ENHANCEMENT OF ADHESION STRENGTH AND TRIBOLOGICAL PERFORMANCE OF CVD DIAMOND FILMS ON TUNGSTEN CARBIDE SUBSTRATES WITH HIGH COBALT CONTENT VIA AMORPHOUS SiC INTERLAYERS

2019 ◽  
Vol 26 (09) ◽  
pp. 1950051
Author(s):  
YUANPING HE ◽  
YU-XIAO CUI ◽  
FANG-HONG SUN
Keyword(s):  
Tungsten Carbide ◽  
Diamond Film ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Cobalt Content ◽  
Indentation Tests ◽  
Friction Performance ◽  
Film Substrate ◽  
Amorphous Sic ◽  
And Tungsten

In this study, the diamond films are deposited on tungsten carbide substrates with 10[Formula: see text]wt.% Co via hot filament chemical vapor deposition (HFCVD). Amorphous SiC (a-SiC) interlayers with various thicknesses are fabricated between the diamond films and tungsten carbide substrates via precursor pyrolysis to promote the adhesion and friction performance of diamond films. Indentation tests are performed to evaluate the adhesion of the as-fabricated diamond films, which show that the a-SiC interlayers can greatly improve the adhesive strength between diamond films and tungsten carbide substrates with 10[Formula: see text]wt.% Co. Moreover, the thickness of a-SiC interlayer is of great importance for the effectiveness on the film–substrate adhesion enhancement. The optimum thickness of a-SiC interlayer is 1[Formula: see text][Formula: see text]m. Afterwards, ball-on-disc experiments are chosen to check the tribological properties of the as-fabricated a-SiC interlayered diamond film specimen with the optimum interlayer thickness, which exhibits lower friction coefficient than the conventional diamond film with no interlayer.

Uniform Deposition of Chemical Vapor Deposition Diamond Films on Slender Tungsten Wires

2016 ◽  
Vol 848 ◽  
pp. 618-623
Author(s):  
Xin Chang Wang ◽  
Xiao Tian Shen ◽  
Tian Qi Zhao ◽  
Fang Hong Sun ◽  
Bin Shen
Keyword(s):  
Chemical Vapor Deposition ◽  
Diamond Film ◽  
Vapor Deposition ◽  
High Surface ◽  
Diamond Films ◽  
Surface Hardness ◽  
Chemical Vapor ◽  
Chemical Vapor Deposition Diamond ◽  
Substrate Adhesion ◽  
Film Substrate

In the present study, high-quality chemical vapor deposition (CVD) micro-crystalline diamond (MCD) film was successfully deposited on the surface of the Φ0.5 mm×120 mm tungsten wire using a special designed graphitic jig for supporting the substrate and a two-step deposition procedure for guaranteeing the uniformity of as-deposited diamond film. It is proved that as-deposited film indeed presented much more uniform thickness than that obtained using a conventional jig described in the previous literature, and a very thick WC interlayer spontaneously formed between the substrate and the diamond film, which together with as-deposited MCD film have significant effects on mechanical properties of the wire. Generally speaking, the coated wire remains extremely high surface hardness of the MCD film and considerable toughness of the substrate, along with favorable film-substrate adhesion. It is recognized that these the coated tungsten wires have broad application prospects, but the technologies for depositing diamond films that are thick enough on even longer and thinner wires still need further investigation.

Nano-Crystalline Diamond Films Deposited on Copper Substrate by MPCVD Method

2011 ◽  
Vol 117-119 ◽  
pp. 1310-1314
Author(s):  
Xing Rui Li ◽  
Xin Wei Shi ◽  
Ning Yao ◽  
Xin Chang Wang
Keyword(s):  
Diamond Film ◽  
Deposition Time ◽  
Microwave Plasma ◽  
Copper Substrate ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Annealing Process ◽  
Adhesive Properties ◽  
Plasma Chemical Vapor Deposition ◽  
Nano Crystalline

Nano-crystalline diamond (NCD) films with good adhesion were deposited on flexible copper substrate with Ni interlayer by Microwave Plasma Chemical Vapor Deposition (MPCVD). In this paper, two-stage method was used to improve the adhesion between the copper substrates and the diamond films. The effect of deposition time of the first stage on the morphology, crystal structure, non-diamond phase and adhesive properties of diamond films was investigated. The performance and structure of the diamond films were studied by Scanning Electron Microscope (SEM), Raman Spectroscopy (Raman) and X-Ray Diffraction (XRD). The results showed that the films were nano-crystalline diamond films positively. Impress method was used to examine the adhesion between diamond film and the substrate. When deposition time is 1.5h, the adhesion between diamond film and the copper substrate is better than the others. When it was 2.5h or longer, because the graphite layers existed as intermediate, the adherence between the diamond films and copper substrates was very poor. Therefore, the diamond films were easily peeled off from the substrates. Otherwise, the second stage called annealing process after the deposition played an important role to the adhesion. The films would be easily peeled off by curling without the annealing process.

