Electromigration Reliability of Electroplated Gold Interconnects

2014 ◽  
Vol 1692 ◽  
Author(s):  
Steve H. Kilgore ◽  
Dieter K. Schroder

ABSTRACTThe electromigration lifetimes of a very large quantity of passivated electroplated Au interconnects were measured utilizing high-resolution in-situ resistance monitoring equipment. Application of moderate accelerated stress conditions with current density limited to 2 MA/cm2 and oven temperatures in the range of 300°C to 375°C prevented large Joule-heated temperature gradients and electrical overstress failures. A Joule-heated Au film temperature increase of 10°C on average was determined from measured temperature coefficients of resistance (TCRs). A failure criterion of 50% resistance degradation was selected to avoid thermal runaway and catastrophic open circuit failures. All Au lifetime distributions followed log-normal statistics. An activation energy of 0.80 ± 0.05 eV was measured from constant-current electromigration tests at multiple temperatures. A current density exponent of 1.91 ± 0.03 was extracted from multiple current densities at a single constant temperature.

2015 ◽  
Vol 1754 ◽  
pp. 25-30
Author(s):  
Munekazu Motoyama ◽  
Makoto Ejiri ◽  
Yasutoshi Iriyama

ABSTRACTWe have studied electrochemical Li deposition/dissolution processes at amorphous solid electrolyte (LiPON) interfaces with 30-nm-thick-Cu-current collectors at different current densities by in-situ scanning electron microscopy (SEM). When the current density is smaller than 300 μA cm−2, Li islands continue to grow under a Cu film without coalescing with their neighbors. Consequently, they produce small cracks in the Cu film leading to isolated Li rod growth from the cracks. On the other hand, a current density of 1.0 mA cm−2 provokes the nucleation of Li islands with a higher number density. They rapidly coalesce under a Cu film in all lateral directions before cracking the Cu film. High current density conditions therefore suppress Li rod growths.


Author(s):  
I-Fei Tsu ◽  
D.L. Kaiser ◽  
S.E. Babcock

A current theme in the study of the critical current density behavior of YBa2Cu3O7-δ (YBCO) grain boundaries is that their electromagnetic properties are heterogeneous on various length scales ranging from 10s of microns to ˜ 1 Å. Recently, combined electromagnetic and TEM studies on four flux-grown bicrystals have demonstrated a direct correlation between the length scale of the boundaries’ saw-tooth facet configurations and the apparent length scale of the electrical heterogeneity. In that work, enhanced critical current densities are observed at applied fields where the facet period is commensurate with the spacing of the Abrikosov flux vortices which must be pinned if higher critical current density values are recorded. To understand the microstructural origin of the flux pinning, the grain boundary topography and grain boundary dislocation (GBD) network structure of [001] tilt YBCO bicrystals were studied by TEM and HRTEM.


1987 ◽  
Vol 115 ◽  
Author(s):  
W. E. Rhoden ◽  
J. V. Maskowitz ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd

IntroductionElectromigration in aluminum films has been identified as an increasing concern for integrated circuit reliability. Electromigration is the mass transport of atoms in a conductor under a current stress. Electromigration occurs in conductors experiencing current densities greater than 105 A/cm2 and is accelerated by high temperature. The damage to aluminum films manifests itself in the formation of voids, hillocks and whiskers along the conductor. This paper presents a test vehicle preparation procedure which can be used to investigate electromigration.


1985 ◽  
Vol 53 ◽  
Author(s):  
F. Namavar ◽  
J. I. Budnick ◽  
F. H. Sanchez ◽  
H. C. Hayden

ABSTRACTWe have carried out a study to understand the mechanisms involved in the formation of buried SIO2 by high dose implantation of oxygen into Si targets. Oxygen ions were implanted at 150 keV with doses up to 2.5 X 1018 ions/cm2 and a current density of less than 10 μA/cm2 into Si 〈100〉 at room and liquid nitrogen temperatures. In-situ Rutherford backscattering (RBS) analysis clearly indicates the formation of uniform buried SIO2 for both room and liquid nitrogen temperatures for doses above 1.5 X 1018/cm2.Oxygen ions were implanted at room temperature into crystalline quartz to doses of about 1018 ions cm2 at 150 keV, with a current density of 〈10〉10 μA/cm2. The RBS spectra of the oxygen implanted quartz cannot be distinguished from those of unimplanted ones. Furthermore, Si ions were implanted into crystalline quartz at 80 keV and dose of 1 X 1017 Si/cm2, and a current aensity of about 1 μA/cm2. However, no signal from Si in excess of the SiO2 ratio could be observed. Our results obtained by RBS show that implantation of either Si+ or O into SiO2 under conditions stated above does not create a layer whose Si:O ratio differs measurably from that of SiO2.


CrystEngComm ◽  
2018 ◽  
Vol 20 (45) ◽  
pp. 7329-7336 ◽  
Author(s):  
Xingang Kong ◽  
Xing Wang ◽  
Dingying Ma ◽  
Jianfeng Huang ◽  
Jiayin Li ◽  
...  

Porous network Zn2Ti3O8 platelike nanoarchitecture was prepared by an ion exchange reaction and further in situ topotactic transformation, and it exhibited an enhanced reversibility capacity of 408 mA h g−1 after 1000 cycles at a current density of 1 Ag−1.


