Nanofluid Properties and Their Effects on Convective Heat Transfer in an Electronics Cooling Application

2009 ◽  
Vol 1 (3) ◽  
Author(s):  
Jessica Townsend ◽  
Rebecca J. Christianson
Keyword(s):  
Thermal Conductivity ◽  
Volume Fraction ◽  
Cooling System ◽  
Electronics Cooling ◽  
Nanoparticle Suspension ◽  
System Combination ◽  
Conductivity Increase ◽  
Viscosity Increase ◽  
Nanoparticle Suspensions ◽  
Complicated Geometries

In the search for new, more effective coolant fluids, nanoparticle suspensions have shown promise due to their enhanced thermal conductivity. However, there is a concomitant increase in the viscosity, requiring an increase in pumping power to achieve the same flow rate. Studies of flow cooling in simple geometries indicate that there is a benefit to using nanofluids, but it is difficult to justify extending these results to the far more complicated geometries. Moreover, with the variability of property measurements found in literature, it is possible to show conflicting results from the same set of flow-cooling data. In this work we present a self-contained study of the properties and effectiveness of an alumina in water nanofluid. Flow-cooling is studied in an off-the-shelf fluid cooling package for electronics to examine the effects of the particulates in a practical scenario. We measure the thermal conductivity and viscosity of the same suspensions to assure consistent interpretation of our results. We find that, while there is no anomalous enhancement of the thermal properties or transport, there is a benefit to using a low volume fraction alumina nanoparticle suspension over using the base fluid alone. In fact, there is an optimal volume fraction (1%) for this nanofluid and electronics cooling system combination that maximizes the heat dissipated. However, we find that this benefit decreases as the volume fraction, and hence the viscosity, increases. Understanding where the trade-off between viscosity increase and thermal conductivity increase occurs is critical to designing an electronics cooling system using a nanofluid as a coolant.

Rheological Study of Micro Particle Laden Polymeric Thermal Interface Materials: Part 1 — Experimental

2002 ◽  
Author(s):  
Ravi S. Prasher ◽  
Jim Shipley ◽  
Suzana Prstic ◽  
Paul Koning ◽  
Jin-Lin Wang
Keyword(s):  
Thermal Conductivity ◽  
Volume Fraction ◽  
Particle Volume Fraction ◽  
Electronics Cooling ◽  
Bond Line ◽  
Rheological Parameters ◽  
Thermal Interface Materials ◽  
Particle Volume ◽  
Thermal Interface ◽  
Interface Materials

Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research groups have primarily dealt with the understanding of the thermal conductivity of these types of TIMs. Thermal resistance is not only dependent on the thermal conductivity but also on the bond line thickness (BLT) of these TIMs. It is not clear that which material property(s) of these particle laden TIMs affects the BLT. This paper discusses the experimental measurement of rheological parameters such as non-Newtonian strain rate dependent viscosity and yield stress for 3 different particle volume fraction and 3 different base polymer viscosity materials. These rheological and BLT measurements vs. pressure will be used to model the BLT of particle-laden systems for factors such as volume fraction.

Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

2003 ◽  
Author(s):  
Ravi S. Prasher ◽  
Jim Shipley ◽  
Suzana Prstic ◽  
Paul Koning ◽  
Jin-Lin Wang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Volume Fraction ◽  
Applied Pressure ◽  
Electronics Cooling ◽  
Thermal Design ◽  
Thermal Interface Materials ◽  
Particle Volume ◽  
Thermal Interface ◽  
Interface Materials

Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIMs affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semi-empirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIMs.

Thermal Conductivity and Thermal Expansion Properties of AlN/EP Composite

2012 ◽  
Vol 482-484 ◽  
pp. 1410-1413 ◽  
Author(s):  
Zhen Hui Ma ◽  
Jin Liang Huang ◽  
Yong Jun Gu ◽  
Biao Jin ◽  
Guan Yu Chen
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Epoxy Matrix ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Casting Method ◽  
Conductivity Increase ◽  
Thermal Conductivity Increase ◽  
Properties Of Composites

AlN/epoxy (AlN/EP) composites were fabricated by casting method. The effects of the AlN content on microstructure, thermal conductivity and thermal expansion properties of composites were investigated. The results indicate that with the AlN content increasing, the thermal conductivity increase, while the coefficient of thermal expansion (CTE) decreases. When the volume fraction of AlN is 25%, the thermal conductivity is 0.507 W/m•K, which is about 2.5 times higher than that of the epoxy matrix, while the coefficient of thermal expansion is 53.7 ppm/°C. The thermal conductivity results obtained were also analyzed using the Maxwell-Eucken model to explain the effect of AlN fillers on the formation of thermal conductive networks.

