scholarly journals 3D Heat Transfer Analysis of a Miniature Copper-Water Vapor Chamber with Wicked Pillars Array

2013 ◽  
Vol 2013 ◽  
pp. 1-10 ◽  
Author(s):  
Yong Jiang ◽  
Gerardo Carbajal ◽  
C. B. Sobhan ◽  
Ji Li
Keyword(s):  
Numerical Simulations ◽  
Thermal Performance ◽  
Three Dimensional ◽  
Experimental Results ◽  
Heat Transfer Analysis ◽  
Working Fluid ◽  
High Heat Flux ◽  
Vapor Chamber ◽  
Total Thermal Resistance ◽  
Pillar Array

A three-dimensional analysis of the heat and mass transfer phenomena inside a vapor chamber is essential for correctly understanding its thermal performance limitations and structural optimization. This paper presents a complete three-dimensional numerical analysis and comparative study of two different miniature vapor chambers designs with identical external geometry and dimensions but different internal structures: one having a wicked pillar array and the other one without the wicked pillars array. The distribution of the wicked pillar array in the vapor core was aligned. Detailed comparative experimental results are also reported, which were performed to verify the calculations from the numerical simulations. It was found that the numerical and experimental results agree quite well, especially at high heat flux values. It is also observed that the vapor chamber with wicked pillars had a better thermal performance than the conventional design, with a 5% decrease in terms of total thermal resistance due to the added extra channels that allow a better flow of the working fluid to the evaporator surface. An insight into how improving the thermal performance of a vapor chamber is provided through the detailed three-dimensional numerical simulations.

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

2019 ◽  
Vol 141 (5) ◽  
Author(s):  
Sangbeom Cho ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Mechanical Design ◽  
Three Dimensional ◽  
Circuit Board ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Conduction Model ◽  
Printed Circuit

We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through successful completion of the following tasks: patterning copper micropillar wick structures on PCB, mechanical design and fabrication of condenser, device sealing, and device vacuuming and charging with working fluid. Two prototype vapor chambers with distinct micropillar array designs are fabricated, and their thermal performance tested under various heat inputs supplied from a 2 mm × 2 mm heat source. Thermal performance of the device improves with heat inputs, with the maximum performance of ∼20% over copper plated PCB with the same thickness. A three-dimensional computational fluid dynamics/heat transfer (CFD/HT) numerical model of the vapor chamber, coupled with the conduction model of the packaging substrate is developed, and the results are compared with test data.

Application of Al2O3 Nanofluid on Sintered Copper-Powder Vapor Chamber for Electronic Cooling

2013 ◽  
Vol 789 ◽  
pp. 423-428 ◽  
Author(s):  
Nandy Putra ◽  
Wayan Nata Septiadi ◽  
Ranggi Sahmura ◽  
Cahya Tri Anggara
Keyword(s):  
Heat Flux ◽  
Thermal Performance ◽  
Base Fluid ◽  
Cooling System ◽  
High Heat ◽  
Electronic Cooling ◽  
Working Fluid ◽  
High Heat Flux ◽  
Processing Unit ◽  
Vapor Chamber

The development of electronic devices pushes manufacturers to create smaller microchips with higher performance than ever before. Microchip with higher working load produces more heat. This leads to the need of cooling system that able to dissipate high heat flux. Vapor chamber is one of highly effective heat spreading device. Its ability to dissipate high heat flux density in limited space made it potential for electronic cooling application, like Central Processing Unit (CPU) cooling system. The purpose of this paper is to study the application of Al2O3Nanofluid as working fluid for vapor chamber. Vapor chamber performance was measured in real CPU working condition. Al2O3Nanofluid with concentration of 0.1%, 0.3%, 0.5%, 1%, 2% and 3% as working fluid of the vapor chamber were tested and compared with its base fluid, water. Al2O3nanofluid shows better thermal performance than its base fluid due to the interaction of particle enhancing the thermal conductivity. The result showed that the effect of working fluid is significant to the performance of vapor chamber at high heat load, and the application of Al2O3nanofluid as working fluid would enhance thermal performance of vapor chamber, compared to other conventional working fluid being used before.

