A Platform for Three-dimensional On-chip Photonics: Multi-bonded Silicon-On-Insulator wafers

2011 ◽  
Author(s):  
Amir Hosseini ◽  
Babak Fallahazad ◽  
David N. Kwong ◽  
Yang Zhang ◽  
Emanuel Tutuc ◽  
...  
Keyword(s):  
Three Dimensional ◽  
Silicon On Insulator ◽  
On Chip

Multimode T-junctions based on truncated Eaton lens

Frequenz ◽  
2020 ◽  
Vol 74 (7-8) ◽  
pp. 271-276
Author(s):  
Seyed Hadi Badri ◽  
Mohsen Mohammadzadeh Gilarlue
Keyword(s):  
Optical Interconnects ◽  
Three Dimensional ◽  
Emerging Technology ◽  
Higher Order ◽  
Silicon On Insulator ◽  
Transmitted Power ◽  
Mode Division Multiplexing ◽  
Higher Order Modes ◽  
On Chip ◽  
Three Dimensional Simulations

AbstractMode-division multiplexing (MDM) in silicon-on-insulator platform is an emerging technology to increase the channel number of a single wavelength carrier by the number of modes and consequently increase the transmission capacity of on-chip optical interconnects. We propose and theoretically demonstrate a multimode branching structure based on the truncated Eaton lens. The proposed T-junctions efficiently convert the higher-order modes into fundamental modes; therefore, they can be potentially employed to manipulate modes in MDM systems. The designed T-junctions are implemented by varying the guiding layer’s thickness on a silicon-on-insulator platform. The three-dimensional simulations verify that the proposed structures can split the TE2 (TE1) mode into the fundamental modes with an average transmitted power of 32% (47%) in a 1550–1600 nm bandwidth.

scholarly journals Electromechanically reconfigurable optical nano-kirigami

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Shanshan Chen ◽  
Zhiguang Liu ◽  
Huifeng Du ◽  
Chengchun Tang ◽  
Chang-Yin Ji ◽  
...  
Keyword(s):  
Near Infrared ◽  
Large Range ◽  
Three Dimensional ◽  
High Contrast ◽  
Si Substrate ◽  
High Modulation ◽  
Gold Nanostructure ◽  
Infrared Wavelengths ◽  
On Chip ◽  
Nano Electromechanical System

AbstractKirigami, with facile and automated fashion of three-dimensional (3D) transformations, offers an unconventional approach for realizing cutting-edge optical nano-electromechanical systems. Here, we demonstrate an on-chip and electromechanically reconfigurable nano-kirigami with optical functionalities. The nano-electromechanical system is built on an Au/SiO2/Si substrate and operated via attractive electrostatic forces between the top gold nanostructure and bottom silicon substrate. Large-range nano-kirigami like 3D deformations are clearly observed and reversibly engineered, with scalable pitch size down to 0.975 μm. Broadband nonresonant and narrowband resonant optical reconfigurations are achieved at visible and near-infrared wavelengths, respectively, with a high modulation contrast up to 494%. On-chip modulation of optical helicity is further demonstrated in submicron nano-kirigami at near-infrared wavelengths. Such small-size and high-contrast reconfigurable optical nano-kirigami provides advanced methodologies and platforms for versatile on-chip manipulation of light at nanoscale.

scholarly journals Towards lab-on-chip ultrasensitive ethanol detection using photonic crystal waveguide operating in the mid infrared

Nanophotonics ◽  
2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Ali Rostamian ◽  
Ehsan Madadi-Kandjani ◽  
Hamed Dalir ◽  
Volker J. Sorger ◽  
Ray T. Chen
Keyword(s):  
Photonic Crystal ◽  
Slow Light ◽  
High Sensitivity ◽  
Guided Wave ◽  
Silicon On Insulator ◽  
Group Index ◽  
Photonic Crystal Waveguide ◽  
Mid Infrared ◽  
Lab On Chip ◽  
On Chip

Abstract Thanks to the unique molecular fingerprints in the mid-infrared spectral region, absorption spectroscopy in this regime has attracted widespread attention in recent years. Contrary to commercially available infrared spectrometers, which are limited by being bulky and cost-intensive, laboratory-on-chip infrared spectrometers can offer sensor advancements including raw sensing performance in addition to use such as enhanced portability. Several platforms have been proposed in the past for on-chip ethanol detection. However, selective sensing with high sensitivity at room temperature has remained a challenge. Here, we experimentally demonstrate an on-chip ethyl alcohol sensor based on a holey photonic crystal waveguide on silicon on insulator-based photonics sensing platform offering an enhanced photoabsorption thus improving sensitivity. This is achieved by designing and engineering an optical slow-light mode with a high group-index of n g  = 73 and a strong localization of modal power in analyte, enabled by the photonic crystal waveguide structure. This approach includes a codesign paradigm that uniquely features an increased effective path length traversed by the guided wave through the to-be-sensed gas analyte. This PIC-based lab-on-chip sensor is exemplary, spectrally designed to operate at the center wavelength of 3.4 μm to match the peak absorbance for ethanol. However, the slow-light enhancement concept is universal offering to cover a wide design-window and spectral ranges towards sensing a plurality of gas species. Using the holey photonic crystal waveguide, we demonstrate the capability of achieving parts per billion levels of gas detection precision. High sensitivity combined with tailorable spectral range along with a compact form-factor enables a new class of portable photonic sensor platforms when combined with integrated with quantum cascade laser and detectors.

