Interaction of Surface Preparation and Cure-Parameters on the Interface Reliability of Flexible Encapsulation in FHE Applications

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Padmanava Choudhury ◽  
Scott Miller
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Surface Preparation ◽  
Peel Strength ◽  
Electronics Industry ◽  
Harsh Environment ◽  
Fe Model ◽  
Experimental Conditions ◽  
Flexible Devices ◽  
Cleaning Methods

Abstract Flexible devices, considered to be the next wave of electronics industry, require flexible encapsulation for protection while conforming to flexibility-needs in end applications. The characteristics of flexible electronics is not only reduced production cost but also thinner, lightweight and non-breakable which creates a new form application for the electronic devices. One such application is use to electronic devices in daily environment to monitor the vitals of one’s body. These devices are often expose to dust, sweat and moisture also they are generally subjected to flexing and folding motion which accrues stresses in those devices. These stresses and the harsh environment are often mitigated by using potting compounds, encapsulants to improve their survivability of the devices. In our study, we have chosen five different formulation of encapsulant subjected it various cure profiles to determine the adhesive strength of the various encapsulant. The benchmark peel strength was developed using a FE-model of the AU-biometric band and encapsulant peel strength at experimental conditions were compared to give us the best performing material. This paper includes the sample geometry which consists of five different encapsulants and two different substrate namely, polyimide and pet tested at four different cure schedule while the substrates were cleaned using two different cleaning methods. The encapulants are compared among each other to create a rank for possible future applications in FHE devices.

Flexible Electronics Based Upon 2D Transition Metal Dichalcogenides

2021 ◽  
Author(s):  
Dongting Jiang ◽  
Zhiyuan Liu ◽  
Zhe Xiao ◽  
Zhengfang Qian ◽  
Yiling Sun ◽  
...  
Keyword(s):  
Transition Metal ◽  
Flexible Electronics ◽  
Space Exploration ◽  
Transition Metal Dichalcogenides ◽  
Electronics Industry ◽  
Inorganic Oxides ◽  
Flexible Devices ◽  
Metal Dichalcogenides ◽  
Materials Used

Flexible devices play an important role in various fields such as electronics, industry, healthcare, military, space exploration, and so on. Traditional materials used for flexible devices include silicon, inorganic oxides,...

Flexible Electronic Devices From Hot Embossing Materials Transfer

2005 ◽  
Author(s):  
Ashante’ Allen ◽  
Andrew Cannon ◽  
William King ◽  
Samuel Graham
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Electronic Devices ◽  
Building Blocks ◽  
Transfer Printing ◽  
Flexible Devices ◽  
Planar Surfaces ◽  
Flexible Electronic ◽  
Semiconductor Nanomaterials ◽  
Flexible Electronic Devices

The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing [1,2] as well as dry transfer techniques [3–5]. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.

Fabricating Microchannels in Elastomer Substrates for Stretchable Electronics

2016 ◽  
Author(s):  
Michelle C. Yuen ◽  
Rebecca K. Kramer
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Stretchable Electronics ◽  
Flexible Substrates ◽  
Soft Sensors ◽  
Elastic Substrate ◽  
Conductive Fluid ◽  
Manufacturing Method ◽  
Flexible Devices ◽  
Soft Electronics

As flexible devices and machines become more ubiquitous, there is a growing need for similarly deformable electronics. Soft polymers continue to be widely used as stretchable and flexible substrates for soft electronics, and in particular, soft sensing. These soft sensors generally consist of a highly elastic substrate with embedded microchannels filled with a conductive fluid. Deforming the substrate deforms the embedded microchannels and induces a change in the electrical resistance through the conductive fluid. Microchannels, thus, are the foundation of flexible electronic devices and sensors. These microchannels have been fabricated using various methods, where the manufacturing method greatly impacts device functionality. In this paper, comparisons are made between the following methods of microchannel manufacturing: cast molding, 3D printing of the elastomer substrate itself, and laser ablation. Further processing of the microchannels into flexible electronics is also presented for all three methods. Lastly, recommended ranges of microchannel sizes and their associated reproducibility and accuracy measures for each manufacturing method are presented.

scholarly journals An Assessment of Surface Treatments for Adhesion of Polyimide Thin Films

Polymers ◽  
2021 ◽  
Vol 13 (12) ◽  
pp. 1955
Author(s):  
Marco Cen-Puc ◽  
Andreas Schander ◽  
Minerva G. Vargas Gleason ◽  
Walter Lang
Keyword(s):  
Flexible Electronics ◽  
Oxygen Plasma ◽  
Reactive Ion Etching ◽  
Peel Test ◽  
Scratch Test ◽  
Peel Strength ◽  
Surface Treatments ◽  
Oxygen Plasma Treatment ◽  
Polyimide Films ◽  
Ion Etching

Polyimide films are currently of great interest for the development of flexible electronics and sensors. In order to ensure a proper integration with other materials and PI itself, some sort of surface modification is required. In this work, microwave oxygen plasma, reactive ion etching oxygen plasma, combination of KOH and HCl solutions, and polyethylenimine solution were used as surface treatments of PI films. Treatments were compared to find the best method to promote the adhesion between two polyimide films. The first selection of the treatment conditions for each method was based on changes in the contact angle with deionized water. Afterward, further qualitative (scratch test) and a quantitative adhesion assessment (peel test) were performed. Both scratch test and peel strength indicated that oxygen plasma treatment using reactive ion etching equipment is the most promising approach for promoting the adhesion between polyimide films.

