Thermal Management of Electronic Equipment: Research Needs in the Mid-1990s and Beyond

1996 ◽  
Vol 49 (10S) ◽  
pp. S167-S174 ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Electronic Devices ◽  
Transport Processes ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Stress Fields ◽  
Hardware Development ◽  
3D Packaging ◽  
The Subject

As electronic devices and equipment are finding their ways into diverse applications, their physical integrity becomes a matter of utmost concern. The thermal design criteria customarily assumed in many of previous heat transfer research programs have to be replaced by those on the thermomechanical load in compact systems. Attempts to find thermal and stress fields in critical parts of components, however, are beset by geometrical complexities and multiple length and time scales involved in transport processes in electronic equipment. Modeling of complex systems is the subject left for further rationalization. Also needed is the foresight about possible hardware morphologies taken by electronic equipment in the future. In view of possible saturation of 2D packaging technology, heat transfer studies for 3D packaging are worth being undertaken. Common to different scenarios of hardware development is the need to critically review the methodology and focuses of fundamental heat transfer research.

scholarly journals Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

2021 ◽  
Vol 39 (2) ◽  
pp. 451-459
Author(s):  
Zhengde Wang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Electronic Devices ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Source Analysis ◽  
Power Electronic ◽  
Cooling Performance ◽  
Scheme Design

In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

Passive Thermal Management of Excess Heat from Electronic Devices

1989 ◽  
Vol 154 ◽  
Author(s):  
John J. Glatz ◽  
Juan F. Leon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Enabling Technology ◽  
Electronic Components ◽  
Potential Applications ◽  
General Scope

AbstractThermal management in the packaging of electronic components is fast becoming an enabling technology in the development of reliable electronics for a range of applications. The objective of the paper is to assess the feasibility of using advance high thermal conductivity pitch fiber (HTCPF) as a solution to some of the packaging problems. The general scope will include the following: identification of the candidate material and its potential applications; thermal management of the chip to board interface; thermal management of the heat within the multi-layer interconnect board (MIB); thermal management of the standard electronic module-format E (SEME); and heat transfer thru the enclosure to a remote heatsink/heat exchanger.

Design Optimization of Micro-channel Heat Exchanger embedded in LTCC

2012 ◽  
Vol 2012 (1) ◽  
pp. 000857-000865
Author(s):  
Aparna Aravelli ◽  
Singiresu S. Rao ◽  
Hari K. Adluru
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Optimization Technique ◽  
Thermal Design ◽  
Transfer Rates ◽  
Design Variables ◽  
Micro Heat Exchanger ◽  
Micro Systems ◽  
Silver Metal

Increase in the density of electronic packaging leads to the investigation of highly efficient thermal management systems. The challenge in these micro-systems is to maximize heat transfer per unit volume. In the author's previous work, experimental and computational analysis has been performed on LTCC substrates using embedded silver vias. This novel technique of embedding silver vias along with forced convection resulted in higher heat transfer rates. The present work further investigates into the optimization of this model. A Multi-objective optimization problem has been formulated for the heat transfer in the LTCC model. The Log Mean Temperature Difference (LMTD) method of heat exchangers has been used in the formulation. Optimization is done based on maximization of the total heat transferred and minimization of the coolant pumping power. Structural and thermal design variables are considered to meet the manufacturability and energy requirements. Demanded pressure loss and volume of the silver metal are used as constraints. The classical optimization technique Sequential Quadratic Programming (SQP) is used to solve the micro-heat exchanger problem. The optimal design is presented and sensitivity analysis results are discussed.

scholarly journals A Review On Transient Thermal Management of Electronic Devices

2021 ◽  
Author(s):  
John Mathew ◽  
Shankar Krishnan
Keyword(s):  
Thermal Management ◽  
Laser Diode ◽  
High Power ◽  
Electronic Devices ◽  
Thermal Response ◽  
Heat Pipes ◽  
Design Guidelines ◽  
Thermal Design ◽  
Laser Diode Arrays ◽  
Transient Thermal

