Constructing a Trade-Off Surface for Extruded Heat Sinks Exposed to Forced Convection

2003 ◽  
Author(s):  
D. J. de Kock ◽  
J. A. Visser
Keyword(s):  
Pressure Drop ◽  
Forced Convection ◽  
Heat Sink ◽  
Optimization Techniques ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Design Criteria ◽  
Relative Importance ◽  
Trade Off ◽  
Optimum Heat

In modern electronic components power densities are being increased continuously while the size and weight decrease. The effective dissipating of the heat produced by these components has now become a major design problem. Ordinary heat sinks often used to dissipate this heat, can in many instances no longer be used. Heat sinks therefore need to be designed and optimized for specific applications. The design of these heat sinks requires a difficult trade-off between conflicting parameters, e.g. mass or material cost, maximum temperature and pressure drop. Since these parameters influence one another, optimum designs require the use of mathematical optimization techniques. In the case of heat sinks, the thermal engineer would typically like to optimize the design simultaneously for three design parameters. The parameters are maximum heat sink temperature, mass and pressure drop. In the formulation of such an optimization problem, where more than one design criterion is important, the engineer currently has to assign the relative importance of each design criteria before starting the optimization. A better approach is to perform a range of optimization problems where the relative importance of the design criteria is varied systematically to obtain a trade-off surface of optimum heat sinks. This surface can then be used to investigate the influence of the different design criteria on each other and to select the optimum heat sink for a specific application. In this study such a trade-off surface is created for an extruded heat sink exposed to forced convection. The constructing of this surface is obtained by combining a semi-empirical simulation program, QFin 3.0 with the DYNAMIC-Q optimization method.

Trade-off Design of Extruded Heat Sinks Using Mathematical Optimization

2004 ◽  
Vol 126 (3) ◽  
pp. 333-341 ◽  
Author(s):  
D. J. de Kock ◽  
J. A. Visser
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Mathematical Optimization ◽  
Optimization Techniques ◽  
Heat Sinks ◽  
Trade Off ◽  
Pareto Optimal Set ◽  
Semi Empirical ◽  
Optimal Set ◽  
Heat Sink Design

Heat sink designers have to balance a number of conflicting parameters to maximize the performance of heat sinks. This multi-parameter problem lends itself naturally to mathematical optimization techniques. The paper illustrates how mathematical optimization techniques combined with a semi-empirical thermal simulation program can be used to construct a trade-off curve (Pareto-optimal set) between the heat sink mass and thermal resistance for a given heat sink configuration. This trade-off curve can be used by the engineer to decide on the optimal heat sink design that is the best compromise between heat sink mass and thermal resistance for the specific application under consideration.

scholarly journals Evaluation of Active Heat Sinks Design under Forced Convection—Effect of Geometric and Boundary Parameters

Materials ◽  
2021 ◽  
Vol 14 (8) ◽  
pp. 2041
Author(s):  
Eva C. Silva ◽  
Álvaro M. Sampaio ◽  
António J. Pontes
Keyword(s):  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Additive Manufacturing ◽  
Pressure Drop ◽  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sinks ◽  
Trapezoidal Shape ◽  
Computational Fluid Dynamics Simulations ◽  
Dynamics Simulations

This study shows the performance of heat sinks (HS) with different designs under forced convection, varying geometric and boundary parameters, via computational fluid dynamics simulations. Initially, a complete and detailed analysis of the thermal performance of various conventional HS designs was taken. Afterwards, HS designs were modified following some additive manufacturing approaches. The HS performance was compared by measuring their temperatures and pressure drop after 15 s. Smaller diameters/thicknesses and larger fins/pins spacing provided better results. For fins HS, the use of radial fins, with an inverted trapezoidal shape and with larger holes was advantageous. Regarding pins HS, the best option contemplated circular pins in combination with frontal holes in their structure. Additionally, lattice HS, only possible to be produced by additive manufacturing, was also studied. Lower temperatures were obtained with a hexagon unit cell. Lastly, a comparison between the best HS in each category showed a lower thermal resistance for lattice HS. Despite the increase of at least 38% in pressure drop, a consequence of its frontal area, the temperature was 26% and 56% lower when compared to conventional pins and fins HS, respectively, and 9% and 28% lower when compared to the best pins and best fins of this study.

scholarly journals Study of Mini Channel Heat Sink with Different Internal Configuration

2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed
Keyword(s):  
Nusselt Number ◽  
Thermal Performance ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Rectangular Channels ◽  
Flow Through ◽  
Internal Configuration

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).

