Optimization Method for Heat Dissipation Micro-Channel of 3D System in a Package

2019 ◽  
Author(s):  
Weiyuan Guo ◽  
Junli Xie ◽  
Yunxia Xiong
Keyword(s):  
Heat Dissipation ◽  
Optimization Method ◽  
Micro Channel

scholarly journals Targeted cooling with CVD diamond and micro-channel to meet 3-D IC heat dissipation challenge

2012 ◽  
Author(s):  
Aftab Alam Khan ◽  
Shabaz Basheer Patel ◽  
Divanshu Chaturvedi ◽  
Ashudeb Dutta ◽  
Shivgovind Singh
Keyword(s):  
Heat Dissipation ◽  
Cvd Diamond ◽  
Micro Channel

Design and Tests of a Water-Cooling Micro-Channel Heat Sink Made by WEDM

2012 ◽  
Vol 459 ◽  
pp. 609-614
Author(s):  
Kuo Zoo Liang ◽  
A Cheng Wang ◽  
Chun Ho Liu ◽  
Lung Tasi ◽  
Yan Cherng Lin
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Electrical Discharge ◽  
Heat Dissipation ◽  
Electrical Discharge Machining ◽  
Input Power ◽  
Wire Electrical Discharge Machining ◽  
Micro Channel ◽  
Water Cooling ◽  
Computer Aided

The purpose of this research is to design a new heat sink of water-cooling. With the aid of CAE (computer aided engineering), WEDM (wire electrical discharge machining), and the concept of micro-channel design, a heat sink of water-cooling can then be built with the merit of a smaller volume and lower thermal resistance. From this paper, results of the experiment indicate that the thermal resistance of heat sink can be decreased to 0.12 °C/W with input power of 60W, flow rate of 0.6 LPM, and a better heat dissipation with the in input power of 100W or 140W can be revealed.

Experimental study of the heat dissipation of battery with a manifold micro-channel heat sink

2019 ◽  
Vol 163 ◽  
pp. 114330 ◽  
Author(s):  
Minqiang Pan ◽  
Xineng Zhong ◽  
Guanping Dong ◽  
Pingnan Huang
Keyword(s):  
Experimental Study ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Micro Channel

scholarly journals Effect of the position of parallelogram ribs in micro channel on heat transfer using diamond nanoparticles

10.30544/537 ◽  
2020 ◽  
Author(s):  
Kamel Chadi ◽  
Nourredine Belghar ◽  
Mokhtar Falek ◽  
Zied Driss ◽  
Belhi Guerira
Keyword(s):  
Reynolds Number ◽  
Heat Dissipation ◽  
Constant Heat Flux ◽  
The Other ◽  
Three Dimensions ◽  
Micro Channel ◽  
Electronic Components ◽  
Thermal Exchange ◽  
First Case ◽  
The Impact

In the present work, we have studied numerically three dimensions, the impact of the position of parallelogram ribs in a micro-channel on thermal exchange. In this study, we proposed three cases of micro-channel heat sinks with parallelogram ribs. As well as one case without ribs, in each of the three cases, we varied the parallelogram rib positions on the micro-channel. The main purpose of this study is to find the best position for parallelograms ribs in which the heat dissipation is useful for improving the thermal performance of the micro-channel as well as improving the cooling of electronic components. We have chosen silicon micro-channel drains for four cases. Constant heat flux is applied to the bottom surfaces and using a nanofluid diamond-water with 5% volume concentration of diamond nanoparticle as a coolant. The simulation has been carried out using the commercial software ANSYS-Fluent. Reynolds number (Re) has been taken between 200 and 400 with the corresponding inlet velocity from 1.53 m/s to 3.01 m/s, and the flow regime has been assumed to be stationary. The numerical results show that the parallelogram ribs position of the micro-channel in the second case gave an improvement in heat exchange, where the Nusselt number is higher than in the other cases, and showed a reduction in the temperature of the heated bottom wall compared to the other cases. Also, the micro-channel shape in the second case can be used to cool the electronic components. The results also showed that with increasing Reynolds number (Re), the friction factor of the micro-channel decreases in all cases. At the same time, we find the lowest value of the thermal resistance in the second case and the biggest value in the first case, base micro-channel without ribs.

