonate heat sink consisting of an array of parallel microchannels with a low ratio of heat to convective resistance, to facilitate the measurement of the Nusselt Number. Our heat transfer and pressure drop measurements are in good agreement with existing correlations, and show that the Nusselt number of a segmented flow is increased by more than a hundred percent over single-phase flow provided the mass velocity is within a given range.

Analysis and Optimization of Flow and Heat Transfer in a Liquid Cooling System for an LED Array

2011 ◽  
Vol 8 (2) ◽  
pp. 72-82
Author(s):  
Samhitha Poonacha ◽  
Basawaraj ◽  
Hemanth Kumar T.R. Seetharam ◽  
K.N. Seetharamu
Keyword(s):  
Heat Transfer ◽  
Cooling System ◽  
Liquid Cooling ◽  
Flow And Heat Transfer ◽  
Led Array ◽  
Liquid Cooling System

The Dynamics of Liquid Cooling in Half-Coil Jackets

2008 ◽  
Vol 3 (1) ◽  
Author(s):  
Jayakumar Natesan Subramanian ◽  
Farouq S. Mjalli
Keyword(s):  
Heat Transfer ◽  
Experimental Data ◽  
Mathematical Model ◽  
Liquid Temperature ◽  
Liquid Cooling ◽  
Shell Side ◽  
Stirred Vessel ◽  
Model Predictions ◽  
Temperature Dynamics ◽  
The Heat Transfer Coefficient

The heat transfer cooling of a hot liquid in a stirred vessel has been studied experimentally with coolant flowing through a half-coil around the vessel. Correlations have been developed for the heat transfer coefficient of the half coil jacket. A mathematical model for the half coil jacket liquid temperature dynamics and its analytical solution is used to find the shell side temperature profile as a function of time. It is found that the model predictions are in satisfactory agreement with the experimental data and that the developed correlation is superior to previously published correlations for similar systems.

Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling

2012 ◽  
Author(s):  
Gongnan Xie ◽  
Yanquan Liu ◽  
Bengt Sunden ◽  
Weihong Zhang ◽  
Jun Zhao
Keyword(s):  
Heat Transfer ◽  
Double Layer ◽  
Pressure Loss ◽  
Heat Dissipation ◽  
Thermal Characteristics ◽  
Parallel Flow ◽  
Air Cooling ◽  
Pumping Power ◽  
Liquid Cooling ◽  
Counter Flow

The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to manage the increase of the dissipated heat. The traditional air-cooling may not meet the requirements, and therefore a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid, but these microchannels are often designed to be single-layer channels. In this paper, the laminar heat transfer and pressure loss in a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flowrates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics, and the parallel-flow layout is found to be better for heat dissipation when the pumping power is limited, while the counter-flow layout is better when a high pumping power is provided.

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