scholarly journals High-Performance On-Chip Silicon Beamsplitter Based on Subwavelength Metamaterials for Enhanced Fabrication Tolerance

Nanomaterials ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 1304
Author(s):  
Raquel Fernández de Cabo ◽  
David González-Andrade ◽  
Pavel Cheben ◽  
Aitor V. Velasco
Keyword(s):  
Integrated Circuits ◽  
Fundamental Mode ◽  
High Performance ◽  
Three Dimensional ◽  
High Sensitivity ◽  
Power Splitting ◽  
Excess Loss ◽  
Power Splitters ◽  
On Chip ◽  
Efficient Power

Efficient power splitting is a fundamental functionality in silicon photonic integrated circuits, but state-of-the-art power-division architectures are hampered by limited operational bandwidth, high sensitivity to fabrication errors or large footprints. In particular, traditional Y-junction power splitters suffer from fundamental mode losses due to limited fabrication resolution near the junction tip. In order to circumvent this limitation, we propose a new type of high-performance Y-junction power splitter that incorporates subwavelength metamaterials. Full three-dimensional simulations show a fundamental mode excess loss below 0.1 dB in an ultra-broad bandwidth of 300 nm (1400–1700 nm) when optimized for a fabrication resolution of 50 nm, and under 0.3 dB in a 350 nm extended bandwidth (1350–1700 nm) for a 100 nm resolution. Moreover, analysis of fabrication tolerances shows robust operation for the fundamental mode to etching errors up to ± 20 nm. A proof-of-concept device provides an initial validation of its operation principle, showing experimental excess losses lower than 0.2 dB in a 195 nm bandwidth for the best-case resolution scenario (i.e., 50 nm).

A new efficient multi‐task applications mapping for three‐dimensional Network‐on‐Chip based MPSoC

2021 ◽  
Author(s):  
Khadidja Gaffour ◽  
Mohammed Kamel Benhaoua ◽  
Abou El Hassan Benyamina ◽  
Amit Kumar Singh
Keyword(s):  
Three Dimensional ◽  
Network On Chip ◽  
Dimensional Network ◽  
On Chip

Current and Future Three-Dimensional LSI Integration Technology by “chip on chip”, “chip on wafer” and “wafer on wafer”

2006 ◽  
Vol 970 ◽  
Author(s):  
Manabu Bonkohara ◽  
Makoto Motoyoshi ◽  
Kazutoshi Kamibayashi ◽  
Mitsumasa Koyanagi
Keyword(s):  
Three Dimensional ◽  
Process Time ◽  
Future Technology ◽  
Sensor Device ◽  
Research Level ◽  
Key Technologies ◽  
The Future ◽  
Chip Size ◽  
On Chip ◽  
Chip Chip

ABSTRACTRecently the development of three dimensional LSI (3D-LSI) has been accelerated and its stage has changed from the research level or limited production level to the investigation level with a view to mass production. This paper describes the current and the future 3D-LSI technologies which we have considered and imagined. The current technology is taken our Chip Size Package (CSP) for sensor device, for instance. In the future technology, there are the five key technologies are described. And considering con and pro of the current 3D LSI stacked approach, such as CoC (Chip on Chip), CoW (Chip on Wafer) and WoW (Wafer on Wafer), We confirmed that CoW combined with Super-Smart-Stack (SSS™) technology will shorten the process time per chip at the same level as WoW approach and is effective to minimize process cost.

Germanium Photodiode Arrays on Silicon-On-Insulator with On-Chip Bias Circuit

2021 ◽  
pp. 1-1
Author(s):  
Keye Sun ◽  
Junyi Gao ◽  
Robert Costanzo ◽  
Ta-Ching Tzu ◽  
Steven M. Bowers ◽  
...  
Keyword(s):  
Silicon On Insulator ◽  
Photodiode Arrays ◽  
On Chip

Three-dimensional tissue model in direct contact with an on-chip vascular bed enabled by removable membranes

Lab on a Chip ◽  
2022 ◽  
Author(s):  
Yoshikazu Kameda ◽  
Surachada Chuaychob ◽  
Miwa Tanaka ◽  
Yang Liu ◽  
Ryu Okada ◽  
...  
Keyword(s):  
Tissue Culture ◽  
Direct Contact ◽  
Three Dimensional ◽  
Culture Period ◽  
Tissue Model ◽  
Vascular Bed ◽  
On Chip

Three-dimensional (3D) tissue culture is a powerful tool for understanding physiological events. However, 3D tissues still have limitations in their size, culture period, and maturity, which are caused by the...

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