Thermal analysis and optimization for a ball grid array package

2005 ◽  
Vol 219 (4) ◽  
pp. 381-393 ◽  
Author(s):  
C-I Ho ◽  
T-C Hung ◽  
C-I Hung
Keyword(s):  
Thermal Resistance ◽  
Heat Dissipation ◽  
Ball Grid Array ◽  
Optimization Method ◽  
Heat Transfer Analysis ◽  
Bga Packages ◽  
Solder Balls ◽  
Bga Package ◽  
Computational Fluid Dynamics Cfd ◽  
Artificial Neural Network Ann

In this study, a computational fluid dynamics (CFD) approach is employed for heat transfer analysis of a ball grid array (BGA) package that is widely used in the modern electronics industry. Owing to the complicated geometric configuration of the BGA package, the submodel approach is used to investigate in detail the temperature distributions of thermal vias and solder balls. The effective thermal resistance of a BGA package has been successfully obtained from numerical simulations. An artificial neural network (ANN) is trained to establish the relationship between the geometry input and the thermal resistance output. The well-trained network is then coupled with the complex optimization method to search for the optimum design of the BGA package to achieve the lowest thermal resistance. The results of this study provide the electronic packaging industry with a reliable and rapid method for heat dissipation design of BGA packages.

A Micro-channel Cooling Model For a Three-dimensional Integrated Circuit Considering Through-silicon Vias

2020 ◽  
Vol 12 ◽  
Author(s):  
Kang-Jia Wang ◽  
Hong-Chang Sun ◽  
Kui-Zhi Wang
Keyword(s):  
Integrated Circuit ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Micro Channel ◽  
3D Ic ◽  
Through Silicon Vias ◽  
3D Ics ◽  
Three Dimensional Integrated Circuit ◽  
Silicon Vias ◽  
Cooling Model

Background: With the increase of the integration degree of the three-dimensional integrated circuit(3D IC), the thermal power consumption per unit volume increases greatly, which makes the chip temperature rise. High temperature could affect the performance of the devices and even lead to thermal failure. So, the thermal management for 3D ICs is becoming a major concern. Objective: The aim of the research is to establish a micro-channel cooling model for a three-dimensional integrated circuit(3D IC) considering the through-silicon vias(TSVs). Methods: By studying the structure of the TSVs, the equivalent thermal resistance of each layer is formulated. Then the one-dimensional micro-channel cooling thermal analytical model considering the TSVs was proposed and solved by the existing sparse solvers such as KLU. Results: The results obtained in this paper reveal that the TSVs can effectively improve the heat dissipation, and its maximal temperature reduction is about 10.75%. The theoretical analysis is helpful to optimize the micro-channel cooling system for 3D ICs. Conclusion: The TSV has an important influence on the heat dissipation of 3D IC, which can improve its heat dissipation characteristic

Liquid Metal Based Mini/Micro Channel Cooling Device

2009 ◽  
Author(s):  
Yue-Guang Deng ◽  
Jing Liu ◽  
Yi-Xin Zhou
Keyword(s):  
Heat Transfer ◽  
Liquid Metal ◽  
Heat Dissipation ◽  
Convective Heat Transfer Coefficient ◽  
Volume Flow ◽  
Micro Channel ◽  
Cooling Device ◽  
Heat Transfer Theory ◽  
Cooling Devices ◽  
Cooling Effects

Effective heat dissipation is of great importance in many engineering fields. In this paper, we investigated a newly emerging method to significantly improve the cooling capability of micro channel devices, through implementing liquid metal with low melting point as the powerful coolant. A series of experiments with different working fluids and volume flow were performed, and the different cooling effects between liquid metal and water were compared. In order to better evaluate the cooling capability of liquid metal based micro channel cooling device, the hydrodynamic and heat transfer theory involved was discussed. The results indicated that, when the system operated in a relatively high velocity, micro channel cooling devices with liquid metal as coolant could produce higher convective heat transfer coefficient compared to those with traditional cooling fluids. And under the same pump power, not only the thermal resistance of liquid metal based micro channel could be much smaller, but also the coolant volume flow could be decreased. What is more, the liquid metal can be driven by a highly efficient electromagnetic pump without any noise. Therefore, more compact and energy-saving micro channel cooling devices with better cooling capability may come into reality. This new method is rather practical, and is expected to be important for realizing an extremely high heat dissipation rate.

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