Characteristics of Flow Boiling Oscillations in Silicon Microchannel Heat Sinks

2007 ◽  
Vol 129 (10) ◽  
pp. 1341-1351 ◽  
Author(s):  
R. Muwanga ◽  
I. Hassan ◽  
R. MacDonald
Keyword(s):  
Heat Sink ◽  
Flow Boiling ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Working Fluid ◽  
Inlet Temperature ◽  
Outlet Temperature ◽  
Standard Heat ◽  
Flow Oscillations ◽  
Footprint Area

Flow boiling oscillation characteristics in two silicon microchannel heat sink configurations are presented. One is a standard heat sink with 45 straight parallel channels, whereas the second is similar except with cross-linked paths at three locations. Data are presented over a flow range of 20–50ml∕min(91–228kg∕(m2s)) using distilled water as the working fluid. The heat sinks have a footprint area of 3.5cm2 and contain 269μm wide by 283μm deep reactive ion etching channels. Flow oscillations are found to be similar in characteristic trends between the two configurations, showing a decreasing frequency with increasing heat flux. The oscillation amplitudes are relatively large and identical in frequency for the inlet temperature, outlet temperature, inlet pressure, and pressure drop. Oscillation properties for the standard heat sink at two different inlet temperatures and various flow rates are correlated for different heat fluxes. This work additionally presents a first glimpse of the cross-linked heat sink performance under flow boiling instability conditions.

Flow Boiling Heat Transfer in a Silicon Microchannel Heat Sink Using Liquid Crystal Thermography

2008 ◽  
Author(s):  
Ayman Megahed ◽  
Ibrahim Hassan ◽  
Tariq Ahmad
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Microchannel Heat Sink

The present study focuses on the experimental investigation of boiling heat transfer characteristics and pressure drop in a silicon microchannel heat sink. The microchannel heat sink consists of a rectangular silicon chip in which 45 rectangular microchannels were chemically etched with a depth of 295 μm, width of 254 μm, and a length of 16 mm. Un-encapsulated Thermochromic liquid Crystals (TLC) are used in the present work to enable nonintrusive and high spatial resolution temperature measurements. This measuring technique is used to provide accurate full and local surface-temperature and heat transfer coefficient measurements. Experiments are carried out for mass velocities ranging between 290 to 457 kg/m2.s and heat fluxes from 6.04 to 13.06 W/cm2 using FC-72 as the working fluid. Experimental results show that the pressure drop increases as the exit quality and the flow rate increase. High values of heat transfer coefficient can be obtained at low exit quality (xe < 0.2). However, the heat transfer coefficient decreases sharply and remains almost constant as the quality increases for an exit quality higher than 0.2.

scholarly journals Optimal design of subcooled triangular microchannel heat sink exchangers with variable heat loads for high performance cooling

2021 ◽  
Vol 2116 (1) ◽  
pp. 012052
Author(s):  
David Olugbenga Ariyo ◽  
Tunde Bello-Ochende
Keyword(s):  
Heat Sink ◽  
High Performance ◽  
Flow Boiling ◽  
High Heat ◽  
Geometric Optimization ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Subcooled Flow Boiling ◽  
Subcooled Flow ◽  
Microchannel Heat Sinks

Abstract Deionized water at a temperature of 25 °C was used as the cooling fluid and aluminium as the heat sink material in the geometric optimization and parameter modelling of subcooled flow boiling in horizontal equilateral triangular microchannel heat sinks. The thermal resistances of the microchannels were minimized subject to fixed volume constraints of the heat sinks and microchannels. A computational fluid dynamics (CFD) ANSYS code used for both the simulations and the optimizations was validated by the available experimental data in the literature and the agreement was good. Fixed heat fluxes between 100 and 500 W/cm2 and velocities between 0.1 and 7.0 m/s were used in the study. Despite the relatively high heat fluxes in this study, the base temperatures of the optimal microchannel heat sinks were within the acceptable operating range for modern electronics. The pumping power requirements for the optimal microchannels are low, indicating that they can be used in the cooling of electronic devices.