scholarly journals Sheet Resistance Measurements of Conductive Thin Films: A Comparison of Techniques

Electronics ◽  
2021 ◽  
Vol 10 (8) ◽  
pp. 960
Author(s):  
Mira Naftaly ◽  
Satyajit Das ◽  
John Gallop ◽  
Kewen Pan ◽  
Feras Alkhalil ◽  
...  
Keyword(s):  
Thin Films ◽  
Sheet Resistance ◽  
Flexible Electronics ◽  
Electronic Devices ◽  
Conductivity Measurements ◽  
Terahertz Time Domain Spectroscopy ◽  
Comparison Of Techniques ◽  
Terahertz Frequencies ◽  
Conductive Thin Films ◽  
Multiple Samples

Conductive thin films are an essential component of many electronic devices. Measuring their conductivity accurately is necessary for quality control and process monitoring. We compare conductivity measurements on films for flexible electronics using three different techniques: four-point probe, microwave resonator and terahertz time-domain spectroscopy. Multiple samples were examined, facilitating the comparison of the three techniques. Sheet resistance values at DC, microwave and terahertz frequencies were obtained and were found to be in close agreement.

DEVELOPMENT OF A METHOD FOR OPTIMAL PLACEMENT OF ELEMENTS ON THE SWITCHING FIELD OF THE PRINTING UNIT IN ORDER TO PROVIDE THE SPECIFIED THERMAL MODES OF RADIO ELECTRONIC MEANS

2020 ◽  
pp. 37-47
Author(s):  
Zang Wang Thanh ◽  
S.U. Uvajsov ◽  
V.V. Chernoverskaya
Keyword(s):  
Electronic Devices ◽  
Electronics Industry ◽  
Performance Characteristics ◽  
Optimal Placement ◽  
Switching Field ◽  
Stages Of Development ◽  
Technical Design ◽  
Design Studies ◽  
Printed Circuit ◽  
Quality And Reliability

Currently technical design is one of the most important stages of development and production of electronic tools that are widely used in the electronics industry. At the stage of design studies in the framework of solving the problem of improving the quality and reliability of electronic devices manufactured in the form of printed circuit assemblies (PU), receive a constructive implementation and the main performance characteristics of future products.

A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial

2021 ◽  
Vol 21 (12) ◽  
pp. 5960-5964
Author(s):  
Kwon Jai Lee ◽  
Jee Young Oh ◽  
Kyong Nam Kim
Keyword(s):  
Residual Stress ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Rapid Development ◽  
Electronic Devices ◽  
Copper Film ◽  
Electronics Industry ◽  
Electronic Components ◽  
Graphene Layers ◽  
Electronic Parts

With the rapid development of the electronics industry, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life of various electronic devices is considerably shortened. Therefore, it is essential to efficiently dissipate the heat generated from the device to extend product life and ensure high efficiency of electronic components. This study evaluated how residual stress is impacted by the thickness of the deposited copper film, which is widely used as a heat dissipation material, and the number of graphene layers. The results confirmed that the residual stress decreased with increasing thickness. Moreover, the residual stress changed based on the transfer area of graphene, which had an elastic modulus eight times that of copper, indicating that the residual stress of the deposited copper film can be controlled.

A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000207-000214
Author(s):  
Rakesh Kumar
Keyword(s):  
High Temperature ◽  
Electronic Devices ◽  
Electronics Industry ◽  
Performance Requirements ◽  
Cell Components ◽  
Temperature Exposure ◽  
Electronic Parts ◽  
Long Term Performance ◽  
Term Performance

A recent development in the area of high temperature and UV stable polymers, which offers solutions to many existing packaging and reliability challenges of electronics industry, is described. Packaging, protection and reliability of various electronic devices and component, including PCB's, MEMS, optoelectronic devices, fuel cell components and nano-electronic parts are, becoming more challenging due to their long-term performance requirements. This high temperature polymer, named Parylene HT, offers solutions to many existing protective, packaging and reliability issues in the electronics and medical industries, in part because of its excellent electrical and mechanical properties, chemical inertness and long-term thermal stability at high temperature exposure (up to 350°C long-term and short-term at 450 °C). Experimental results and trial runs demonstrate the ability of Parylene HT coating to meet the growing requirements of higher dielectric capabilities, higher temperature integrity, mechanical processing, etc. of a dynamic electronics industry. In addition, Parylene HT polymer coating truly conforms to parts due to its molecular level deposition characteristics. Its suitability and biocompatibility encourage researchers to explore Parylene HT's role in sensors and in active electronic devices for various industries.

New insights and perspectives into biological materials for flexible electronics

2017 ◽  
Vol 46 (22) ◽  
pp. 6764-6815 ◽  
Author(s):  
Lili Wang ◽  
Di Chen ◽  
Kai Jiang ◽  
Guozhen Shen
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Biological Materials ◽  
Flexible Electronic ◽  
Critical Components ◽  
Flexible Electronic Devices

Materials based on biological materials are becoming increasingly competitive and are likely to be critical components in flexible electronic devices.

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