Examination of the material properties and performance of thin-diamond film cutting tool inserts produced by arc-jet and hot filament chemical vapor deposition

1996 ◽  
Vol 11 (7) ◽  
pp. 1765-1775 ◽  
Author(s):  
James M. Olson ◽  
Michael J. Dawes
Keyword(s):  
Wear Resistance ◽  
Chemical Vapor Deposition ◽  
Diamond Film ◽  
Vapor Deposition ◽  
Cutting Tool ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Polycrystalline Diamond ◽  
And Performance ◽  
Hot Filament

Thin diamond film coated WC-Co cutting tool inserts were produced using arc-jet and hot-filament chemical vapor deposition. The diamond films were characterized using SEM, XRD, and Raman spectroscopy to examine crystal structure, fracture mode, thickness, crystalline orientation, diamond quality, and residual stress. The performance of the tools was evaluated by comparing the wear resistance of the materials to brazed polycrystalline diamond-tipped cutting tool inserts (PCD) while machining A390 aluminum (18% silicon). Results from the experiments carried out in this study suggest that the wear resistance of the thin diamond films is primarily related to the grain boundary strength, crystal orientation, and the density of microdefects in the diamond film.

Compact and Efficient HFCVD for Electronic Grade Diamond and Related Materials

2009 ◽  
Vol 1203 ◽  
Author(s):  
R. Vispute ◽  
Andrew Seiser ◽  
Geun Lee ◽  
Jaurette Dozier ◽  
Jeremy Feldman ◽  
...  
Keyword(s):  
Diamond Film ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Deposition Efficiency ◽  
Raman Shift ◽  
Compositional Variation ◽  
Force Microscopy ◽  
Substrate Rotation ◽  
Sample Rotation ◽  
Hot Filament

AbstractA compact and efficient hot filament chemical vapor deposition system has been designed for growing electronic-grade diamond and related materials. We report here the effect of substrate rotation on quality and uniformity of HFCVD diamond films on 2” wafers, using two to three filaments with power ranging from 500 to 600 Watt. Diamond films have been characterized using x-ray diffraction, Raman Spectroscopy, scanning electron microscopy and atomic force microscopy. Our results indicate that substrate rotation not only yields uniform films across the wafer, but crystallites grow larger than without sample rotation. Well-faceted microcrystals are observed for wafers rotated at 10 rpm. We also find that the Raman spectrum taken from various locations indicate no compositional variation in the diamond film and no significant Raman shift associated with intrinsic stresses. Results are discussed in the context of growth uniformity of diamond film to improve deposition efficiency for wafer-based electronic applications.

Growth Time Optimization of Fine Grained Diamond Coated Drills for Machining CFRP

2016 ◽  
Vol 836-837 ◽  
pp. 333-339 ◽  
Author(s):  
Xin Chang Wang ◽  
Xiao Tian Shen ◽  
Tian Qi Zhao ◽  
Fang Hong Sun ◽  
Bin Shen
Keyword(s):  
Residual Stress ◽  
Protective Coatings ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Cutting Edge ◽  
Growth Time ◽  
Protective Effects ◽  
Initial Shape ◽  
Fine Grained ◽  
Film Substrate

Carbon fiber reinforced plastics (CFRP), which are widely used in the aerospace and some other new-tech industries, are considered very difficult to machine due to the material anisotropic and inhomogeneous features. Chemical vapor deposition (CVD) diamond films are suitable as protective coatings on cutting tools for machining advanced composite materials, owing to their extremely high hardness, favorable wear resistance, low friction coefficient and high thermal conductivity. Among different types of diamond films, the fine grained diamond (FGD) film can provide much more favorable environment for machining CFRP due to the small grain size, low surface roughness and the retentivity for the sharpness of the cutting edge. In the present study, aiming at drilling CFRP, FGD films of different thicknesses are deposited on Φ3 mm drills by controlling the growth time, adopting the common-used hot filament CVD (HFCVD) technology. It can be directly proved by deposition experiments that overlong growth time can induce spontaneous film delamination and removal before the cooling stage, probably as a result of the excessive residual stress concentrated on the complicated surfaces. As demonstrated by the cutting tests, with increasing the growth time, the main failure mode of the FGD coated drill changes from film delamination to flank wear/tipping to film delamination, and the maximum tool life exists when the growth time is moderate, because the flimsy film cannot provide sufficient protective effects on the film-substrate interface and even hasn’t totally cover the substrate, while there’s relatively higher residual stress in the film that is too thick, and such the residual stress can significantly deteriorate the film-substrate adhesion. Moreover, during the life cycle of each FGD film, relatively shorter growth time often means the slightly better hole quality, attributed to the retentivity of the initial shape of the uncoated drill that is optimal designed for machining CFRP, especially the weaker passivation of the cutting edge.

