Mechanical Engineering Tools: A Problem-Based, Introductory Design Course at the American University of Beirut

2009 ◽  
Author(s):  
R. F. Hamade ◽  
N. Ghaddar
Keyword(s):  
Mechanical Engineering ◽  
Printed Circuit Board ◽  
Problem Based Learning ◽  
Project Planning ◽  
Circuit Board ◽  
Learning Methods ◽  
American University ◽  
Team Members ◽  
American University Of Beirut ◽  
Cad Cam

Given the prevailing trend of ever decreasing number of required credits, this course solves one of the thorny issues which engineering departments encounter while developing curricula: to teach or not to teach ‘tools’. Those ‘tools of the trade’ include some truly ‘enabling technologies’ comprised of such ‘soft tools’ as CAD/CAM, MATLAB, project planning, controls and of ‘hard tools’ such as reverse engineering, assembly, machine shop fabrication processes, and printed circuit board technology. This course, ME Tools, was introduced in order to offer a viable platform which helps introduce the freshman mechanical engineering student to some of these ‘tools’ in a problem-based context. This goal is met via course organization and prevailing practices conducive to ‘active learning’ via activities and structure typically associated with collaborative and cooperative learning methods. ME Tools climaxes in a 5-event contest during which custom electric microcars are put to action in what is known around the American University of Beirut (AUB) campus as the ‘Gee Whiz contest’. Furthermore, and since the course activities revolve around one central theme, designing and racing an electric microcar, the true integral nature of this course is authenticated and revealed via this problem-based learning approach. This is accomplished as a team effort where teamwork experience and communication skills are highly stressed and practiced. The teams are organized so that the student team members are assigned to one of four functions: manager, systems engineer, analyst, and detail designer. The manner by which the students are assigned to one of these functions is done based on the students’ responses to a short (20 questions) questionnaire designed for this purpose. Assessment wise, grading of certain course grade components is mapped to the specific learning outcomes based on the cooperative, collaborative, and problem-based learning methods.

A Virtual Prototyping Framework for Electronics Manufacturing

Manufacturing ◽  
2002 ◽  
Author(s):  
J. Cecil ◽  
A. Kanchanapiboon
Keyword(s):  
Life Cycle ◽  
Printed Circuit Board ◽  
Virtual Prototyping ◽  
Circuit Board ◽  
Electronics Manufacturing ◽  
Functional Evaluation ◽  
Surface Mount Technology ◽  
Team Members ◽  
Printed Circuit ◽  
Pcb Assembly

This paper presents a framework for supporting virtual prototyping related activities in the domain of printed circuit board (PCB) assembly. The focus of discussion is restricted to Surface Mount Technology (SMT) based processes only. In general, Virtual Prototyping enables the conceptualization, evaluation and validation of proposed ideas, plans and solutions. Using a virtual prototyping framework, cross functional evaluation and analysis can be facilitated where designers, manufacturing engineers, testing and other life-cycle team members can communicate effectively as well as identify and eliminate problems, which may arise later in the downstream manufacturing and testing activities.

scholarly journals Speaking Different Languages

2001 ◽  
Vol 123 (02) ◽  
pp. 53-55
Author(s):  
Jean Thilmany
Keyword(s):  
Computer Aided Design ◽  
Printed Circuit Board ◽  
Mechanical Design ◽  
Circuit Board ◽  
Intermediate Data ◽  
Computer Aided ◽  
Cad Cam ◽  
Manufacturing Applications ◽  
Technology Users ◽  
San Rafael

This article illustrates the importance of interoperability between computer-aided design (CAD), computer-aided manufacturing (CAM), and computer-aided engineering (CAE) software. Interoperability is an intricate concept, rife with accusation and blame-laying, and dependent on the unseen algorithms and mathematical equations that drive the lines and geometries CAD users see on screen. At the Daratech 2000 summit, a panel of technology users and technology vendors worked together to draft what was called a symposium communique that challenged suppliers to cooperate more with one another to move toward interoperability. The communique calls the interoperability issue one of the most troublesome aspects of CAD, CAM, and CAE usage. PTC in Waltham, MA, has released Associate Topology Bus, a tool that thy company says helps engineers share data between systems by allowing them to exchange geometry as well as what the company calls design-intent, between systems. Autodesk of San Rafael, California, offers interoperable features as what it calls DWG linking between its AutoCAD software and its 3D Studio Viz, a system used by architects. Its Mechanical Desktop software can read printed circuit board data in intermediate data format (IDF) and convert it to AutoCAD objects suitable for further mechanical design and manufacturing applications.

