scholarly journals Friction-Induced Nanofabrication: A Review

2021 ◽  
Vol 34 (1) ◽  
Author(s):  
Bingjun Yu ◽  
Linmao Qian
Keyword(s):  
Focused Ion Beam ◽  
Low Cost ◽  
Ion Beam ◽  
Semiconductor Industry ◽  
Scanning Probe ◽  
Nanoscale Science And Engineering ◽  
Positive Role ◽  
Alternative Technologies ◽  
Ic Manufacturing ◽  
Nanoscale Science

AbstractAs the bridge between basic principles and applications of nanotechnology, nanofabrication methods play significant role in supporting the development of nanoscale science and engineering, which is changing and improving the production and lifestyle of the human. Photo lithography and other alternative technologies, such as nanoimprinting, electron beam lithography, focused ion beam cutting, and scanning probe lithography, have brought great progress of semiconductor industry, IC manufacturing and micro/nanoelectromechanical system (MEMS/NEMS) devices. However, there remains a lot of challenges, relating to the resolution, cost, speed, and so on, in realizing high-quality products with further development of nanotechnology. None of the existing techniques can satisfy all the needs in nanoscience and nanotechnology at the same time, and it is essential to explore new nanofabrication methods. As a newly developed scanning probe microscope (SPM)-based lithography, friction-induced nanofabrication provides opportunities for maskless, flexible, low-damage, low-cost and environment-friendly processing on a wide variety of materials, including silicon, quartz, glass surfaces, and so on. It has been proved that this fabrication route provides with a broad application prospect in the fabrication of nanoimprint templates, microfluidic devices, and micro/nano optical structures. This paper hereby involved the principals and operations of friction-induced nanofabrication, including friction-induced selective etching, and the applications were reviewed as well for looking ahead at opportunities and challenges with nanotechnology development. The present review will not only enrich the knowledge in nanotribology, but also plays a positive role in promoting SPM-based nanofabrication.

To Eliminate Curtain Effect of FIB TEM Samples by a Combination of Sample Dicing and Backside Milling

2014 ◽  
Author(s):  
Jian-Shing Luo ◽  
Hsiu Ting Lee
Keyword(s):  
Sample Preparation ◽  
Focused Ion Beam ◽  
Preparation Method ◽  
Low Cost ◽  
Ion Beam ◽  
Sample Preparation Method ◽  
Site Specific ◽  
Dual Beam ◽  
Transmission Electron

Abstract Several methods are used to invert samples 180 deg in a dual beam focused ion beam (FIB) system for backside milling by a specific in-situ lift out system or stages. However, most of those methods occupied too much time on FIB systems or requires a specific in-situ lift out system. This paper provides a novel transmission electron microscopy (TEM) sample preparation method to eliminate the curtain effect completely by a combination of backside milling and sample dicing with low cost and less FIB time. The procedures of the TEM pre-thinned sample preparation method using a combination of sample dicing and backside milling are described step by step. From the analysis results, the method has applied successfully to eliminate the curtain effect of dual beam FIB TEM samples for both random and site specific addresses.

Cross-sectional microanalysis for tracking the effect of solvent on the morphological evaluation of PLA/AgNWs bionanocomposties

2021 ◽  
pp. 096739112110230
Author(s):  
Meltem Sezen ◽  
Busra Tugba Camic
Keyword(s):  
Focused Ion Beam ◽  
Silver Nanowires ◽  
Low Cost ◽  
Ion Beam ◽  
Lower Surface ◽  
Polymer Matrices ◽  
Elemental Distribution ◽  
Medical Sciences ◽  
Surface Area Ratio ◽  
Cross Sectional

The emphasis of biocompatible polymer applications in medical sciences and biotechnology has remarkably increased. Developing new low-cost, low-toxicity and lightweight composite forms of biopolymers has become even more attractive since the addition of new species into polymer matrices assist to improve biomedical activities of such materials to a higher extend. Developments in nanoscience and nanotechnology recently contribute to controlled fabrication and ultraprecise diagnosis of such materials. This study concerns the observation of solution processing effects in the fabrication of porous PLA/AGNWs bionanocomposite coatings using electron and ion processing based serial cross-sectioning and high-resolution imaging. The nanostructuring and characterization were both performed in a focused ion-beam-scanning electron microscope (FIB-SEM) platform. HR-SEM imaging was conducted on-site to track solvent based morphological property alterations of PLA and PLA/AgNWs structures. Simultaneous SEM-EDS analyses revealed the elemental distribution and the chemical composition along the cross-sectioned regions of the samples. Accordingly, it was observed that, in case of acetone dissolved materials, both pristine PLA and PLA/AgNWs samples sustained their foamy structure. When chloroform was used as the solvent, the porosity of the polymer matrices was less and the resulting structure was found to be denser than samples dissolved in acetone with a lower surface area ratio inside the material. This can be attributed to the rapid volatilization of acetone compared to chloroform, and hence the formation of interconnected pore network. For both nanocomposite biopolymers dissolved in acetone and chloroform, silver nanowires were homogeneously distributed throughout PLA matrices.

