Mechanical Stress Monitoring Sensor for 3-D Module During Manufacturing and Operation

Author(s):  
Koki Isobe ◽  
Ken Suzuki ◽  
Hideo Miura

In three-dimensional packaging module which have been used in electronic equipment, the size of partial interconnections and total structure have been continuously miniaturized for improving the performance of the products. Due to the fluctuation of the mechanical properties of the component materials and the drop impact towards the fragile modules during manufacturing and operation, the final residual stress varies easily in a chip of the 3-D structure. Both the static and dynamic changes of the stress distribution induce the variation of the performance of electronic devices and the degradation of their long-term reliability. It is, therefore, important to control and optimize the residual stress quantitatively. In this study, a stress sensor which can monitor the change of the local residual stress in 3-D module was developed by applying the piezoresistance effect of single-crystalline silicon. The sensor was embedded in a silicon chip, and it can measure the periodic stress in a silicon chip assembled by area-arrayed bump structure. The impact stress during the manufacturing process was successfully monitored by using this sensor. It was also confirmed that the effective amplitude of the impact stress varies drastically depending on the mechanical properties of the stacked thin films.

2015 ◽  
Vol 825-826 ◽  
pp. 369-376 ◽  
Author(s):  
Robert Prussak ◽  
Daniel Stefaniak ◽  
Christian Hühne ◽  
Michael Sinapius

This paper focuses on the reduction of process-related thermal residual stress in fiber metal laminates and its impact on the mechanical properties. Different modifications during fabrication of co-cure bonded steel/carbon epoxy composite hybrid structures were investigated. Specific examinations are conducted on UD-CFRP-Steel specimens, modifying temperature, pressure or using a thermal expansion clamp during manufacturing. The impact of these parameters is then measured on the deflection of asymmetrical specimens or due yield-strength measurements of symmetrical specimens. The tensile strength is recorded to investigate the effect of thermal residual stress on the mechanical properties. Impact tests are performed to determine the influence on resulting damage areas at specific impact energies. The experiments revealed that the investigated modifications during processing of UD-CFRP-Steel specimens can significantly lower the thermal residual stress and thereby improve the tensile strength.


Author(s):  
Kohta Nakahira ◽  
Hironori Tago ◽  
Fumiaki Endo ◽  
Ken Suzuki ◽  
Hideo Miura

Since the thickness of the stacked silicon chips in 3D integration has been thinned to less than 100 μm, the local thermal deformation of the chips has increased drastically because of the decrease of the flexural rigidity of the thinned chips. The clear periodic thermal deformation and thus, the thermal residual stress distribution appears in the stacked chips due to the periodic alignment of metallic bumps, and they deteriorate the reliability of products. In this paper, the dominant structural factors of the local residual stress in a silicon chip are discussed quantitatively based on the results of a three-dimensional finite element analysis and the measurement of the local residual stress in a chip using stress sensor chips. The piezoresistive strain gauges were embedded in the sensor chips. The length of each gauge was 2 μm, and an unit cell consisted of 4 gauges with different crystallographic directions. This alignment of strain gauges enables to measure the tensor component of three-dimensional stress fields separately. Test flip chip substrates were made by silicon chip on which the area-arrayed tin/copper bumps were electroplated. The width of a bump was fixed at 200 μm, and the bump pitch was varied from 400 μm to 1000 μm. The thickness of the copper layer was about 40 μm and that of tin layer was about 10 μm. This tin layer was used for the rigid joint formation by alloying with copper interconnection formed on a stress sensing chip. The measured amplitude of the residual stress increased from about 30 MPa to 250 MPa depending on the combination of materials such as bump, underfill, and interconnections. It was confirmed that both the material constant of underfill and the alignment structure of fine bumps are the dominant factors of the local deformation and stress of a silicon chip mounted on area-arrayed metallic bumps. It was also confirmed experimentally that both the hound’s-tooth alignment between a TSV (Through Silicon Via) and a bump and control of mechanical properties of electroplated copper thin films used for the TSV and bump is indispensable in order to minimize the packaging-induced stress in the three-dimensionally mounted chips. This test chip is very effective for evaluating the packaging-process induced stress in 3D stacked chips quantitatively.


2010 ◽  
Vol 43 ◽  
pp. 651-656
Author(s):  
Ai Xin Feng ◽  
Yu Peng Cao ◽  
Chuan Chao Xu ◽  
Huai Yang Sun ◽  
Gui Fen Ni ◽  
...  

