Silicon- and aluminum-nitride films deposited by reactive low-voltage ion plating and reactive dc-magnetron sputtering
Keyword(s):
Keyword(s):
2021 ◽
Keyword(s):
2002 ◽
Vol 11
(3-6)
◽
pp. 413-417
◽
2008 ◽
Vol 8
(9)
◽
pp. 4557-4560
◽
Keyword(s):
2017 ◽
Vol 57
(1S)
◽
pp. 01AD06
◽
2013 ◽
Vol 27
(10)
◽
pp. 1112-1116
◽
Keyword(s):