Mechanical and thermal properties of polymer micro- and nanocomposites
Keyword(s):
Abstract We have analyzed the thermal conductivity and the tensile modulus of composite materials within the framework of the Halpin-Tsai and Lewis-Nielsen models. The parameter linking thermal conductivity and tensile modulus together is the shape factor of the (nano)filler. Model analysis based on experimental data shows that particle aggregation into a weak mechanical network may be required to achieve good correlation between thermal conductivity and the Young’s modulus when analyzing the data within the framework of a single model and requiring the same value of the shape factor. We believe this approach will make quantitative analysis of nanocomposite thermal properties possible.
1994 ◽
Vol 41
(10)
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pp. 1209-1214
2022 ◽
2019 ◽
Vol 234
(1)
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pp. 82-95
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2016 ◽
Vol 28
◽
pp. 108-114