scholarly journals Thermal Assessment of Nano-Particulate Graphene-Water/Ethylene Glycol (WEG 60:40) Nano-Suspension in a Compact Heat Exchanger

Energies ◽  
2019 ◽  
Vol 12 (10) ◽  
pp. 1929 ◽  
Author(s):  
M. Sarafraz ◽  
Mohammad Safaei ◽  
Zhe Tian ◽  
Marjan Goodarzi ◽  
Enio Bandarra Filho ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Ethylene Glycol ◽  
Thermal Performance ◽  
Evaluation Criteria ◽  
High Heat ◽  
Operating Conditions ◽  
Working Fluid ◽  
High Heat Flux ◽  
Micro Channel

In the present study, we report the results of the experiments conducted on the convective heat transfer of graphene nano-platelets dispersed in water-ethylene glycol. The graphene nano-suspension was employed as a coolant inside a micro-channel and heat-transfer coefficient (HTC) and pressure drop (PD) values of the system were reported at different operating conditions. The results demonstrated that the use of graphene nano-platelets can potentially augment the thermal conductivity of the working fluid by 32.1% (at wt. % = 0.3 at 60 °C). Likewise, GNP nano-suspension promoted the Brownian motion and thermophoresis effect, such that for the tests conducted within the mass fractions of 0.1%–0.3%, the HTC of the system was improved. However, a trade-off was identified between the PD value and the HTC. By assessing the thermal performance evaluation criteria (TPEC) of the system, it was identified that the thermal performance of the system increased by 21% despite a 12.1% augmentation in the PD value. Furthermore, with an increment in the fluid flow and heat-flux applied to the micro-channel, the HTC was augmented, showing the potential of the nano-suspension to be utilized in high heat-flux thermal applications.

Thermal and Manufacturing Design Considerations for Silicon-Based Embedded Microchannel-Three-Dimensional Manifold Coolers—Part 2: Parametric Study of EMMCs for High Heat Flux (∼1 kW/cm2) Power Electronics Cooling

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Ki Wook Jung ◽  
Sougata Hazra ◽  
Heungdong Kwon ◽  
Alisha Piazza ◽  
Edward Jih ◽  
...  
Keyword(s):  
Heat Flux ◽  
Pressure Drop ◽  
Power Electronics ◽  
Parametric Study ◽  
Three Dimensional ◽  
Working Fluid ◽  
Inlet Temperature ◽  
High Heat Flux ◽  
Dimensional Manifold ◽  
Power Capability

Abstract Thermal management of power electronics modules is one of the limiting factors in the peak power capability of the traction inverter system and overall efficiency of the e-drive. Liquid cooling using embedded microchannels with a three-dimensional (3D)-manifold cooler (EMMC) is a promising technology capable of removing heat fluxes of >1 kW/cm2 at tens of kPa pressure drop. In this work, we utilize computational fluid dynamics (CFD) simulations to conduct a parametric study of selected EMMC designs to improve the thermofluidic performance for a 5 mm × 5 mm heated area with the applied heat flux of 800 W/cm2 using single-phase water as working fluid at inlet temperature of 25 °C. We implemented strategies such as: (i) symmetric distribution of manifold inlet/outlet conduits, (ii) reducing the thickness of cold-plate (CP) substrate, and (iii) increasing fluid–solid interfacial area in CP microchannels, which resulted in a reduction in thermal resistance from 0.1 for baseline design to 0.04 cm2 K/W, while the pressure drop increased from 8 to 37 kPa.

