Silicon Based System-in-Package : Breakthroughs in Miniaturization and ‘Nano’-integration Supported by Very High Quality Passives and System Level Design Tools

2006 ◽  
Vol 969 ◽  
Author(s):  
Franck Murray ◽  
François LeCornec ◽  
Serge Bardy ◽  
Catherine Bunel ◽  
Jan Verhoeven ◽  
...  
Keyword(s):  
New Technologies ◽  
Test System ◽  
System Level ◽  
Design Tools ◽  
Design Environment ◽  
High Quality ◽  
Silicon Chips ◽  
The Creation ◽  
Silicon Based ◽  
Very High

AbstractThe very large development of home and domestic electronic appliances as well as portable device has led the microelectronics industry to evolve in two complimentary directions : “More Moore” with the continuous race towards extremely small dimensions hence the development of SoCs (System on Chip) and more recently a new direction that we could name “More than Moore” with the integration of devices that were laying outside the chips and here the creation of SiPs (System in Package).These two approaches are not in competition one with the other: the paper will show some examples of integrated nano systems that use several SoCs.The technology we have developed is called Silicon Based System in Package. The first products using this technology are now in volume production and used mainly in the field of wireless communications.This new technology relies on four pillars. Passive integration is the first. Very efficient and high quality factor capacitors and inductors have been integrated, allowing the creation of complete modules including active devices, filters and decoupling capacitors. High-density MOS capacitors with 1-1000 nF capacitance, and as high values as 25-250+ nF/mm2 specific capacitance have been fabricated in macroporous Si-wafers, containing over 1 billion macropores. Typically an ESR less than 100 mÙ and an ESL less than 25 pH were found for capacitors over 10 nF. This novel concept is an important step forward in improving the stability of power-amplifier modules by replacing conventional SMD technology.Whereas generations with capacitors density of up to 100 nF/mm2 will be using “conventional” materials and structures, the next steps in the roadmap will call for new 3D structures and materials such as high-k dielectrics.The second element is advanced packaging. New technologies, such as the assembly of Silicon chips onto other Silicon chips, also named “double flip chip” have been developed. This has been made possible thanks to the combination of the most advanced microbumping and die placement techniques. In addition to a tremendous reduction of size (up to a factor of 10 to 20) these techniques have also brought a better repeatability of system performance.The third element has been the development of design tools that allow a seamless system design for engineers used to IC design tools and flows. Our Design Environment allows co design of multiple technologies chips and their integration in a single system. This IC-like Design Environment has contributed a lot to the adoption of the technology.Testing is the fourth element and is one of the economical enablers of the technology. The key words are: “known good die”, RF test, system test? Some innovative RF probing and full on wafer subsystem test will be shown. Even though efficient test is not vital for the technical feasibility of this system integration, it becomes very quickly one of the most important enablers, especially when we deal with very high volumes of production. The conclusion of the paper will be an open door to the future. Some innovations like the integration of light or even energy storage inside our SiPs will be presented.

Silicon Based System-in-Package : Breakthroughs in Miniaturization and ‘Nano’-integration Supported by Very High Quality Passives and System Level Design Tools

2006 ◽  
Vol 969 ◽  
Author(s):  
Franck Murray ◽  
François LeCornec ◽  
Serge Bardy ◽  
Catherine Bunel ◽  
Jan Verhoeven ◽  
...  
Keyword(s):  
New Technologies ◽  
Test System ◽  
System Level ◽  
Design Tools ◽  
Design Environment ◽  
High Quality ◽  
Silicon Chips ◽  
The Creation ◽  
Silicon Based ◽  
Very High

AbstractThe very large development of home and domestic electronic appliances as well as portable device has led the microelectronics industry to evolve in two complimentary directions : “More Moore” with the continuous race towards extremely small dimensions hence the development of SoCs (System on Chip) and more recently a new direction that we could name “More than Moore” with the integration of devices that were laying outside the chips and here the creation of SiPs (System in Package).These two approaches are not in competition one with the other: the paper will show some examples of integrated nano systems that use several SoCs.The technology we have developed is called Silicon Based System in Package. The first products using this technology are now in volume production and used mainly in the field of wireless communications.This new technology relies on four pillars. Passive integration is the first. Very efficient and high quality factor capacitors and inductors have been integrated, allowing the creation of complete modules including active devices, filters and decoupling capacitors. High-density MOS capacitors with 1-1000 nF capacitance, and as high values as 25-250+ nF/mm2 specific capacitance have been fabricated in macroporous Si-wafers, containing over 1 billion macropores. Typically an ESR less than 100 mÙ and an ESL less than 25 pH were found for capacitors over 10 nF. This novel concept is an important step forward in improving the stability of power-amplifier modules by replacing conventional SMD technology.Whereas generations with capacitors density of up to 100 nF/mm2 will be using “conventional” materials and structures, the next steps in the roadmap will call for new 3D structures and materials such as high-k dielectric.The second element is advanced packaging. New technologies, such as the assembly of Silicon chips onto other Silicon chips, also named “double flip chip” have been developed. This has been made possible thanks to the combination of the most advanced microbumping and die placement techniques. In addition to a tremendous reduction of size (up to a factor of 10 to 20) these techniques have also brought a better repeatability of system performance.The third element has been the development of design tools that allow a seamless system design for engineers used to IC design tools and flows. Our Design Environment allows co design of multiple technologies chips and their integration in a single system. This IC-like Design Environment has contributed a lot to the adoption of the technology.Testing is the fourth element and is one of the economical enablers of the technology. The key words are: “known good die”, RF test, system test, etc. Some innovative RF probing and full on wafer subsystem test will be shown. Even though efficient test is not vital for the technical feasibility of this system integration, it becomes very quickly one of the most important enablers, especially when we deal with very high volumes of production. The conclusion of the paper will be an open door to the future. Some innovations like the integration of light or even energy storage inside our SiPs will be presented.