Boiling Heat Transfer Performance in a Spiraling Radial Inflow Microchannel Cold Plate

2015 ◽  
Author(s):  
Maritza Ruiz ◽  
Claire M. Kunkle ◽  
Jorge Padilla ◽  
Van P. Carey
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
Contact Angles ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Maximum Heat ◽  
Flow Boiling Heat Transfer

This study presents an experimental exploration of flow boiling heat transfer in a spiraling radial inflow microchannel heat sink. The effect of surface wettability, fluid subcooling levels, and mass fluxes are considered in this type of heat sink for use in applications with high fluxes up to 300 W/cm2. The design of the heat sink provides an inward radial swirl flow between parallel, coaxial disks that form a microchannel of 300 μm and 1 cm radius with a single inlet and a single outlet. The channel is heated on one side through a copper conducting surface, while the opposite side is essentially adiabatic to simulate a heat sink scenario for electronics cooling. Flow boiling heat transfer and pressure drop data were obtained for this heat sink device using water at near atmospheric pressure as the working fluid for inlet subcooling levels from 20 to 81°C and mean mass flux levels ranging from 184 to 716 kg/m2s. To explore the effects of varying surface wetting, experiments were conducted with two different heated surfaces. One was a clean, machined copper surface with water equilibrium contact angles in the range of 14–40°, typical of common metal surfaces. The other was a surface coated with zinc oxide nanostructures that are superhydrophilic with equilibrium contact angles measured below 10°. During boiling, increased wettability resulted in quicker rewetting and smaller bubble departure diameter as indicated by reduced temperature oscillations during boiling and achieving higher maximum heat flux without dryout. Reducing inlet subcooling levels was also found to reduce the magnitude of oscillations in the oscillatory boiling regime. The highest heat transfer coefficients were seen in fully developed boiling with low subcooling levels as a result of heat transfer being dominated by nucleate boiling. The highest heat fluxes achieved were during partial subcooled flow boiling at 300 W/cm2 with an average surface temperature of 134 °C and requiring a pumping power to heat rate ratio of 0.01%. The hydrophilic surface retained wettability after a series of boiling tests. Recommendations for use of this heat sink design in high flux applications is also discussed.

A Compact Integrated Thermosyphon Heat Sink for Power Electronics Cooling

2019 ◽  
Author(s):  
Ahmed Elkholy ◽  
Roger Kempers
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Flow Boiling ◽  
Electronics Cooling ◽  
Heat Pipes ◽  
Heat Sinks ◽  
Working Fluid ◽  
Convection Heat ◽  
Two Phase ◽  
Spreading Resistance

Abstract The trend in miniaturization of power electronic components requires the development of new robust and passive cooling methods to meet increased heat flux demands. Conventional heat sinks encounter inherent shortcomings due to heat spreading resistance of the heat sink baseplate particularly in natural convection heat sinks used to cool small localized heat sources. Heat pipes embedded within the base of heat sinks can be used to improve spreading performance but are limited by the ability to conduct heat into and out of the heat pipes. In the current study, a small, naturally aspirated two-phase thermosyphon heat sink was developed and characterized experimentally. The proposed architecture integrates all thermosyphon components into one compact device, where the evaporator, riser and the downcomer are incorporated at the heat sink base. The downcomer also serves as the condenser within the base of a vertical finned natural convection heat sink. The side-heated evaporator consists of an array mini-channels configuration which can operate in either pool boiling or flow boiling configuration, which allows the thermosyphon heat sink to operate in either reflux mode or looped mode, respectively. Experiments were carried out using HFE 7000 as the working fluid. The effect of the of input power on the thermal performance is examined for both modes for powers ranging from 10 to 80 W. Results demonstrate that this approach significantly reduces the spreading resistance resulting in a net improvement which can be traded-off for a decrease the overall size or weight of the heat sink.