Thermal Resistance of Particle Laden Polymeric Thermal Interface Materials

2003 ◽  
Vol 125 (6) ◽  
pp. 1170-1177 ◽  
Author(s):  
Ravi S. Prasher ◽  
Jim Shipley ◽  
Suzana Prstic ◽  
Paul Koning ◽  
Jin-lin Wang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Volume Fraction ◽  
Applied Pressure ◽  
Electronics Cooling ◽  
Thermal Design ◽  
Thermal Interface Materials ◽  
Semiempirical Model ◽  
Thermal Interface ◽  
Interface Materials

Particle laden polymers are one of the most prominent thermal interface materials (TIM) used in electronics cooling. Most of the research has primarily dealt with the understanding of the thermal conductivity of these types of TIMs. For thermal design, reduction of the thermal resistance is the end goal. Thermal resistance is not only dependent on the thermal conductivity, but also on the bond line thickness (BLT) of these TIMs. It is not clear which material property(s) of these particle laden TIMs affects the BLT and eventually the thermal resistance. This paper introduces a rheology based semiempirical model for the prediction of the BLT of these TIMs. BLT depends on the yield stress of the particle laden polymer and the applied pressure. The BLT model combined with the thermal conductivity model can be used for modeling the thermal resistance of these TIMs for factors such as particle volume faction, particle shape, base polymer viscosity, etc. This paper shows that there exists an optimal filler volume fraction at which thermal resistance is minimum. Finally this paper develops design rules for the optimization of thermal resistance for particle laden TIMs.

A Study of Some Mechanical and Physical Properties for Palm Fiber/Polyester Composite

2020 ◽  
Vol 38 (3B) ◽  
pp. 104-114
Author(s):  
Samah M. Hussein
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Date Palm ◽  
Volume Fraction ◽  
Unsaturated Polyester ◽  
Dielectric Strength ◽  
Palm Fiber ◽  
Mechanical And Physical Properties ◽  
Polyester Composite

This research has been done by reinforcing the matrix (unsaturated polyester) resin with natural material (date palm fiber (DPF)). The fibers were exposure to alkali treatment before reinforcement. The samples have been prepared by using hand lay-up technique with fiber volume fraction of (10%, 20% and 30%). After preparation of the mechanical and physical properties have been studied such as, compression, flexural, impact strength, thermal conductivity, Dielectric constant and dielectric strength. The polyester composite reinforced with date palm fiber at volume fraction (10% and 20%) has good mechanical properties rather than pure unsaturated polyester material, while the composite reinforced with 30% Vf present poor mechanical properties. Thermal conductivity results indicated insulator composite behavior. The effect of present fiber polar group induces of decreasing in dielectric strength, and increasing dielectric constant. The reinforcement composite 20% Vf showed the best results in mechanical, thermal and electrical properties.

Study of the boundary layer heat transfer of nanofluids over a stretching sheet: Passive control of nanoparticles at the surface

2015 ◽  
Vol 93 (7) ◽  
pp. 725-733 ◽  
Author(s):  
M. Ghalambaz ◽  
E. Izadpanahi ◽  
A. Noghrehabadi ◽  
A. Chamkha
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Boundary Layer ◽  
Nusselt Number ◽  
Heat Transfer Enhancement ◽  
Base Fluid ◽  
Stretching Sheet ◽  
Volume Fraction ◽  
Enhancement Ratio ◽  
Transfer Enhancement