1986 ◽  
Vol 87 (6) ◽  
pp. 907-932 ◽  
Author(s):  
J H Caldwell ◽  
D T Campbell ◽  
K G Beam

The loose patch voltage clamp has been used to map Na current density along the length of snake and rat skeletal muscle fibers. Na currents have been recorded from (a) endplate membrane exposed by removal of the nerve terminal, (b) membrane near the endplate, (c) extrajunctional membrane far from both the endplate and the tendon, and (d) membrane near the tendon. Na current densities recorded directly on the endplate were extremely high, exceeding 400 mA/cm2 in some patches. The membrane adjacent to the endplate has a current density about fivefold lower than that of the endplate, but about fivefold higher than the membrane 100-200 micron from the endplate. Small local variations in Na current density are recorded in extrajunctional membrane. A sharp decrease in Na current density occurs over the last few hundred micrometers from the tendon. We tested the ability of tetrodotoxin to block Na current in regions close to and far from the endplate and found no evidence for toxin-resistant channels in either region. There was also no obvious difference in the kinetics of Na current in the two regions. On the basis of the Na current densities measured with the loose patch clamp, we conclude that Na channels are abundant in the endplate and near-endplate membrane and are sparse close to the tendon. The current density at the endplate is two to three orders of magnitude higher than at the tendon.


2011 ◽  
Vol 43 (3) ◽  
pp. 313-326 ◽  
Author(s):  
M. Spasojevic ◽  
L. Ribic-Zelenovic ◽  
A. Maricic

Cobalt and nickel powders of three different compositions: Ni0.8Co0.2, Ni0.55Co0.45 and Ni0.2Co0.8 were obtained by electrodeposition from an ammonium chloride-sulphate solution. It was shown that the microstructure and morphology of the powders depended on the deposition current density as well as on the bath composition. Amorphous powder of Ni0.8Co0.2 was obtained at the current density higher than 200 mA cm-2, but nanocrystalline powders having the same composition were obtained at current densities lower than 200 mAcm-2. The nanocrystalline powders with lower Ni contents (0.55 and 0.2) obtained at a current density ranging from 40 mA cm-2 to 450 mA cm-2 were solid solutions of two phases, FCC (?-Ni) and HCP (?-Co) ones. The increase of the HCP phase in the powder was a result of both the Co content increase in the powder and decrease of the deposition current density.


Author(s):  
J. V. Maskowitz ◽  
W. E. Rhoden ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd

The existence of electromigration in thin films has been acknowledged since the early sixties. Electromigration is described as the main transport for atoms in a conductor under a current stress. Initial interest had been of a theoretical nature as electromigration had little impact on circuit reliability. With the maturing of Very Large Scale Integrated Circuit (VLSI) technology, current densities are exceeding 106 Amps/cm2 while linestripes are reaching into the submicron range. In this environment, electromigration can cause unwanted open or short circuits in thin films. This has serious implications on the reliability of any integrated circuit. By 1990, millions of transistors may be fabricated on a chip with feature sizes smaller than the wavelength of visible light.


Author(s):  
Patrick Magee ◽  
Mark Tooley

As discussed in Chapter 4, when a voltage is applied across a conductor, a current will flow. If the voltage is applied across the body via suitable electrodes the body becomes part of the circuit and a current will also flow, the magnitude depending on the properties of the tissues in its path, particularly the resistance. This current can cause heating or other physiological effects, depending on the frequency of the driving voltage. The effects of the domestic mains current flowing through the body was discussed in Chapter 6, but different effects occur as the frequency of the voltage is increased. As the frequency goes up, the heating increases but the tissue stimulation decreases and, at frequencies above 100 kHz (i.e. radio frequencies), the effect is entirely heating. This heating effect in the body by electric current is called diathermy, but the location, concentration and how this heat is used is dependant on the electrode design and the current concentration or current density at any point in the circuit. For a certain applied voltage, the average current throughout the circuit will be the same. The current density is the current per unit area, and so if the material in which the current passes is smaller, the heating effect increases. The resistance of the material is proportional to its size, so as the material becomes smaller then its resistance gets larger. The heating power is the product of the current squared and the resistance (power = I2 × R). Surgical diathermy (or electrosurgery) is where either one or both of the electrodes are very small, and it is used to cut and coagulate tissue. The smaller electrode can be made into a pointed surgical tool and localised heating will occur at the tip of the instrument. The smaller and more pointed the instrument is, the greater the current density will be at the tip. This electrode is classified as the active or live one. The current densities around this electrode can be as much as 10 A cm−2, and the total heating power typically around 200 W.


2011 ◽  
Vol 04 (01) ◽  
pp. 31-36 ◽  
Author(s):  
QING LU ◽  
YIKAI ZHOU

Herein, a modified interfacial synthetic route has been demonstrated by synthesizing uniform poly(3,4-ethylenedioxythiophene)/ MnO 2 hierarchical mesoporous nanocomposite. The in-situ generated polymer has been proven to be effective in constraining the overgrowth of nuclei. Consequently, assembled nanosheets with a thickness less than 5 nm have been prepared. At a high rate of 10 A g-1 charge/discharge process, the nanocomposite electrode retains 73.4% of the specific capacitance exhibited at 1 A g-1. At a current density as large as 800 mA g-1, the nanocomposite electrode attains reversible lithium storage specific capacities of 400 mAh g-1 after 50 cycles and 300 mAh g-1 after 100 cycles. The excellent high-rate performance of the nanocomposite electrode is highlighted in terms of its extremely large surface area, unique microstructure and mesoporous features.


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