DEVELOPMENT OF A METHOD FOR OPTIMAL PLACEMENT OF ELEMENTS ON THE SWITCHING FIELD OF THE PRINTING UNIT IN ORDER TO PROVIDE THE SPECIFIED THERMAL MODES OF RADIO ELECTRONIC MEANS

2020 ◽  
pp. 37-47
Author(s):  
Zang Wang Thanh ◽  
S.U. Uvajsov ◽  
V.V. Chernoverskaya
Keyword(s):  
Electronic Devices ◽  
Electronics Industry ◽  
Performance Characteristics ◽  
Optimal Placement ◽  
Switching Field ◽  
Stages Of Development ◽  
Technical Design ◽  
Design Studies ◽  
Printed Circuit ◽  
Quality And Reliability

Currently technical design is one of the most important stages of development and production of electronic tools that are widely used in the electronics industry. At the stage of design studies in the framework of solving the problem of improving the quality and reliability of electronic devices manufactured in the form of printed circuit assemblies (PU), receive a constructive implementation and the main performance characteristics of future products.

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

scholarly journals Usage of Sims and Auger Test Methods in the Production of Multilayer Printed Circuit Boards

1984 ◽  
Vol 11 (3) ◽  
pp. 225-229
Author(s):  
E. Toth ◽  
P. Banlaki ◽  
I. Hajdu ◽  
J. Pinkola
Keyword(s):  
Copper Foil ◽  
Printed Circuit Boards ◽  
Copper Surface ◽  
Test Methods ◽  
Main Constituent ◽  
Circuit Boards ◽  
Adhesion Properties ◽  
Printed Circuit ◽  
Quality And Reliability ◽  
Type Electrolyte

The quality and reliability of multilayer boards are determined by the adhesion strength between the copper sheets and the epoxy-glass laminates. The adhesion properties of copper foil may be improved by mechanical or chemical roughening. The most efficient method is, however, to oxidize the copper surface.Oxidized copper layers have been tested by thermogravimetry. Subsequently the oxide layers have been tested by Auger and SIMS techniques. The results showed that the main constituent of the oxide layer produced in a sodium hypochlorite type electrolyte is Cu20.

A Study on the Control of Residual Stress of Copper Thick-Film Using 2D Nanomaterial

2021 ◽  
Vol 21 (12) ◽  
pp. 5960-5964
Author(s):  
Kwon Jai Lee ◽  
Jee Young Oh ◽  
Kyong Nam Kim
Keyword(s):  
Residual Stress ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Rapid Development ◽  
Electronic Devices ◽  
Copper Film ◽  
Electronics Industry ◽  
Electronic Components ◽  
Graphene Layers ◽  
Electronic Parts

With the rapid development of the electronics industry, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life of various electronic devices is considerably shortened. Therefore, it is essential to efficiently dissipate the heat generated from the device to extend product life and ensure high efficiency of electronic components. This study evaluated how residual stress is impacted by the thickness of the deposited copper film, which is widely used as a heat dissipation material, and the number of graphene layers. The results confirmed that the residual stress decreased with increasing thickness. Moreover, the residual stress changed based on the transfer area of graphene, which had an elastic modulus eight times that of copper, indicating that the residual stress of the deposited copper film can be controlled.

Advanced Build-up Materials and Processes for Packages with Fine Line and Space

2014 ◽  
Vol 2014 (1) ◽  
pp. 000444-000447 ◽  
Author(s):  
Yoshio Nishimura ◽  
Hirohisa Narahashi ◽  
Shigeo Nakamura ◽  
Tadahiko Yokota
Keyword(s):  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Additive Process ◽  
Fine Line ◽  
Printed Circuit ◽  
Low Dielectric ◽  
Line Space

Printed circuit boards manufactured by a semi-additive process are widely used for packaging substrates. Along with increasing demands of downsizing electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to be miniaturized with high density of circuit wirings. We report our insulation build-up materials and processes for advanced packages with fine line/space and high reliability. The insulation materials we developed show low coefficient of thermal expansion (CTE), low dielectric loss tangent and good thinner insulation reliability. They can produce fine line and space (FLS) under 10μm pitch by a semi-additive process.

A High Temperature and UV Stable Vapor Phase Polymer for Electronics Applications

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000207-000214
Author(s):  
Rakesh Kumar
Keyword(s):  
High Temperature ◽  
Electronic Devices ◽  
Electronics Industry ◽  
Performance Requirements ◽  
Cell Components ◽  
Temperature Exposure ◽  
Electronic Parts ◽  
Long Term Performance ◽  
Term Performance

A recent development in the area of high temperature and UV stable polymers, which offers solutions to many existing packaging and reliability challenges of electronics industry, is described. Packaging, protection and reliability of various electronic devices and component, including PCB's, MEMS, optoelectronic devices, fuel cell components and nano-electronic parts are, becoming more challenging due to their long-term performance requirements. This high temperature polymer, named Parylene HT, offers solutions to many existing protective, packaging and reliability issues in the electronics and medical industries, in part because of its excellent electrical and mechanical properties, chemical inertness and long-term thermal stability at high temperature exposure (up to 350°C long-term and short-term at 450 °C). Experimental results and trial runs demonstrate the ability of Parylene HT coating to meet the growing requirements of higher dielectric capabilities, higher temperature integrity, mechanical processing, etc. of a dynamic electronics industry. In addition, Parylene HT polymer coating truly conforms to parts due to its molecular level deposition characteristics. Its suitability and biocompatibility encourage researchers to explore Parylene HT's role in sensors and in active electronic devices for various industries.