Abstract Much effort in the area of electronics thermal management has focused on developing cooling solutions that cater to steady-state operation. However, electronic devices are increasingly being used in applications involving time-varying workloads. These include microprocessors (particularly those used in portable devices), power electronic devices such as IGBTs, and high-power semiconductor laser diode arrays. Transient thermal management solutions become essential to ensure the performance and reliability of such devices. In this review, emerging transient thermal management requirements are identified, and cooling solutions reported in the literature for such applications are presented with a focus on time scales of thermal response. Transient cooling techniques employing actively controlled two-phase microchannel heat sinks, phase change materials (PCM), heat pipes/vapor chambers, combined PCM-heat pipes/vapor chambers, and flash boiling systems are examined in detail. They are compared in terms of their thermal response times to ascertain their suitability for the thermal management of pulsed workloads associated with microprocessor chips, IGBTs, and high-power laser diode arrays. Thermal design guidelines for the selection of appropriate package level thermal resistance and capacitance combinations are also recommended.

scholarly journals Effect of Nanoparticle Deposition on the Thermal Performance of Evaporator in Thermosyphons

2021 ◽  
Vol 2116 (1) ◽  
pp. 012054
Author(s):  
T Donepudi ◽  
A V Korobko ◽  
J W R Peeters ◽  
S Fateh
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Electronic Devices ◽  
Heat Transfer Process ◽  
Heat Fluxes ◽  
Management Systems ◽  
Two Phase ◽  
Nanoparticle Deposition ◽  
Promising Alternative ◽  
Conventional Systems

Abstract Rapid advancements in technology have led to the miniaturization of electronic devices which typically dissipate heat fluxes in the order of 100 W/cm2. This has brought about an unprecedented challenge to develop efficient and reliable thermal management systems. Novel cooling technologies such as Two-Phase Thermosyphons that make use of nanofluids provide a promising alternative to the use of conventional systems. This article analytically estimates the effects caused by nanoparticles that deposit on the evaporator surface and their effect on the heat transfer process.

scholarly journals Reciprocity of thermal diffusion in time-modulated systems

2022 ◽  
Vol 13 (1) ◽  
Author(s):  
Jiaxin Li ◽  
Ying Li ◽  
Pei-Chao Cao ◽  
Minghong Qi ◽  
Xu Zheng ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Thermal Diffusion ◽  
Acoustic Waves ◽  
Transport Processes ◽  
Time Modulation ◽  
External Bias ◽  
Dynamic Materials ◽  
Symmetry Constraints ◽  
Diffusive Processes

AbstractThe reciprocity principle governs the symmetry in transmission of electromagnetic and acoustic waves, as well as the diffusion of heat between two points in space, with important consequences for thermal management and energy harvesting. There has been significant recent interest in materials with time-modulated properties, which have been shown to efficiently break reciprocity for light, sound, and even charge diffusion. However, time modulation may not be a plausible approach to break thermal reciprocity, in contrast to the usual perception. We establish a theoretical framework to accurately describe the behavior of diffusive processes under time modulation, and prove that thermal reciprocity in dynamic materials is generally preserved by the continuity equation, unless some external bias or special material is considered. We then experimentally demonstrate reciprocal heat transfer in a time-modulated device. Our findings correct previous misconceptions regarding reciprocity breaking for thermal diffusion, revealing the generality of symmetry constraints in heat transfer, and clarifying its differences from other transport processes in what concerns the principles of reciprocity and microscopic reversibility.

Thermal Management of Electronic Equipment: A Review of Technology and Research Topics

1986 ◽  
Vol 39 (12) ◽  
pp. 1847-1868 ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Heat Transfer ◽  
Flip Chip ◽  
Nucleate Boiling ◽  
The Body ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Design Criteria ◽  
Research Topics ◽  
Small Component ◽  
Convection Cooling

Increasing miniaturization of microcircuits on chips of increasing size and new schemes of electrical connection, such as flip-chip bonding and surface mounting, are setting more demanding criteria regarding the thermal field within electronic equipment. While the search for a solution to meet a set of prescribed design criteria is becoming more complex, the body of available data needed to perform such a search is quite small. This article describes the two primary functions to be implemented by electronic heat transfer research: the definition of thermal design criteria and the establishment of a thermal packaging database. Examples of actual designs of packages are drawn from recent publications to illustrate the points of technical importance. The examples are packages of DRAM chips, flat-leaded packages of logic chips, and modules with dismountable heat sinks. These examples are used to address thermal stress problems, the problems of fin design, and thermal interface management, respectively. In the section on natural convection cooling, the effects of various factors on the uncertainties pertaining to heat transfer coefficient are assessed in light of the correlations proposed in the current literature. The section on forced convection cooling deals with the problem of heat transfer from an array of packages in a parallel-plate channel. The final section is devoted to the research topics of nucleate boiling heat transfer enhancement, from the surface of a small component, and microchannel cooling.