In the experiment, we use pulsed laser to conduct discrete scratching on Ni-containing stainless steel protective coatings to test residual stress situation after the matrix is scratched; then to analyze the the impact of the impact stress wave on coating - substrate bonding strength according to the test results, finally to infer the laser power density range within which it occurs coating failure. The study shows that: after laser discrete scratching, the residual stress of the center of the laser-loaded point on matrix surface gradually reduces when the pulsed laser power density increases. The matrix produces a corresponding residual compressive stress under the laser power density reaches a certain value. The actual failure threshold values are 12.006 GW/cm2, 11.829GW/cm2 and 12.193GW/cm2 measured by the three-dimensional topography instrument testing the discrete scratch point of three groups of samples and verified by using a microscope


2011 ◽  
Vol 189-193 ◽  
pp. 1132-1136 ◽  
Author(s):  
Yong Xu Zhao ◽  
Wen Jun Hu ◽  
Jun Mei ◽  
Niu Wei ◽  
Jian Jun Xie

After testing on T-type rubber bearing under tensile, compression and shear mechanical properties under different temperature in this paper. Obtained load deflection curve and destructive mode under different loading conditions at -40 and normal temperature of rubber components. Analysis the impact of temperature and the loading conditions that effect on load-elongation and destructive mode of T-type damping rubber structure. It showed that T-end rubber bearing has different kinds of deformation under different force-giving methods. Under compression, the stress pattern of the rubber bearing is three-dimensional and middle rubber bear the greatest force. Under tensile loading, the middle part of the rubber contract and the side with smaller lateral section has greater shrinkage; moreover, damage occurred in the area with stress concentration and weak strength. Under shearing action, extrude faces appeared with crinkle and damage occurred in the middle part of extrude faces. At the low temperature-40 , rubber support still has great elastic properties. The low temperature has a big effect on tensile properties and has little effect on damage properties.


2018 ◽  
Vol 52 (25) ◽  
pp. 3429-3444 ◽  
Author(s):  
Ezequiel Buenrostro ◽  
Daniel Whisler

Three-dimensional fiber-reinforced foam cores may have improved mechanical properties under specific strain rates and fiber volumes. But its performance as a core in a composite sandwich structure has not been fully investigated. This study explored different manufacturing techniques for the three-dimensional fiber-reinforced foam core using existing literature as a guideline to provide a proof of concept for a low-cost and easily repeatable method comprised of readily available materials. The mechanical properties of the fiber-reinforced foam were determined using a three-point bend test and compared to unreinforced polyurethane foam. The foam was then used in a sandwich panel and subjected to dynamic loading by means of a gas gun (103 s−1). High-strain impact tests validated previously published studies by showing, qualitatively and quantitatively, an 18–20% reduction in the maximum force experienced by the fiber-reinforced core and its ability to dissipate the impact force in the foam core sandwich panel. The results show potential for this cost-effective manufacturing method to produce an improved composite foam core sandwich panel for applications where high-velocity impacts are probable. This has the potential to reduce manufacturing and operating costs while improving performance.


2007 ◽  
Vol 293 (6) ◽  
pp. H3379-H3387 ◽  
Author(s):  
Paul D. Jöbsis ◽  
Hiroshi Ashikaga ◽  
Han Wen ◽  
Emily C. Rothstein ◽  
Keith A. Horvath ◽  
...  

Much attention has been focused on the passive mechanical properties of the myocardium, which determines left ventricular (LV) diastolic mechanics, but the significance of the visceral pericardium (VP) has not been extensively studied. A unique en face three-dimensional volumetric view of the porcine VP was obtained using two-photon excitation fluorescence to detect elastin and backscattered second harmonic generation to detect collagen, in addition to standard light microscopy with histological staining. Below a layer of mesothelial cells, collagen and elastin fibers, extending several millimeters, form several distinct layers. The configuration of the collagen and elastin layers as well as the location of the VP at the epicardium providing a geometric advantage led to the hypothesis that VP mechanical properties play a role in the residual stress and passive stiffness of the heart. The removal of the VP by blunt dissection from porcine LV slices changed the opening angle from 53.3 ± 10.3 to 27.3 ± 5.7° (means ± SD, P < 0.05, n = 4). In four porcine hearts where the VP was surgically disrupted, a significant decrease in opening angle was found (35.5 ± 4.0°) as well as a rightward shift in the ex vivo pressure-volume relationship before and after disruption and a decrease in LV passive stiffness at lower LV volumes ( P < 0.05). These data demonstrate the significant and previously unreported role that the VP plays in the residual stress and passive stiffness of the heart. Alterations in this layer may occur in various disease states that effect diastolic function.