FIB Techniques for Analysis of Metallurgical Specimens

2000 ◽  
Vol 6 (S2) ◽  
pp. 524-525 ◽  
Author(s):  
Michael W. Phaneuf ◽  
Jian Li
Keyword(s):  
Focused Ion Beam ◽  
Materials Science ◽  
Ion Beam ◽  
Semiconductor Industry ◽  
Zirconium Alloys ◽  
Chemical Information ◽  
Specimen Preparation ◽  
Orientation Contrast ◽  
Imaging Tool ◽  
Zinc Coatings

Focused ion beam (FIB) microscopes, the use of which is well established in the semiconductor industry, are rapidly gaining attention in the field of materials science, both as a tool for producing site specific, parallel sided TEM specimens and as a stand alone specimen preparation and imaging tool.Both FIB secondary ion images (FIB SII) and FIB secondary electron images (FIB SEI) contain novel crystallographic and chemical information. The ability to see “orientation contrast” in FIB SEI and to a lesser extent SII is well known for cubic materials and more recently stress-free FIB sectioning combined with FIB imaging have been shown to reveal evidence of plastic deformation in metallic specimens. Particularly in hexagonal metals, FIB orientation contrast is sometimes reduced or eliminated by the FIB sectioning process. We have successfully employed FIB gas assisted etching during FIB sectioning using XeF2 for zirconium alloys and Cl2 for zinc coatings on steels to retain orientation contrast during subsequent imaging.

Molding of Three-Dimensional Microcomponents

2006 ◽  
Author(s):  
W. N. P. Hung ◽  
M. M. Agnihotri ◽  
M. Y. Ali ◽  
S. Yuan
Keyword(s):  
Focused Ion Beam ◽  
New Technologies ◽  
Electrical Discharge Machining ◽  
Ion Beam ◽  
Semiconductor Industry ◽  
Three Dimensional ◽  
Cost Effective ◽  
Molecular Structures ◽  
Minimum Size ◽  
Ion Beam Sputtering

Traditional micromanufacturing has been developed for semiconductor industry. Selected micro electrical mechanical systems (MEMS) have been successfully developed and implemented in industry. Since current MEMS are designed for manufacture using microelectronics processes, they are limited to two-dimensional profiles and semiconductor based materials. Such shape and material constraints would exclude many applications that require biocompatibility, dynamic stress, and high ductility. New technologies are sought to fabricate three dimensional microcomponents using robust materials for demanding applications. To be cost effective, such microdevices must be economically mass producible. Molding is one of the promising replication techniques to mass produce components from polymers and polymer-based composites. This paper presents the development of a micromolding process to produce thermoplastic microcomponents. Mold design required precision fitting and was integrated with a vacuum pump to minimize air trap in mold cavities. Nickel and aluminum mold inserts were used for the study; their cavities were fabricated by combinations of available micromachining processes like laser micromachining, micromilling, micro electrical discharge machining, and focused ion beam sputtering. High and low density polyethylene, polystyrene polymers were used for this study. The effects of polymer molecular structures, molding temperature, time, and pressure on molding results were studied. Simulation of stress in the microcomponents, plastic flow in microchannels, and mold defects was performed and compare with experimental data. The research results showed that a microcomponent can be fabricated to the minimum size of 10 ± 1μm (0.0004 inch) with surface roughness <10 nm Rt. Molding of micro-size geartrains and orthopedic meso-size fasteners was completed to illustrate the capability of this process.

scholarly journals Three-Dimensional Nanoscale Mapping of State-of-the-Art Field-Effect Transistors (FinFETs)

2017 ◽  
Vol 23 (5) ◽  
pp. 916-925
Author(s):  
Pritesh Parikh ◽  
Corey Senowitz ◽  
Don Lyons ◽  
Isabelle Martin ◽  
Ty J. Prosa ◽  
...  
Keyword(s):  
Field Effect ◽  
Focused Ion Beam ◽  
Field Effect Transistors ◽  
Ion Beam ◽  
Semiconductor Industry ◽  
Three Dimensional ◽  
Atom Probe ◽  
Physical Structure ◽  
Oxide Semiconductor ◽  
Device Performance