The effects of the outlet area and the location of the main power supply unit on the cooling capability through naturally air-cooled electronic equipment casings

1998 ◽  
Vol 212 (5) ◽  
pp. 381-383 ◽  
Author(s):  
M Ishizuka
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Power Supply ◽  
Flow Resistance ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Power Supply Unit ◽  
Air Cooling ◽  
Uniform Temperature ◽  
Cooling Systems

This paper describes a practical thermal design approach to natural air-cooled electronic equipment casings. A set of simplified equations for the thermal design of natural air-cooled electronic equipment casings has been proposed. The proposed set of equations satisfied the demand of practical air-cooling systems, since it takes account of factors such as the stack effect, the air flow resistance and the heat transfer due to natural convection. The effects of the outlet area and the location of the main power supply unit on the natural cooling capability of electronic equipment casings were studied using a set of equations. The results have shown that a uniform temperature distribution could be achieved when the main power supply unit was placed at the bottom of the casing. It has also been suggested that the value of the heat removed from the casing surface could be more significant than that from the outlet vent in the thermal design of natural air-cooled electronic equipment casings.

Enhanced Heat Transfer and Thermal Performance of Metal Foam Microchannel Heat Sinks With Internal Y-Shaped Bifurcation

2016 ◽  
Author(s):  
Han Shen ◽  
Xueting Liu ◽  
Bengt Sunden ◽  
Gongnan Xie
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Thermal Performance ◽  
Metal Foam ◽  
Electronic Devices ◽  
Metal Foams ◽  
Heat Sinks ◽  
Pore Density ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Internal Y-shaped bifurcation has been proved to be an advantageous way on improving thermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, large surface area and high thermal conductivity. In this paper, different parameters of metal foams in Y-shaped bifurcation microchannel heat sinks are designed and investigated numerically. The effects of Reynolds number, porosity of metal foam, and the pore density (PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is found that the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibit better heat transfer enhancement and overall thermal performance. This research provides broad application prospects for heat sinks with metal foam in the thermal management of high power density electronic devices.

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

2021 ◽  
Author(s):  
Masaya Fukada ◽  
Takashi Fukue ◽  
Yasuhiro Sugimoto ◽  
Tomoyuki Hatakeyama ◽  
Masaru Ishizuka
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Flow Rate ◽  
Heat Sink ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Heat Sinks ◽  
Rate Distribution ◽  
Resistance Network ◽  
Convection Cooling

Abstract This study describes a thermal design method of forced convection cooling in high-density packaging electronic equipment for upstream design processes by flow and thermal resistance network analysis. Forced convection cooling by combining fans and heat sinks is the most standard strategy for dissipating heat from electronic equipment. In recent years, the thermal design of electronic equipment becomes more critical, and fast thermal design is required due to the rapid development of final products. We have been developing the flow and thermal resistance network analysis as the quick thermal design method for electronic equipment. However, an accurate prediction of forced convection cooling performance by finned heat sinks mounted in high-density packaging electronic equipment is generally tricky. Some bypasses, which are clearances between the heat sinks and enclosure walls or other components, exist around the heat sinks. Therefore, a flow rate distribution between the heat sink fins and the bypasses should be predicted. Many researchers have investigated hydrodynamic characteristics and heat transfer characteristics of finned heat sinks. However, many previous studies have been conducted on the finned heat sink performance when there are no bypasses. In order to achieve an optimum design of the finned heat sinks in the upstream configuration regardless of the heat sink dimensions, a systematic database of hydrodynamic characteristics and heat transfer characteristics of the finned heat sinks with bypasses should be investigated. This paper discusses the development of function models of pressure drop, flow rate distribution, and heat transfer of the finned heat sinks with the bypasses for the resistance network analysis through experiments and CFD analysis. Several types of finned heat sinks with 40 mm in width and 80 mm in length were prepared, and these were mounted in a rectangular enclosure with 45 mm in width and height. First, the pressure drop characteristic around the heat sink was investigated. In addition, the flow rate distribution between the heat sink and the bypass was evaluated separately. A flow branching coefficient was developed to predict the flow rate distribution around the heat sink combined with the pressure drop coefficient. Using the developed flow branching coefficient, the flow and thermal resistance network model around the finned heat sink was developed. The results from the proposed resistance network model showed good agreement with those from the experiment.

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