Heat Transfer to Supercritical Water in Vertical Annular Channel and 3-Rod Bundle

2009 ◽  
Author(s):  
V. G. Razumovskiy ◽  
Eu. N. Pis’mennyy ◽  
A. Eu. Koloskov ◽  
I. L. Pioro
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Supercritical Water ◽  
Annular Channel ◽  
Heat Fluxes ◽  
Inlet Temperature ◽  
Outlet Temperature ◽  
Rod Bundle ◽  
Temperature Regimes ◽  
Outside Diameter

The results of heat transfer to supercritical water flowing upward in a vertical annular channel (1-rod channel) and tight 3-rod bundle consisting of the tubes of 5.2-mm outside diameter and 485-mm heated length are presented. The heat-transfer data were obtained at pressures of 22.5, 24.5, and 27.5 MPa, mass flux within the range from 800 to 3000 kg/m2·s, inlet temperature from 125 to 352°C, outlet temperature up to 372°C and heat flux up to 4.6 MW/m2 (heat flux rate up to 2.5 kJ/kg). Temperature regimes of the annular channel and 3-rod bundle were stable and easily reproducible within the whole range of the mass and heat fluxes, even when a deteriorated heat transfer took place. The data resulted from the study could be applicable for a reference estimation of heat transfer in future designs of fuel bundles.

Hydoroil-Based Micro Pin Fin Heat Sink

2006 ◽  
Author(s):  
Ali Kosar ◽  
Chih-Jung Kuo ◽  
Yoav Peles
Keyword(s):  
Heat Sink ◽  
Hydraulic Performance ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Nusselt Numbers ◽  
Friction Factors ◽  
Pin Fins ◽  
Micro Pin Fins

An experimental study on thermal-hydraulic performance of de-ionized water over a bank of shrouded NACA 66-021 hydrofoil micro pin fins with wetted perimeter of 1030-μm and chord thickness of 100 μm has been performed. Average heat transfer coefficients have been obtained over effective heat fluxes ranging from 4.0 to 308 W/cm2 and mass velocities from 134 to 6600 kg/m2s. The experimental data is reduced to the Nusselt numbers, Reynolds numbers, total thermal resistances, and friction factors in order to determine the thermal-hydraulic performance of the heat sink. It has been found that prodigious hydrodynamic improvement can be obtained with the hydrofoil-based micro pin fin heat sink compared to the circular pin fin device. Fluid flow over pin fin heat sinks comprised from hydrofoils yielded radically lower thermal resistances than circular pin fins for a similar pressure drop.

Two-Phase Flow in Microchannels

2001 ◽  
Author(s):  
G. Hetsroni ◽  
A. Mosyak ◽  
Z. Segal
Keyword(s):  
Heat Sink ◽  
High Speed ◽  
Single Phase ◽  
Flow Boiling ◽  
Electronics Cooling ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Two Phase ◽  
Infrared Radiometry ◽  
Phase Water

Abstract Experimental investigation of a heat sink for electronics cooling is performed. The objective is to keep the operating temperature at a relatively low level of about 323–333K, while reducing the undesired temperature variation in both the streamwise and transverse directions. The experimental study is based on systematic temperature, flow and pressure measurements, infrared radiometry and high-speed digital video imaging. The heat sink has parallel triangular microchannels with a base of 250μm. According to the objectives of the present study, Vertrel XF is chosen as the working fluid. Experiments on flow boiling of Vertrel XF in the microchannel heat sink are performed to study the effect of mass velocity and vapor quality on the heat transfer, as well as to compare the two-phase results to a single-phase water flow.

scholarly journals Cooling Performance of Heat Sinks Used in Electronic Devices

2018 ◽  
Vol 171 ◽  
pp. 02003
Author(s):  
Ibrahim Mjallal ◽  
Hussein Farhat ◽  
Mohammad Hammoud ◽  
Samer Ali ◽  
Ali AL Shaer ◽  
...  
Keyword(s):  
Heat Sink ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Passive Cooling ◽  
Short Term ◽  
Cooling Systems ◽  
Thermal Output ◽  
Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel

2018 ◽  
Author(s):  
Kan Zhou ◽  
Junye Li ◽  
Zhao-zan Feng ◽  
Wei Li ◽  
Hua Zhu ◽  
...  
Keyword(s):  
Heat Flux ◽  
Flow Pattern ◽  
Flow Boiling ◽  
Nucleate Boiling ◽  
Working Fluid ◽  
Inlet Temperature ◽  
Lower Mass ◽  
Subcooled Flow Boiling ◽  
Mass Fluxes ◽  
Subcooled Flow

For improving the functionality and signal speed of electronic devices, electronic components have been miniaturized and an increasing number of elements have been packaged in the device. As a result there has been a steady rise in the amount of heat necessitated to be dissipated from the electronic device. Recently microchannel heat sinks have been emerged as a kind of high performance cooling scheme to meet the heat dissipation requirement of electronics packaging, In the present study an experimental study of subcooled flow boiling in a high-aspect-ratio, one-sided heating rectangular microchannel with gap depth of 0.52 mm and width of 5 mm was conducted with deionized water as the working fluid. In the experimental operations, the mass flux was varied from 200 to 400 kg/m2s and imposed heat flux from 3 to 20 W/cm2 while the fluid inlet temperature was regulated constantly at 90 °C. The boiling curves, flow pattern and onset of nucleate boiling of subcooled flow boiling were investigated through instrumental measurements and a high speed camera. It was found that the slope of the boiling curves increased sharply once the superheat needed to initiate the onset of nucleate boiling was attained, and the slope was greater for lower mass fluxes, with lower superheat required for boiling incipience. As for the visualization images, for relatively lower mass fluxes the bubbles generated were larger and not easy to depart from the vertical upward placed narrow microchannel wall, giving elongated bubbly flow and reverse backflow. The thin film evaporation mechanism dominated the entire test section due to the elongated bubbles and transient local dryout as well as rewetting occurred. Meanwhile the initiative superheat and heat flux of onset of nucleate boiling were compared with existing correlations in the literature with good agreement.

scholarly journals A Study of Critical Heat Flux During Flow Boiling in Microchannel Heat Sinks

2011 ◽  
Vol 134 (1) ◽  
Author(s):  
Tailian Chen ◽  
Suresh V. Garimella
Keyword(s):  
Heat Flux ◽  
Critical Heat Flux ◽  
Flow Rate ◽  
Heat Input ◽  
Heat Sink ◽  
Flow Boiling ◽  
Strong Dependence ◽  
Heat Fluxes ◽  
Abrupt Decrease ◽  
Parallel Microchannels

The cooling capacity of two-phase transport in microchannels is limited by the occurrence of critical heat flux (CHF). Due to the nature of the phenomenon, it is challenging to obtain reliable CHF data without causing damage to the device under test. In this work, the critical heat fluxes for flow boiling of FC-77 in a silicon thermal test die containing 60 parallel microchannels were measured at five total flow rates through the microchannels in the range of 20–80 ml/min. CHF is caused by dryout at the wall near the exit of the microchannels, which in turn is attributed to the flow reversal upstream of the microchannels. The bubbles pushed back into the inlet plenum agglomerate; the resulting flow blockage is a likely cause for the occurrence of CHF which is marked by an abrupt increase in wall temperature near the exit and an abrupt decrease in pressure drop across the microchannels. A database of 49 data points obtained from five experiments in four independent studies with water, R-113, and FC-77 as coolants was compiled and analyzed. It is found that the CHF has a strong dependence on the coolant, the flow rate, and the area upon which the heat flux definition is based. However, at a given flow rate, the critical heat input (total heat transfer rate to the coolant when CHF occurs) depends only on the coolant and has minimal dependence on the details of the microchannel heat sink (channel size, number of channels, substrate material, and base area). The critical heat input for flow boiling in multiple parallel microchannels follows a well-defined trend with the product of mass flow rate and latent heat of vaporization. A power-law correlation is proposed which offers a simple, yet accurate method for predicting the CHF. The thermodynamic exit quality at CHF is also analyzed and discussed to provide insights into the CHF phenomenon in a heat sink containing multiple parallel microchannels.

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