Compact Modeling of Forced Flow in Longitudinal Fin Heat Sinks With Tip Bypass

2003 ◽  
Vol 125 (3) ◽  
pp. 319-324 ◽  
Author(s):  
C. B. Coetzer ◽  
J. A. Visser
Keyword(s):  
Pressure Drop ◽  
Heat Sink ◽  
Heat Sinks ◽  
Compact Model ◽  
Forced Flow ◽  
Compact Modeling ◽  
Transfer Coefficients ◽  
Wide Range ◽  
Laminar And Turbulent Flow ◽  
Improved Accuracy

This paper introduces a compact model to predict the interfin velocity and the resulting pressure drop across a longitudinal fin heat sink with tip bypass. The compact model is based on results obtained from a comprehensive study into the behavior of both laminar and turbulent flow in longitudinal fin heat sinks with tip bypass using CFD analysis. The new compact flow prediction model is critically compared to existing compact models as well as to the results obtained from the CFD simulations. The results indicate that the new compact model shows at least a 4.5% improvement in accuracy predicting the pressure drop over a wide range of heat sink geometries and Reynolds numbers simulated. The improved accuracy in velocity distribution between the fins also increases the accuracy of the calculated heat transfer coefficients applied to the heat sinks.

Compact Modeling of Fluid Flow and Heat Transfer in Straight Fin Heat Sinks

2004 ◽  
Vol 126 (2) ◽  
pp. 247-255 ◽  
Author(s):  
Duckjong Kim ◽  
Sung Jin Kim
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Fluid Flow ◽  
Pressure Drop ◽  
Heat Sink ◽  
Volume Averaging ◽  
Thermal Design ◽  
Heat Sinks ◽  
Compact Modeling ◽  
Flow And Heat Transfer

In the present work, a compact modeling method based on a volume-averaging technique is presented. Its application to an analysis of fluid flow and heat transfer in straight fin heat sinks is then analyzed. In this study, the straight fin heat sink is modeled as a porous medium through which fluid flows. The volume-averaged momentum and energy equations for developing flow in these heat sinks are obtained using the local volume-averaging method. The permeability and the interstitial heat transfer coefficient required to solve these equations are determined analytically from forced convective flow between infinite parallel plates. To validate the compact model proposed in this paper, three aluminum straight fin heat sinks having a base size of 101.43mm×101.43mm are tested with an inlet velocity ranging from 0.5 m/s to 2 m/s. In the experimental investigation, the heat sink is heated uniformly at the bottom. The resulting pressure drop across the heat sink and the temperature distribution at its bottom are then measured and are compared with those obtained through the porous medium approach. Upon comparison, the porous medium approach is shown to accurately predict the pressure drop and heat transfer characteristics of straight fin heat sinks. In addition, evidence indicates that the entrance effect should be considered in the thermal design of heat sinks when Re Dh/L>∼O10.

Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials

2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Electronic Devices ◽  
Ceramic Materials ◽  
Substrate Material ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Small Surface

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals

2001 ◽  
Author(s):  
V. S. Travkin
Keyword(s):  
Heat Sink ◽  
Solid Phase ◽  
Physical Characteristics ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Pin Fin ◽  
Three Samples ◽  
Non Local ◽  
Scale Design ◽  
Research And Design

Abstract The primary difficulty in semiconductor heat sink (and many other types of heat exchangers) research and design is not a lack of interest or money, but rather confusion with what being looked for and adequacy of the tools used for the search. As recently shown, there are few meaningful parameters (apart from sizes and weight) or physical characteristics of interest in semiconductor cooler design are local values. Even the maximum temperature of the base Tmax or semiconductor temperature are not local. In this work outlined the description in detail of arguments on how, and for what reasons, the measured data are to be simulated or measured and represented in a way that allows design goals to be formulated primarily with bulk physical characteristics. We demonstrate why studies of only averaged local integrated variables are not enough. Four sample semiconductor heat sinks of two morphologies (three samples of round pin fin and one sample of longitudinal rib fin sinks) were studied by different techniques and models. There were changes in by-pass values, external heat flux and flow rate. The results are depicted with using new parameters that better represent the needs of a design process as well as the usual parameters used in the past. Characteristics reported are the heat transfer rate in solid phase, relative fin effectiveness, and influence of only morphology features among others. Some suggestions for heat sink design are discussed.