Perlaksanaan Kaedah Pembelajaran Berasaskan Projek dalam Pengajaran dan Pembelajaran Kaedah Fiqh

2018 ◽  
Vol 2 (2) ◽  
pp. 14-23
Author(s):  
Mohd Aderi Che Noh ◽  
Normurni Mohamad ◽  
Adibah Hasanah Abd Halim ◽  
Absha Atiah Abu Bakar
Keyword(s):  
Data Collection ◽  
Mechanical Engineering ◽  
Project Based Learning ◽  
Narrative Form ◽  
Learning Methods ◽  
Engineering Program ◽  
Science Technology ◽  
Interview Methods

This study aims to see the implementation of project based learning methods (PBL) implemented by lecturers in the Science, Technology and Engineering P&P processes in Islam as an effort to enhance students' understanding in the Fiqh Method. Respondents in this study were students of second semester, Diploma of Mechanical Engineering program, Department of Mechanical Engineering, Politeknik Banting. Observation and interview methods are used for data collection purposes. The data were analyzed descriptively and presented in narrative form. The findings show that PBL activity is a fun and enjoyable P&P activity for students. Abstrak Kajian  ini  bertujuan  untuk  melihat  perlaksanaan  kaedah  pembelajaran  berasaskan  projek  (PBL)  yang dilaksanakan  oleh  pensyarah  dalam  proses  P&P Sains,  Teknologi  dan  kejuruteraan  dalam  Islam  sebagai usaha  meningkatkan  kefahaman  pelajar  pelajar  dalam  tajuk  Kaedah Fiqh.  Responden  dalam  kajian  ini adalah   terdiri   daripada   pelajar   semester   dua   progran   Diploma   Kejuruteraan   Mekanikal,   Jabatan Kejuruteraan  Mekanikal,  Politeknik  Banting.  Kaedah  pemerhatian  dan  temu  bual  digunakan  bagi  tujuan pengutipan data. Data dianalisis secara deskriptif dan dipersembahkan dalam bentuk naratif. Dapatan kajian menunjukkan aktiviti PBL merupakan aktiviti P&P yang disukai dan menyeronokkan bagi para pelajar.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

DIDACTIC MODEL OF LIFT

2018 ◽  
pp. 219-224
Author(s):  
Lubica Miková
Keyword(s):  
Printed Circuit Board ◽  
Base Plate ◽  
Educational Process ◽  
Circuit Board ◽  
Basic Knowledge ◽  
Practical Training ◽  
Target Setting ◽  
Lower Base ◽  
Complex Design ◽  
Starting Point

Urgency of the research. Mechatronics products become more sophisticated and complicated. Mechatronic engineers should be prepared for this complex design process. Practical experimental model helps improve educational process as preparing for practice. Target setting. Miniaturized model of the lift suitable for practical training on subjects focused to microcontrollers, sen-sors, actuators etc. Students have possibility to make practice on laboratory exercises, where they can verify theoretical knowledge obtained on lectures. The arrangement of the model has modular character, because of possibility to rearrange or adding of new function into model. The aim was to create minimized model of real lift with all functions and systems. Actual scientific researches and issues analysis. Many universities are oriented only to finished robotic kits and do not support creativity of students. Open access and open structure model missing in this field. There is a need for fast prototyping model, which allows the creation of new design of product. Uninvestigated parts of general matters defining. The question of the design of printed circuit board are uninvestigated, because they need more time than allows normal exercises. The research objective. The main aim of educational process is to educate engineers with basic knowledge, skills and handicraft. Practical models help as support devices for fulfil of this aim. All mechatronic students can practice a training on these practical models. They become as more skilled and well-oriented engineers.. The statement of basic materials. Construction consist of upper and lower base plate connected with four pillars used as linear guide for moving of lift cage. Lower base plate includes base microcontrollers boards, resistor network, power transis-tor array board, power supply terminals, relay modules, PWM module and signals terminals. Upper base plate consist of DC motor with gearing and screw mechanism for moving the lift cage. Conclusions. The model enables supports the creativity of the students. The starting point of the using of the model can be without any wired connections. Students should connect every part and try functionality of every function. The students receive the defined several problems and they have to analyze it and make any proposal for solution of defined problems.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

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