Quality Control and Testing of CIPP Liners

2014 ◽  
Vol 1044-1045 ◽  
pp. 1549-1552 ◽  
Author(s):  
Otakar Cigler ◽  
Karel Kubečka ◽  
Petr Waldstein
Keyword(s):  
Quality Control ◽  
Western Europe ◽  
High Efficiency ◽  
New Technologies ◽  
Environmentally Friendly ◽  
Point Of View ◽  
High Quality ◽  
Very High

The construction and rehabilitation of buildings and structures are intervention in the environment of people. Therefore, we are always looking for new technologies that are not only environmentally friendly but also acceptable from the point of view. Speed, flexibility, minimum limit for residents and transport, and also a high efficiency is the reason why more and more in recent years carried out the rehabilitation of sewerage using remediation sleeves. One of the systems of trenchless rehabilitation of sewerage systems used in Western Europe is a system company RELINEEUROPE Alphaliner Liner GmBH & co., the company's Technicians have developed one of the most important practices in the area of trenchless rehabilitation of sewerage systems. A large proportion of the development also has operators and owners of the pipeline. Technology offers very high quality of carried out restorations. This article describes the procedures for ensuring the quality of the used in Germany, which is a world leader in the development, production and use of this technology.

scholarly journals Using Supra-Covered Bonds to Enhance Liquidity in the Euro Area: Assessment of Advantages for the Banking Sector

2020 ◽  
Vol 13 (12) ◽  
pp. 293
Author(s):  
Matteo Salto ◽  
Stefano Zedda ◽  
Stefan Zeugner
Keyword(s):  
Euro Area ◽  
Banking Sector ◽  
Strong Increase ◽  
High Quality ◽  
Government Bonds ◽  
Central European ◽  
European Institution ◽  
The Creation ◽  
Main Effects ◽  
Very High

The discussion on the necessity of a larger volume of very highly quality liquid assets (VHQLA) in the euro area has been very extensive. The debate on expanding the pool of comparable euro area assets focuses on “safe assets”, often on various combinations of government bonds, most of which would not entail a strong increase in euro VHQLA. This paper explores a different option, complementary to the existing ones, based on the creation of a safe European asset backed by fully private assets. The paper proposes the issuance of supra-covered bonds by a central European institution. The latter are bonds issued by the central issuer and backed by covered bonds, which banks would have created using their mortgages as their cover pool. The aim is to increase substantially the outstanding amount of euro VHQLA. Such an asset would also be very beneficial during crisis periods, such as the current COVID19 crisis, by allowing banks to transform mortgages into very high quality liquid assets that can be used for funding and as a collateral in operations with the Eurosystem, thus enhancing the possible credit to sustain small and medium-sized enterprises (SMEs). This paper assesses the main effects of such a proposal on banks under different possible scenarios.

scholarly journals QUALITATIVE ASPECTS OF URBANIZATION IN RUSSIA (ON THE EXAMPLE OF PERM)

2021 ◽  
pp. 5-16
Author(s):  
Татьяна Анатольевна Балина ◽  
Кристина Эдуардовна Опутина ◽  
Лариса Юрьевна Чекменева
Keyword(s):  
Urban Environment ◽  
Smart City ◽  
New Technologies ◽  
Sociological Research ◽  
High Quality ◽  
Image Improvement ◽  
The Creation ◽  
The City

В статье рассматриваются качественные аспекты современных урбанизационных процессов в России. Подчеркивается необходимость формирования качественной городской среды как важного аспекта урбанизации. Отмечается, что создание современной городской среды подразумевает не только совершенствование управления, формирование имиджа, благоустройство и развитие инфраструктуры, но и внедрение новых технологий и различных элементов «умного города». На примере города Перми рассмотрены проблемы формирования качественной городской среды. Приведены результаты социологических исследований по вопросам оценки качества городской среды жителями Перми, который в преддверии празднования 300-летия стремится обновить свой облик. The article examines the qualitative aspects of modern urbanization processes in Russia. The need for the formation of a high-quality urban environment as an important aspect of urbanization is emphasized. It is noted that the creation of a modern urban environment implies not only the improvement of management, the formation of the image, improvement and development of infrastructure, but also the introduction of new technologies and various elements of the «smart city». The problems of forming a high-quality urban environment are considered on the example of the city of Perm. The results of sociological research on the assessment of the quality of the urban environment by residents of Perm, which, on the eve of the 300th anniversary, seeks to renew its appearance.