Experimental Investigation On a Thin Loop Heat Pipe with New Evaporator Structure

2021 ◽  
Author(s):  
Ai Ueno ◽  
Shuto Tomita ◽  
Hosei Nagano
Keyword(s):  
Critical Role ◽  
Three Dimensional ◽  
Experimental Results ◽  
Working Fluid ◽  
Stable Operation ◽  
Temperature Hysteresis ◽  
Loop Heat Pipes ◽  
Operation Temperature ◽  
Transport Length

Abstract This paper presents thin loop heat pipes (tLHPs) with evaporator thickness of 1 mm and a one-way transport length of 200 mm. Grooves and liquid cores are mounted on the evaporator case in the design of a flat evaporator. Liquid cores play a critical role in reducing the pressure drop in the wick and in increasing the path length for heat transfer. A one-dimensional steady model was applied to the design of the tLHP. New tLHPs with thin evaporator (26 × 24 × t1 mm) was fabricated by a three-dimensional printer. Firstly, two kinds of tLHP systems were (type-1) fabricated with different wick materials - micro glass paper and Shirasu porous glass (SPG). Ethanol was selected as a working fluid. The experimental results showed the both LHPs can transport heat up to 12 W. Secondary, the evaporator structure was modified based on the experimental results with the type-1 tLHP, and the tLHP with SPG wick (type-2) was fabricated. The experimental results demonstrated the stable operation. The operation temperature was 83 °C, and the thermal resistance became 1.98 °C/W. The power cycle test at the range of a heat load from 5 to 10 W was also conducted. No temperature hysteresis was observed during three cycles.

Circulation Effectiveness of Working Fluid in Inclined Micro Heat Pipes

2015 ◽  
Vol 789-790 ◽  
pp. 422-425
Author(s):  
Fun Liang Chang ◽  
Yew Mun Hung
Keyword(s):  
Heat Transfer ◽  
Heat Pipe ◽  
Thermal Performance ◽  
Heat Pipes ◽  
Operating Conditions ◽  
Circulation Rate ◽  
Working Fluid ◽  
High Heat Flux ◽  
Micro Heat Pipe ◽  
Micro Heat Pipes

Micro heat pipe is a two-phase heat transfer device offering effective high heat-flux removal in electronics cooling. Essentially, micro heat pipe relies on the phase change processes, namely evaporation and condensation, and the circulation of working fluid to function as heat transfer equipment. The vast applications of micro heat pipe in portable appliances necessitate its functionality under different orientations with respect to gravity. Therefore, its thermal performance is strongly related to its orientation. By incorporating solid wall conduction, together with the continuity, momentum, and energy equations of the working fluid, a mathematical model is developed to investigate the heat and fluid flow characteristics of inclined micro heat pipes. We investigate both the favorable and adverse effects of gravity on the circulation rate which is intimately related to the thermal performance of micro heat pipes. The effects of gravity, through the angle of inclination, on the circulation strength and heat transport capacity are analysed. This study serves as a useful analytical tool in the micro heat pipe design and performance analysis, associated with different inclinations and operating conditions.

Experimental investigation on the thermal performance of three-dimensional vapor chamber for LED automotive headlamps

2019 ◽  
Vol 157 ◽  
pp. 113478 ◽  
Author(s):  
Zhimin Lu ◽  
Pengfei Bai ◽  
Bin Huang ◽  
Alex Henzen ◽  
Reinder Coehoorn ◽  
...  
Keyword(s):  
Experimental Investigation ◽  
Thermal Performance ◽  
Three Dimensional ◽  
Vapor Chamber

scholarly journals Analysis on thermal and hydraulic performance of a T-shaped vapor chamber designed for motorcycle led lights

2019 ◽  
Vol 23 (1) ◽  
pp. 137-148 ◽  
Author(s):  
Qifei Jian ◽  
Cong Li ◽  
Li Wang
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Working Fluid ◽  
Large Temperature ◽  
Vapor Chamber ◽  
Cooling Conditions ◽  
Circulation Characteristic ◽  
Large Pressure ◽  
Led Lights ◽  
Heat Loads

Experiment and numerical analyses were conducted to study the thermal performance and circulation characteristic of the working fluid of a T-shaped vapor chamber special designed for the motorcycle LED light. The influences of heat loads and cooling magnitude were experimentally investigated. Results show that both the heat loads and cooling conditions have strong influences on the thermal performance of the vapor chamber, and the thermal resistance in the extended section occupies over 75.8% of the overall thermal resistance of the vapor chamber. Simulation results indicate that large pressure drop occurs along the extended section of the vapor chamber, and causes large temperature difference along the extended section.

