Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

2015 ◽  
Author(s):  
H. Y. Zhang ◽  
Xiao Yan ◽  
W. H. Zhu ◽  
Leon Lin
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Power Dissipation ◽  
High Current Density ◽  
Hot Spot ◽  
Thermal Design ◽  
Good Prediction ◽  
Excessive Heat ◽  
Pin Fin ◽  
Power Application

2.5-D package with through silicon vias (TSVs) on interposer has been envisioned as the most viable way in heterogeneous integration. In this work, several design approaches are considered in the thermal analysis and enhancements of a 2.5-D package with multi chips on through silicon interposer (TSI), which include overmolding materials, metal slug, lid attachment, pin fin heat sink and fan-driven heat sink cooling. The analysis models consist of two dummy flip chips on a silicon interposer to represent the logic die and memory die, respectively. Package submodels, especially the TSV ones, are analyzed with good modeling accuracy. Package thermal modeling indicates that the thermal conductivity of the epoxy overmolding has minimal effect on the thermal performance of copper slug package. Lid attachment further enhances the thermal performance through peripheral substrate attachment. Both designs largely rely on thermally conductive PCB (4L) to maximize power dissipation. Pin-fin heat sink, made of aluminum, can be mounted on the package top to further minimize thermal resistance and extend the power dissipation beyond 10W. For high power application, fan cooled heat sink is used to reduce excessive heat. Copper based aluminum heat sink can remove the heat of 120W from the bare-die package. Self heating due to high current density through the TSV is analyzed. The proposed analytical expression gives good prediction on the local TSV hot spot. It is demonstrated that a distributed TSV network design provides lower temperature rise, which shall have lower risk of failures and is preferred in practice.

Effect of Pin-Fin Heat Sink Structure and Irradiation Angle on High-Power LED Down-Light Thermal Performance

2012 ◽  
Vol 591-593 ◽  
pp. 653-656
Author(s):  
Hai Lin Liu ◽  
Li Gang Wu ◽  
Shi Xun Dai ◽  
Wan Jiong Lin ◽  
Bo You Zhou ◽  
...  
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Thermal Design ◽  
Cooling Effect ◽  
Future Design ◽  
Pin Fin ◽  
High Power Led ◽  
Simulation Results ◽  
Irradiation Angle

The heat sink has played an important role in the thermal design of high power LED lamps. In this study, a pin-fin heat sink is designed for the 3-chips high power LED down-light. Thermal performance of pin-fin heat sink is researched by changing the fin height, fin number and lamp’s irradiation angle. Simulation results gotten by CFD software show that the pin-fin heat sink has better thermal performance with fin height of 40mm and fin number of 75. The LED down-light with a pin-fin heat sink has a better cooling effect in multi-angle irradiation. The results provide a reference for future design of pin-fin heat-sink.

Cooling of Thermal Enhanced BGA Package Using Foam Metal Heat Sinks

2000 ◽  
Author(s):  
Jenn-Jiang Hwang ◽  
Chung-Hsing Chao
Keyword(s):  
Heat Sink ◽  
Power Dissipation ◽  
Thermal Characterization ◽  
Junction Temperature ◽  
Pin Fin ◽  
Bga Packages ◽  
Plastic Ball ◽  
Bga Package ◽  
Foam Metal ◽  
Forced Air

Abstract This study reported thermal performance of a thermally enhanced plastic ball grid array (PBGA), namely T2-BGA™ which incorporates a heat slug in package, with a foam-metal heat sink on the top of this package. Experimental measurement of junction-to-ambient thermal resistance is performed in accordance with the SEMI standards of G38-0996 and G42-0996 for thermal characterization of BGA packages. Allowable power dissipation is subject to the constraint of junction temperature (Tj) at 95°C and ambient temperature (Ta) in chassis at 35 °C under free and forced air (0 ∼ 3 m/s) conditions. Based on this constraint, allowable power dissipation of a regular PBGA with a commercial pin fin heat sink under free and 3 m/s forced air is 5.45 W and 9.17 W compared with those of T2-BGA with a foam heat sink of 6.80 W and 19.6 W respectively. This results show that T2-BGA™ with a foam heat sink offers enormous potential to high power package applications.

Structure Design for Heat Sink Based on Thermal Analysis

2011 ◽  
Vol 80-81 ◽  
pp. 767-773
Author(s):  
Hai Gang Sun ◽  
Yong Zhou
Keyword(s):  
Thermal Analysis ◽  
Thermal Performance ◽  
Heat Sink ◽  
Cfd Simulation ◽  
Thermal Control ◽  
Structure Design ◽  
Thermal Design ◽  
Structure Parameters ◽  
Igbt Module ◽  
Key Factor

Thermal design and the working temperature control have been a key factor in the design of electronic devices and system. In this paper, a sort of heat sink collocated with high-power IGBT module, which is commonly used in car-carrying motor control system, is designed based on thermal analysis by means of CFD simulation and computer-aided analyzing, also the influence relations of structure parameters with thermal performance are studied. With thermal control as the overall design objective, structure parameters of heat sink are determined according to the obtained relations. Further, thermal performance of the designed heat sink is simulated and analyzed in CFD software to examine the validity of the design result. In this way, a method of thermal analyzing and structure parameter design for heat sink, which is proved as an efficacious approach, is introduced and can be used to thermal design and analysis for similar products.