Structural changes in silicon-on-insulator material during post-implantation annealing

1986 ◽  
Vol 44 ◽  
pp. 736-737
Author(s):  
C. O. Jung ◽  
S. J. Krause ◽  
S.R. Wilson
Keyword(s):  
Integrated Circuits ◽  
Oxide Layer ◽  
High Speed ◽  
Structural Changes ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Quality ◽  
Radiation Hardened ◽  
Post Implantation ◽  
Very High

Silicon-on-insulator (SOI) structures have excellent potential for future use in radiation hardened and high speed integrated circuits. For device fabrication in SOI material a high quality superficial Si layer above a buried oxide layer is required. Recently, Celler et al. reported that post-implantation annealing of oxygen implanted SOI at very high temperatures would eliminate virtually all defects and precipiates in the superficial Si layer. In this work we are reporting on the effect of three different post implantation annealing cycles on the structure of oxygen implanted SOI samples which were implanted under the same conditions.

Constructed reed beds: appropriate technology for small communities

1995 ◽  
Vol 32 (3) ◽  
pp. 339-348 ◽  
Author(s):  
M. B. Green ◽  
J. Upton
Keyword(s):  
Sewage Treatment ◽  
Appropriate Technology ◽  
Great Promise ◽  
High Quality ◽  
Reed Beds ◽  
Small Communities ◽  
Operational Information ◽  
Reed Bed ◽  
Small Sites ◽  
Very High

Reed bed treatment is put in the context of a major water company’s need to provide reliable, high quality, effluents from small sewage treatment works whilst seeking to minimise running costs. Design and operational information is given for reed bed applications in Severn Trent Water. Performance details are provided for application to secondary, tertiary and storm overflow treatment. The results give particular confidence in the system’s ability to deliver very high quality effluents when used for tertiary treatment, the company’s biggest application. Reed beds work well against less demanding criteria for secondary treatment at small sites and show great promise for storm overflow treatment.

An authoring tool for democratizing the creation of high-quality VR experiences

2021 ◽  
Author(s):  
Dimitrios Ververidis ◽  
Panagiotis Migkotzidis ◽  
Efstathios Nikolaidis ◽  
Eleftherios Anastasovitis ◽  
Anastasios Papazoglou Chalikias ◽  
...  
Keyword(s):  
Authoring Tool ◽  
High Quality ◽  
The Creation

scholarly journals An Evaluation of Pixel- and Object-Based Tree Species Classification in Mixed Deciduous Forests Using Pansharpened Very High Spatial Resolution Satellite Imagery

2021 ◽  
Vol 13 (10) ◽  
pp. 1868
Author(s):  
Martina Deur ◽  
Mateo Gašparović ◽  
Ivan Balenović
Keyword(s):  
Spatial Resolution ◽  
Satellite Imagery ◽  
Tree Species ◽  
Classification Accuracy ◽  
New Technologies ◽  
Deciduous Forest ◽  
Species Classification ◽  
Tree Species Classification ◽  
Object Based ◽  
Very High

Quality tree species information gathering is the basis for making proper decisions in forest management. By applying new technologies and remote sensing methods, very high resolution (VHR) satellite imagery can give sufficient spatial detail to achieve accurate species-level classification. In this study, the influence of pansharpening of the WorldView-3 (WV-3) satellite imagery on classification results of three main tree species (Quercus robur L., Carpinus betulus L., and Alnus glutinosa (L.) Geartn.) has been evaluated. In order to increase tree species classification accuracy, three different pansharpening algorithms (Bayes, RCS, and LMVM) have been conducted. The LMVM algorithm proved the most effective pansharpening technique. The pixel- and object-based classification were applied to three pansharpened imageries using a random forest (RF) algorithm. The results showed a very high overall accuracy (OA) for LMVM pansharpened imagery: 92% and 96% for tree species classification based on pixel- and object-based approach, respectively. As expected, the object-based exceeded the pixel-based approach (OA increased by 4%). The influence of fusion on classification results was analyzed as well. Overall classification accuracy was improved by the spatial resolution of pansharpened images (OA increased by 7% for pixel-based approach). Also, regardless of pixel- or object-based classification approaches, the influence of the use of pansharpening is highly beneficial to classifying complex, natural, and mixed deciduous forest areas.

Sign in / Sign up

Export Citation Format

Share Document