The boundary layer heat and mass transfer of nanofluids over an isothermal stretching sheet is analyzed using a drift-flux model. The relative slip velocity between the nanoparticles and the base fluid is taken into account. The nanoparticles’ volume fractions at the surface of the sheet are considered to be adjusted passively. The thermal conductivity and the dynamic viscosity of the nanofluid are considered as functions of the local volume fraction of the nanoparticles. A non-dimensional parameter, heat transfer enhancement ratio, is introduced, which shows the alteration of the thermal convective coefficient of the nanofluid compared to the base fluid. The governing partial differential equations are reduced into a set of nonlinear ordinary differential equations using appropriate similarity transformations and then solved numerically using the fourth-order Runge–Kutta and Newton–Raphson methods along with the shooting technique. The effects of six non-dimensional parameters, namely, the Prandtl number of the base fluid Prbf, Lewis number Le, Brownian motion parameter Nb, thermophoresis parameter Nt, variable thermal conductivity parameter Nc and the variable viscosity parameter Nv, on the velocity, temperature, and concentration profiles as well as the reduced Nusselt number and the enhancement ratio are investigated. Finally, case studies for Al2O3 and Cu nanoparticles dispersed in water are performed. It is found that increases in the ambient values of the nanoparticles volume fraction cause decreases in both the dimensionless shear stress f″(0) and the reduced Nusselt number Nur. Furthermore, an augmentation of the ambient value of the volume fraction of nanoparticles results in an increase the heat transfer enhancement ratio hnf/hbf. Therefore, using nanoparticles produces heat transfer enhancement from the sheet.

Effect of Coating on the Thermal Conductivities of Diamond/Cu Composites Prepared by Spark Plasma Sintering (SPS)

2014 ◽  
Vol 722 ◽  
pp. 25-29 ◽  
Author(s):  
Q.L. Che ◽  
X.K. Chen ◽  
Y.Q. Ji ◽  
Y.W. Li ◽  
L.X. Wang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Theoretical Prediction ◽  
Volume Fraction ◽  
Interface Reaction ◽  
Copper Matrix ◽  
Bonding Force ◽  
Ti Alloys ◽  
Plasma Sintering ◽  
Spark Plasma

The carbide forming is proposed to improve interfacial bonding between diamond particles and copper-matrix for diamond/copper composites. The volume fraction of diamond and minor titanium are optimized. The microstructures, thermal properties, interface reaction production and its effect of minor titanium on the properties of the composites are investigated. The results show that the bonding force and thermal conductivity of the diamond/Cu-Ti alloys composites is much weaker and lower than that of the coated-diamond/Cu. the thermal conductivity of coated-60 vol. % diamond/Cu composites is 618 W/m K which is 80 % of the theoretical prediction value. The high thermal conductivity has been achieved by forming the titanium carbide at diamond/copper interface to gain a good interface.

Pool Boiling Characteristics of Metallic Nanofluids

2011 ◽  
Vol 133 (11) ◽  
Author(s):  
K. Hari Krishna ◽  
Harish Ganapathy ◽  
G. Sateesh ◽  
Sarit K. Das
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Boiling Heat Transfer ◽  
Volume Fraction ◽  
Pool Boiling ◽  
Heat Fluxes ◽  
Solid Particles ◽  
Heater Surface ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics

Nanofluids, solid-liquid suspensions with solid particles of size of the order of few nanometers, have created interest in many researchers because of their enhancement in thermal conductivity and convective heat transfer characteristics. Many studies have been done on the pool boiling characteristics of nanofluids, most of which have been with nanofluids containing oxide nanoparticles owing to the ease in their preparation. Deterioration in boiling heat transfer was observed in some studies. Metallic nanofluids having metal nanoparticles, which are known for their good heat transfer characteristics in bulk regime, reported drastic enhancement in thermal conductivity. The present paper investigates into the pool boiling characteristics of metallic nanofluids, in particular of Cu-H2O nanofluids, on flat copper heater surface. The results indicate that at comparatively low heat fluxes, there is deterioration in boiling heat transfer with very low particle volume fraction of 0.01%, and it increases with volume fraction and shows enhancement with 0.1%. However, the behavior is the other way around at high heat fluxes. The enhancement at low heat fluxes is due to the fact that the effect of formation of thin sorption layer of nanoparticles on heater surface, which causes deterioration by trapping the nucleation sites, is overshadowed by the increase in microlayer evaporation, which is due to enhancement in thermal conductivity. Same trend has been observed with variation in the surface roughness of the heater as well.

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