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

2005 ◽  
Author(s):  
Ioan Sauciuc ◽  
Ravi Prasher ◽  
Je-Young Chang ◽  
Hakan Erturk ◽  
Gregory Chrysler ◽  
...  
Keyword(s):  
Power Density ◽  
Thermal Performance ◽  
Hot Spot ◽  
Average Power ◽  
Building Blocks ◽  
Thermal Design ◽  
Air Cooling ◽  
Back Side ◽  
Two Phase ◽  
Density Factor

Over the past few years, thermal design for cooling microprocessors has become increasingly challenging mainly because of an increase in both average power density and local power density, commonly referred to as “hot spots”. The current air cooling technologies present diminishing returns, thus it is strategically important for the microelectronics industry to establish the research and development focus for future non air-cooling technologies. This paper presents the thermal performance capability for enabling and package based cooling technologies using a range of “reasonable” boundary conditions. In the enabling area a few key main building blocks are considered: air cooling, high conductivity materials, liquid cooling (single and two-phase), thermoelectric modules integrated with heat pipes/vapor chambers, refrigeration based devices and the thermal interface materials performance. For package based technologies we present only the microchannel building block (cold plate in contact with the back-side of the die). It will be shown that as the hot spot density factor increases, package based cooling technologies should be considered for more significant cooling improvements. In addition to thermal performance, a summary of the key technical challenges are presented in the paper.   This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.

Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging

2011 ◽  
Author(s):  
Sulaman Pashah ◽  
Abul Fazal M. Arif
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Packaging ◽  
Base Plate ◽  
Heat Sinks ◽  
Metallic Base ◽  
Plate Interface ◽  
Pin Fin ◽  
Pin Fins ◽  
Reliability Performance

Heat sinks are used in modern electronic packaging system to enhance and sustain system thermal performance by dissipating heat away from IC components. Pin fins are commonly used in heat sink applications. Conventional metallic pins fins are efficient in low Biot number range whereas high thermal performance can be achieved in high Biot number regions with orthotropic composite pin fins due to their adjustable thermal properties. However, several challenges related to performance as well as manufacturing need to be addressed before they can be successfully implemented in a heat sink design. A heat sink assembly with metallic base plate and polymer composite pin fins is a solution to address manufacturing constraints. During the service life of an electronic packaging, the heat sink assembly is subjected to power cycles. Cyclic thermal stresses will be important at the pin-fin and base-plate interface due to thermal mismatch. The cyclic nature of stresses can lead to fatigue failure that will affect the reliability of the heat sink and electronic packaging. A finite element model of the heat sink is used to investigate the thermal stress cyclic effect on thermo-mechanical reliability performance. The aim is to assess the reliability performance of the epoxy bond at the polymer composite pin fins and metallic base plate interface in a heat-sink assembly.

Thermal Design Guidelines for FC-BGA Package With Hot Spot Problem

2006 ◽  
Author(s):  
Eason Chen ◽  
Jeng Yuan Lai ◽  
Yu-Po Wang ◽  
C. S. Hsiao
Keyword(s):  
Thermal Management ◽  
Heat Sink ◽  
Flip Chip ◽  
Hot Spot ◽  
Design Guidelines ◽  
Thermal Design ◽  
Cfd Modeling ◽  
Bga Packages ◽  
Function Integration ◽  
Hot Spot Problem

With the evolving function integration and power consumption of high-end IC applications, thermal management has become one of the most important concerns of semiconductor designers. In particular, hot spot problem, in recent years, has turned into a popular topic in IC chip thermal management that it comes from the uneven power consumptions in various logical blocks and results in local high temperature that would increase IC chip failure risks. In this paper, thermal evaluations for hot spot impacts on Flip-Chip Ball Grid Array (FC-BGA) packages were presented using CFD modeling technique. The evaluation topics covered hot spot power density effects on substrate designs and heat sink module characterizations including passive heat sink and fan heat sink performance under various hot spot conditions. Finally, thermal suggestions were concluded for package designers to improve the substrate design in substrate via arrangements to effectively dissipate hot spot source. Also heat sink module performance was derived for different ratings of hot spots and external heat sink performance is obtained for the hot spot impact elimination.

S-Shaped Pin-Fins for Enhancement of Overall Performance of the Pin-Fin Heat Sink

2010 ◽  
Author(s):  
T. J. John ◽  
B. Mathew ◽  
H. Hegab
Keyword(s):  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Pumping Power ◽  
Pin Fin ◽  
Pin Fins ◽  
Overall Performance

In this paper the authors are studying the effect of introducing S-shaped pin-fin structures in a micro pin-fin heat sink to enhance the overall thermal performance of the heat sinks. For the purpose of evaluating the overall thermal performance of the heat sink a figure of merit (FOM) term comprising both thermal resistance and pumping power is introduced in this paper. An optimization study of the overall performance based on the pitch distance of the pin-fin structures both in the axial and the transverse direction, and based on the curvature at the ends of S-shape fins is also carried out in this paper. The value of the Reynolds number of liquid flow at the entrance of the heat sink is kept constant for the optimization purpose and the study is carried out over a range of Reynolds number from 50 to 500. All the optimization processes are carried out using computational fluid dynamics software CoventorWARE™. The models generated for the study consists of two sections, the substrate (silicon) and the fluid (water at 278K). The pin fins are 150 micrometers tall and the total structure is 500 micrometer thick and a uniform heat flux of 500KW is applied to the base of the model. The non dimensional thermal resistance and nondimensional pumping power calculated from the results is used in determining the FOM term. The study proved the superiority of the S-shaped pin-fin heat sinks over the conventional pin-fin heat sinks in terms of both FOM and flow distribution. S-shaped pin-fins with pointed tips provided the best performance compared to pin-fins with straight and circular tips.

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