AbstractThe semiconductor industry has seen tremendous progress over the last few decades with continuous reduction in transistor size to improve device performance. Miniaturization of devices has led to changes in the dopants and dielectric layers incorporated. As the gradual shift from two-dimensional metal-oxide semiconductor field-effect transistor to three-dimensional (3D) field-effect transistors (finFETs) occurred, it has become imperative to understand compositional variability with nanoscale spatial resolution. Compositional changes can affect device performance primarily through fluctuations in threshold voltage and channel current density. Traditional techniques such as scanning electron microscope and focused ion beam no longer provide the required resolution to probe the physical structure and chemical composition of individual fins. Hence advanced multimodal characterization approaches are required to better understand electronic devices. Herein, we report the study of 14 nm commercial finFETs using atom probe tomography (APT) and scanning transmission electron microscopy–energy-dispersive X-ray spectroscopy (STEM-EDS). Complimentary compositional maps were obtained using both techniques with analysis of the gate dielectrics and silicon fin. APT additionally provided 3D information and allowed analysis of the distribution of low atomic number dopant elements (e.g., boron), which are elusive when using STEM-EDS.

Enabling nanoscale science and engineering via highly flexible, low-cost, maskless lithography

2005 ◽  
Author(s):  
Henry I. Smith ◽  
Rajesh Menon ◽  
Amil Patel ◽  
David Chao ◽  
Michael Walsh ◽  
...  
Keyword(s):  
Low Cost ◽  
Maskless Lithography ◽  
Science And Engineering ◽  
Nanoscale Science And Engineering ◽  
Nanoscale Science

scholarly journals Polymer micro-lenses as an long-coupling-distance interfacing layer in low-cost optical coupling solution between optical fibers and photonic integrated waveguide circuits

2019 ◽  
Vol 11 (4) ◽  
pp. 121
Author(s):  
Andrzej Kaźmierczak ◽  
Mateusz Słowikowski ◽  
Krystian Pavłov ◽  
Maciej Filipiak ◽  
Ryszard Piramidowicz
Keyword(s):  
Optical Fiber ◽  
Focused Ion Beam ◽  
Low Cost ◽  
Ion Beam ◽  
Single Mode ◽  
Optical Fiber Communication ◽  
Japanese Journal ◽  
Spot Size ◽  
Optical Signal ◽  
Silicon On Insulator

We present a low-cost scheme for non-permanent optical signal coupling for prospective application in single use photonic integrated chips. The proposed scheme exploits the use of polymer kinoform microlenses. The feasibility of the proposed solution is demonstrated by the experimental investigation of the optical signal coupling from single mode optical fiber (SMF) to the test structure of SixNy integrated waveguide. Full Text: PDF ReferencesM. Smit et al., "An introduction to InP-based generic integration technology," Semiconductor Science and Technology, 29 (8), 083001, 2014 CrossRef R. Baets et al., "Silicon Photonics: silicon nitride versus silicon-on-insulator," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optical Society of America, 2016), paper Th3J.1. CrossRef K. Shiraishi et al., "A silicon-based spot-size converter between single-mode fibers and Si-wire waveguides using cascaded tapers," Appl. Phys. Lett. 91, 141120 (2007) CrossRef Y. Sobu et al., "GaInAsP/InP waveguide dual core spot size converter for optical fiber,"IEEE Photonic Society 24th Annual Meeting, 469-470, (2011). CrossRef F. Van Laere et al., "Compact and Highly Efficient Grating Couplers Between Optical Fiber and Nanophotonic Waveguides," Journal of Lightwave Technology, vol. 25, no. 1, pp. 151-156, Jan. 2007. CrossRef A. Kaźmierczak et al., "Light coupling and distribution or Si3N4/SiO2 integrated multichannel single mode sensing system," Opt. Eng. 48, 2009, pp. 014401 CrossRef M. Rossi et al., "Arrays of anamorphic phase-matched Fresnel elements for diode-to-fiber coupling," Appl. Opt. 34, 2483-2488 (1995) CrossRef M. Prasciolu et al, "Fabrication of Diffractive Optical Elements On-Fiber for Photonic Applications by Nanolitography," Japanese Journal of Applied Physics, Volume 42, (2003) CrossRef F.Schiappelli et al., "Efficient fiber-to-waveguide coupling by a lens on the end of the optical fiber fabricated by focused ion beam milling" Microelectronic Engineering Volumes 73-74, pp.397-404 (2004) CrossRef

Sign in / Sign up

Export Citation Format

Share Document