Development of a versatile analytical protocol for the comprehensive determination of the elemental composition of smartphone compartments on the example of printed circuit boards

2018 ◽  
Vol 10 (31) ◽  
pp. 3864-3871 ◽  
Author(s):  
B. Bookhagen ◽  
W. Obermaier ◽  
C. Opper ◽  
C. Koeberl ◽  
T. Hofmann ◽  
...  
Keyword(s):  
Elemental Composition ◽  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Comprehensive Method ◽  
Analytical Protocol ◽  
Comprehensive Determination

A comprehensive method for the determination of metals in electronic devices was developed and tested on smartphones.

scholarly journals Development of a Physical Separation Route for the Concentration of Base Metals from Old Wasted Printed Circuit Boards

Minerals ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1014
Author(s):  
Pedro Jorge Walburga Keglevich de Buzin ◽  
Weslei Monteiro Ambrós ◽  
Irineu Antônio Schadach de Brum ◽  
Rejane Maria Candiota Tubino ◽  
Carlos Hoffmann Sampaio ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Preliminary Evidence ◽  
Composition Analysis ◽  
Base Metals ◽  
Circuit Boards ◽  
Physical Separation ◽  
Printed Circuit ◽  
Processing Circuit

Wastes from old electronic devices represent a significant part of the electronic scrap generated in developing countries, being commonly sold by collectors as low-value material to recycling hubs abroad. Upgrading the quality of this waste type could drive the revenue of recyclers, and thus, boost the recycling market. On this basis, this study investigated the possibility of concentrating metals from old wasted printed circuit boards through a physical separation-based route. Preparation of samples comprised fragmentation, size classification, density, and magnetic separation steps, followed by chemical and macro composition analysis. Cu, Al, Fe, and Sn constituted the major metals encountered in the scraps, including some peak concentrations of Zn, Sb, Pb, Ba, and Mn. Four distinct concentrate products could be obtained after suitable processing: (a) a light fraction composed of plastics and resins; (b) an aluminum concentrate; (c) a magnetic material concentrate, containing mainly iron; (d) a final concentrate containing more than 50% in mass of copper and enriched with nonferrous metals. Preliminary evidence showed that further processes, like the separation of copper wires through drumming, can potentially improve the effectiveness of the proposed processing circuit and should guide future works.

scholarly journals Extraction of Selected Metals from Waste Printed Circuit Boards by Bioleaching Acidophilic Bacteria

2021 ◽  
Vol 1 (1) ◽  
Author(s):  
Anna HOŁDA ◽  
Aldona KRAWCZYKOWSKA
Keyword(s):  
Metal Content ◽  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Economic Benefits ◽  
Technological Innovations ◽  
Secondary Source ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Acidophilic Bacteria ◽  
Waste Printed Circuit Boards

Technological innovations and increased demand for electronic devices resulted in production of more and more waste with highmetal content. Worldwide, 50 million tons of WEEE (Waste from Electrical and Electronic Equipment) are generated each year. Giventhe metal content present in electrical waste (e-waste), it is considered to be an urban mine and, if properly treated, can serve as analternative secondary source of metals. Waste printed circuit boards (WPCBs) that constitute approx. 3-5% of WEEE by weight areof particular importance. They contain, on average, 30-40% of metals by weight, with higher purity than in minerals. With environmental and economic benefits in mind, increasing attention is being paid to the development of processes to recover metals and othervaluable materials from WPCBs. The research presented in the article aimed at assessing the usefulness of the biotechnological methodfor leaching of selected metals from e-waste. The results indicate that it is possible to mobilize metals from WPCBs using microorganisms such as Acidithiobacillus ferroxidans bacteria 

scholarly journals Mechatronics Education in School of Design – Development of Educational Tool to Study Design Expression Using Mechatronics

2011 ◽  
Vol 23 (5) ◽  
pp. 629-637 ◽  
Author(s):  
Atsushi Mitani ◽  
◽  
Tamon Hosoya
Keyword(s):  
Product Design ◽  
Study Design ◽  
Electronic Devices ◽  
Educational Tool ◽  
Design Development ◽  
Human Actions ◽  
Printed Circuit ◽  
Actual Model ◽  
Control Feedback

We developed a printed circuit substrate for studying electronic devices and a PIC processor for design expressions in the mechatronics class of Sapporo City University, School of Design, Product Design Course. We then taught PIC assembler programming for LED blinking control, feedback from sensors and switches, the servomotor driving, and sequential feedback. Students in this class was given a subject to realize an actual model for the design expression of something that moves in reaction to human actions using these skills.

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