Optimization Under Uncertainty of Manifold Microchannel Heat Sinks

2012 ◽  
Author(s):  
Suchismita Sarangi ◽  
Karthik K. Bodla ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Optimization Under Uncertainty ◽  
Microchannel Heat Sink ◽  
Probabilistic Optimization ◽  
Manifold Microchannel

Conventional microchannel heat sinks provide good heat dissipation capability but are associated with high pressure drop and corresponding pumping power. The use of a manifold system that distributes the flow into the microchannels through multiple, alternating inlet and outlet pairs is investigated here. This manifold arrangement greatly reduces the pressure drop incurred due to the smaller flow paths, while simultaneously increasing the heat transfer coefficient by tripping the thermal boundary layers. A three-dimensional numerical model is developed and validated, to study the effect of various geometric parameters on the performance of the manifold microchannel heat sink. Apart from a deterministic analysis, a probabilistic optimization study is also performed. In the presence of uncertainties in the geometric and operating parameters of the system, this probabilistic optimization approach yields an optimal design that is also robust and reliable. Uncertainty-based optimization also yields auxiliary information regarding local and global sensitivities and helps identify the input parameters to which outputs are most sensitive. This information can be used to design improved experiments targeted at the most sensitive inputs. Optimization under uncertainty also provides a quantitative estimate of the allowable uncertainty in input parameters for an acceptable uncertainty in the relevant output parameters. The optimal geometric design parameters with uncertainties that maximize heat transfer coefficient while minimizing pressure drop for fixed input conditions are identified for a manifold microchannel heat sink. A comparison between the deterministic and probabilistic optimization results is also presented.

Numerical Study of Microchannel Heat Sinks With Non-Uniform Heat Flux Conditions

2011 ◽  
Author(s):  
Ling Ling ◽  
Yanfeng Fan ◽  
Ibrahim Hassan
Keyword(s):  
Heat Flux ◽  
Heat Sink ◽  
Numerical Study ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Bottom Surface ◽  
Nonuniform Heating ◽  
Uniform Heat Flux ◽  
Computational Domain ◽  
Uniform Heating

Higher heat flux is produced by Micro-Electro-Mechanical Systems (MEMS) because of their reduced size and increased clock speed. At the mean time, studies of non-uniform heating conditions which are more practical than uniform heating conditions are inadequate and needed urgently. Four nonuniform heating conditions are simulated in the paper. Three heat sinks with different widths of cross-linked channels locating above the center of hotspots are studied and compared to conventional straight microchannel heat sink. Half of the module geometry is chosen to be the computational domain. Two hotspots are placed at the bottom surface. The coolant is water, whose properties are dependent on temperature. Two inlet velocities, 0.5 m/s and 1 m/s, are tested for each heat sink. Temperature profile at the hotspots, pressure drop and total thermal resistance are selected as criteria of evaluating heat sink performance. All heat sinks have better performance when there is an upstream hotspot or the upstream hotspot is subjected to a higher heat flux. Cross-linked channel width of 0.5 mm has the best benefit to obtain better temperature uniformity without increasing the maximum temperature on the bottom surface.

A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

1990 ◽  
Vol 112 (3) ◽  
pp. 234-240 ◽  
Author(s):  
G. L. Lehmann ◽  
S. J. Kosteva
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Convection Heat Transfer ◽  
Heat Sinks ◽  
Air Cooling ◽  
Transfer Coefficients ◽  
Packaging System ◽  
Transfer Rates ◽  
Heat Transfer Coefficients

An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and spaced elements attached to one channel wall. The presence of a single or complete row of longitudinally finned heat sinks creates a modified flow pattern. Convective heat transfer rates at downstream positions are measured and compared to that of a plain array (no heat sinks). Heat transfer rates are described in terms of adiabatic heat transfer coefficients and thermal wake functions. Empirical correlations are presented for both variations in Reynolds number (5000 < Re < 20,000) and heat sink geometry. It is found that the presence of a heat sink can both enhance and degrade the heat transfer coefficient at downstream locations, depending on the relative position.

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