INFLUENCE OF EMBEDDED TUNGSTEN PARTICLES ON MECHANICAL BEHAVIORS OF CVD DIAMOND COATING

2019 ◽  
Vol 27 (02) ◽  
pp. 1950097
Author(s):  
YAO WANG ◽  
PING HE ◽  
YINGCHAO CHEN ◽  
MUSEN LIU ◽  
CHENG LI ◽  
...  
Keyword(s):  
Crack Propagation ◽  
Tungsten Carbide ◽  
Chemical Vapor ◽  
High Hardness ◽  
Sem Analysis ◽  
Diamond Coating ◽  
Indentation Tests ◽  
Doping Technique ◽  
Cvd Diamond Coating ◽  
Hot Filament

Diamond coating has gained intensive attraction in the tribological field due to its high hardness. However, its weak flexibility always gives rise to the fragile crack, which causes the delamination and peeling off from substrate. In this work, a novel deposition method combining the conventional hot filament chemical vapor deposition (HFCVD) and particles doping technique is proposed to balance the hardness and flexibility of diamond coating, by which the diamond coating with tungsten particles is deposited on the co-cemented tungsten carbide substrate. The as-deposited diamond coating is characterized by scanning electron microscopy (SEM) analysis, surface roughness and Raman spectrum. The indentation tests are conducted to evaluate the crack propagation of diamond coating. Tribological behavior is examined on a reciprocating ball-on-plate tribometer. The results indicate that tungsten carbide may be formed between tungsten particles and diamond coating. The W–WC–amorphous carbon–diamond structural coating can validly inhibit the crack propagation and decrease the friction coefficient. Hence, adding embedding particles into the diamond coating may provide a useful way in enhancing the mechanical properties of diamond coating.

DYNAMIC SCALING PHENOMENA IN DIAMOND FILM GROWTH

2001 ◽  
Vol 08 (03n04) ◽  
pp. 347-351 ◽  
Author(s):  
M. CATTANI ◽  
M. C. SALVADORI
Keyword(s):  
Chemical Vapor Deposition ◽  
Differential Equations ◽  
Diamond Film ◽  
Vapor Deposition ◽  
Film Growth ◽  
Diamond Films ◽  
Growth Dynamics ◽  
Chemical Vapor ◽  
Dynamic Scaling ◽  
Diamond Film Growth

In this paper we investigate how the growth dynamics of diamond films, synthesized by plasma-enhanced chemical vapor deposition, can be explained within the framework of the Edwards–Wilkinson and Kardar–Parisi–Zhang stochastic differential equations.

Carbon Nanotube Array Thermal Interfaces on Chemical Vapor Deposited Diamond

2007 ◽  
Author(s):  
Baratunde A. Cola ◽  
Xianfan Xu ◽  
Timothy S. Fisher
Keyword(s):  
Carbon Nanotube ◽  
Diamond Film ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Photoacoustic Technique ◽  
Nanotube Array ◽  
Carbon Nanotube Array ◽  
Chemical Vapor Deposited ◽  
Cnt Arrays ◽  
Film Interface

Carbon nanotube (CNT) arrays have been directly synthesized on plasma-enhanced chemical vapor deposited diamond films in the same growth chamber. The diamond films were grown using a bias-enhanced nucleation technique that produces relatively smooth and flat films. The thermal resistances of the CNT array/diamond film interface were measured using a photoacoustic technique to be approximately 12 mm2·K/W at moderate pressures.

SIMULATION AND EXPERIMENTAL RESEARCH ON ADHESION ENHANCEMENT BETWEEN DIAMOND FILMS AND WC-Co SUBSTRATES BY EMPLOYING AMORPHOUS SiC INTERLAYER

2019 ◽  
Vol 26 (06) ◽  
pp. 1850201
Author(s):  
YU-XIAO CUI ◽  
FANG-HONG SUN
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Surface Topography ◽  
Diamond Film ◽  
Simulation Analysis ◽  
Diamond Films ◽  
Residual Stress Distribution ◽  
Atomic Force ◽  
3D Surface Topography ◽  
Amorphous Sic

The finite element method (FEM) is employed to analyze the residual stress distribution of bi-layer (a-SiC [Formula: see text] diamond) film system, and the adhesion enhancement mechanism of a-SiC interlayer is further investigated. The influence of a-SiC interlayer on the surface topography of WC-Co substrate is taken into consideration by adopting a 3D surface topography model agreeing with the Atomic Force Microscope (AFM) characterization of a-SiC interlayer. For the sake of comparison, the stress distribution of a diamond film with no interlayer is also simulated. The simulation analysis reveals that the residual stress distribution is much more homogeneous after employing the a-SiC interlayer, which is supposed to be of great importance to the adhesion enhancement of diamond films. Afterwards, the diamond films with and without a-SiC interlayer are fabricated on WC-Co substrates. Raman mapping is carried out to measure the real residual stress distribution of as-fabricated a-SiC diamond films, which is in accordance with the simulation results. Moreover, the a-SiC interlayered diamond film exhibits better adhesion than the diamond film with no interlayer in adhesion evaluation, which can be ascribed to the more homogeneous residual stress distribution and better interfacial bonding after introducing the a-SiC interlayer.

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