Author(s):  
Megan J. Farrell ◽  
Eric S. Comeau ◽  
Robert L. Mauck

Limitations associated with the use of autologous chondrocytes (CH) for cartilage tissue engineering beget the need for alternative cell sources. Mesenchymal stem cells (MSC) are clinically attractive due to their ability to undergo chondrogenesis in three-dimensional culture [1,2]; however, when compared to CH, MSC fail to develop functional equivalence [2,3]. We have previously shown a marked depth-dependence in local equilibrium modulus of MSC-laden gels, with the superficial zones (where maximal media exchange occurs) considerably stiffer than regions removed from nutrient supply (center and bottom of construct); less dramatic depth-dependence was observed in CH-laden gels [4]. Similarly, other studies have shown depth-dependent properties in CH-laden gels with the construct edge generally stiffer than the center [5]. Given this apparent influence of nutrient supply, the objective of the current study was to assess the impact of dynamic culture (via orbital shaking) on the development of depth-dependent mechanical properties in both MSC and CH-laden hydrogels. Furthermore, we assessed cell viability and matrix content throughout the construct depth to determine the mechanism by which this depth-dependency arises. We hypothesized that improved nutrient transport would reduce construct inhomogeneity (particularly for MSC-laden constructs) and improve bulk mechanical properties.


2013 ◽  
Vol 690-693 ◽  
pp. 2659-2663
Author(s):  
Jian Ping Zhou ◽  
Xiang Feng Zhang ◽  
Hong Sheng Liu ◽  
Jun Yi Gao ◽  
Yan Xu

Residual stress affect the lifetime of weldments directly. Temperature Generated from the welding process is the major reason that influences the microstructure and mechanical properties of the metal weldments. Therefore it is necessary to simulate the temperature field for optimizing the structure of weldments. In this work the three-dimension finite element analysis software SYSWELS was used to simulate T-type tube, and carried on a detailed analysis of temperature field and residual stress in cool process of weld.


2019 ◽  
Author(s):  
Anne Schmitz

Abstract The types of biomedical devices that can be three-dimensional printed (3DP) is limited by the mechanical properties of the resulting materials. As a result, much research has focused on adding carbon nanotubes (CNT) to these photocurable polymers to make them stronger. However, there is little to no data on how CNTs affect the impact resistance of these polymers, an important property when designing and manufacturing lower limb prosthetics. The objective of this study was to expand the use of 3DP to prosthetics by testing the hypothesis that adding CNTs to a stereolithographic (SLA) photocurable resin will result in a cured polymer with increased impact resistance. Twenty-six total specimens: 13 with nanotubes and 13 without nanotubes, were printed on a Form2 SLA printer. Once all the specimens were printed, washed, and cured, the impact resistance was quantified using a pendulum impact tester in a notched Izod configuration. Contrary to the hypothesis, the specimens with SWCNTs (0.312 ± 0.036 ft*lb/in) had a significantly lower impact resistance compared to the non-SWCNT specimens (0.364 ± 0.055 ft*lb/in), U = 34.0, p = 0.004. This decreased impact resistance may be due to voids in the printed polymer around the aggregated nanotubes. Thus, SLA polymers still do not have the impact strength needed to be used for a full lower limb prosthetic.


Polymers ◽  
2020 ◽  
Vol 12 (11) ◽  
pp. 2456
Author(s):  
Demei Lee ◽  
Guan-Yu Wu

Three-dimensional (3D) printing is a manufacturing technology which creates three-dimensional objects layer-by-layer or drop-by-drop with minimal material waste. Despite the fact that 3D printing is a versatile and adaptable process and has advantages in establishing complex and net-shaped structures over conventional manufacturing methods, the challenge remains in identifying the optimal parameters for the 3D printing process. This study investigated the influence of processing parameters on the mechanical properties of Fused Deposition Modelling (FDM)-printed carbon fiber-filled polylactide (CFR-PLA) composites by employing an orthogonal array model. After printing, the tensile and impact strengths of the printed composites were measured, and the effects of different parameters on these strengths were examined. The experimental results indicate that 3D-printed CFR-PLA showed a rougher surface morphology than virgin PLA. For the variables selected in this analysis, bed temperature was identified as the most influential parameter on the tensile strength of CFR-PLA-printed parts, while bed temperature and print orientation were the key parameters affecting the impact strengths of printed composites. The 45° orientation printed parts also showed superior mechanical strengths than the 90° printed parts.


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