Experimental Investigation of a Flat-Plate Oscillating Heat Pipe With Modified Evaporator and Condenser

2014 ◽  
Author(s):  
M. J. Rhodes ◽  
M. R. Taylor ◽  
J. G. Monroe ◽  
S. M. Thompson
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flat Plate ◽  
Thermal Performance ◽  
High Heat ◽  
Working Fluid ◽  
High Heat Flux ◽  
Oscillating Heat Pipe ◽  
Lower Heat ◽  
Operating Temperatures

The thermal performance of a flat-plate oscillating heat pipe (FP-OHP) - with modified evaporator and condenser was experimentally investigated during high heat flux conditions. The copper FP-OHP (101.6 × 101.6 × 3.18 mm3) possessed two inter-connected layers of 1.02 mm2 square channels with the evaporator and condenser possessing two parallel, 0.25 × 0.51 mm2 square microchannels. The microchannels were integrated to enhance evaporation and condensation heat transfer to improve the FP-OHP’s ability to transport high heat flux. The FP-OHP was oriented vertically and locally heated with a 14.52 cm2 heating block at its base and cooled with a water block that provided either: 20 °C, 40 °C, or 60 °C operating temperatures. A FP-OHP without embedded microchannels was also investigated for baseline performance comparison. Both FP-OHPs were filled with Novec HFE-7200 (3M) working fluid at a filling ratio of approximately 80% by volume. The maximum temperature of each FP-OHP was recorded versus time for various heat inputs for the investigated operating temperatures. The results indicate that the integrated microchannels enhance the FP-OHP’s thermal performance for all operating temperatures. At 20 °C, 40 °C, and 60 °C, the microchannel-embedded evaporator and condenser dissipated 80 W, 65 W, and 55 W more than the baseline control with a minimum thermal resistance of 0.219 °C/W, 0.205 °C/W, and 0.170 °C/W, respectively — corresponding to a percent enhancement on-the-order of 25%. This percent enhancement increased with operating temperature. It has also been shown that Novec HFE-7200 allows the FP-OHP to start at relatively lower heat inputs — as low as 35 W, demonstrating that this working fluid can enhance heat transfer even at lower heat flux applications.

Heat Transfer Investigation of an Additively Manufactured Minichannel Heat Exchanger

2019 ◽  
Author(s):  
Hamidreza Rastan ◽  
Amir Abdi ◽  
Monika Ignatowicz ◽  
Bejan Hamawandi ◽  
Poh Seng Lee ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Exchanger ◽  
Single Phase ◽  
Three Dimensional ◽  
Heat Fluxes ◽  
Experimental Results ◽  
Working Fluid ◽  
Minichannel Heat Exchanger ◽  
Simulation Results ◽  
Good Agreement

Abstract This study investigates the thermal performance of laminar single-phase flow in an additively manufactured minichannel heat exchanger both experimentally and numerically. Distilled water was employed as the working fluid, and the minichannel heat exchanger was made from aluminum alloy (AlSi10Mg) through direct metal laser sintering (DMLS). The minichannel was designed with a hydraulic diameter of 2.86 mm. The Reynolds number ranged from 175 to 1360, and the heat exchanger was tested under two different heat fluxes of 1.5 kWm−2 and 3 kWm−2. A detailed experiment was conducted to obtain the thermal properties of AlSi10Mg. Furthermore, the heat transfer characteristics of the minichannel heat exchanger was analyzed numerically by solving a three-dimensional conjugate heat transfer using the COMSOL Multiphysics® to verify the experimental results. The experimental results were also compared to widely accepted correlations in literature. It is found that 95% and 79% of the experimental data are within ±10% range of both the simulation results and the values from the existing correlations, respectively. Hence, the good agreement found between the experimental and simulation results highlights the possibility of the DMLS technique as a promising method for manufacturing future multiport minichannel heat exchangers.

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