Dependence of PECVD Silicon Oxynitride Properties on Deposition Parameters

1988 ◽  
Vol 131 ◽  
Author(s):  
Aubrey L. Helms ◽  
Robert M. Havrilla
Keyword(s):  
Gas Flow ◽  
Chemical Vapor ◽  
Silicon Oxynitride ◽  
Gas Flow Rate ◽  
Process Gas ◽  
Deposition Parameters ◽  
Chemical Vapor Deposited ◽  
Passivation Layers ◽  
Parallel Plate Reactor ◽  
Deposition Conditions

ABSTRACTThe properties of Plasma Enhanced Chemical Vapor Deposited (PECVD) silicon oxynitride thin films were determined for a variety of deposition conditions. The films were characterized with respect to stress, refractive index, deposition rate, hydrogen content, dielectric constant, and uniformity. The films were deposited in an Electrotech ND6200 parallel plate reactor using a silane - ammonia - nitrous oxide process gas chemistry. Deposition parameters which were investigated include process gas flow rate, power, and total pressure. The possible application of these films as both inter-layer and final passivation layers for use on GaAs ICs will be discussed.

Chemical vapor deposition parameters dependent length control of hexagonal graphene

2016 ◽  
Vol 231 (6) ◽  
pp. 1187-1196
Author(s):  
Hatem Abuhimd
Keyword(s):  
Chemical Vapor Deposition ◽  
Flow Rate ◽  
Vapor Deposition ◽  
Gas Flow ◽  
Chemical Vapor ◽  
Chamber Pressure ◽  
Gas Flow Rate ◽  
Production Scale ◽  
Surface Graph ◽  
Deposition Parameters

This paper presents a process metamodel-based artificial neural network full factorial experimental design and analysis to study the yield of lengthy hexagonal graphene grown by chemical vapor deposition. All of the process variables of chemical vapor deposition such as temperature, pressure, and gas flow rate under the study played a role in influencing hexagonal graphene length; the current study investigated their main effects and interactions. The metamodel-based analysis demonstrates that the hydrocarbon flow rate and the pressure are the most statistically significant factors that influence the length of hexagonal graphene. In particular, minimum and maximum values of the chamber pressure are not significant in terms of the concentrating effect they may have on the flowing mixture of gases with very small flow rate, i.e. 50 sccm. At the highest flow rate of 400 sccm, the chamber pressure stepped up to 764 Torr, which can support the growth reaction to the extent that the resultant hexagonal graphene length of 900 µm can be achieved. However, the two level effect of the flow rate can optimize the length to 990 µm and ≈1390 µm at 700 Torr and 764 Torr, respectively. In addition, the response surface graph confirms the factors of significance and adds that higher flow with lower pressure will consistently yield tall hexagonal graphene. We found that gas flow rate is the most significant of the control variables and only the optimum value of the gas flow rate of 225 sccm can ensure the growth of tall hexagonal graphene. We also found that the interaction of flow rate with temperature of the gases in the chamber is extremely significant to the quality of output. Outcomes of this investigation are beneficial for moving close to producing hexagonal graphene on production scale for future applications.

Control and Variation of Stress in Pecvd SiNx Films on InP

1988 ◽  
Vol 130 ◽  
Author(s):  
J. Lopata ◽  
W. C. Dautremont-Smith ◽  
J. W. Lee
Keyword(s):  
Compressive Stress ◽  
High Frequency ◽  
Gas Flow ◽  
Plasma Reactor ◽  
Low Frequency ◽  
Chemical Vapor ◽  
Flow Ratio ◽  
Deposition Parameters ◽  
Chemical Vapor Deposited ◽  
Gas Flow Ratio

AbstractStress in plasma enhanced chemical vapor deposited (PECVD) SiNx films on InP has been evaluated as a function of source gases (NH3 /SiH4 or N2/SiH4) and plasma operating frequency (high, » 1 MHz or low, « 1 MHz). All films were deposited at 300°C in the same parallel-plate, radial flow plasma reactor. Levels of stress in PECVD SiNx on InP within a continuous range from moderately high tensile (∼ 5 × 109 dyne cm−2) to very high compressive (2 × 1010 dyne cm−2 ) were obtained from appropriate choices of deposition parameters. Deposition from NH3/SiH4 at high frequency produces tensile stress, of magnitude increasing with NH3/SiH4 flow ratio. Deposition from N2/SiH4 at high frequency produces zero to low compressive stress. At low frequency compressive stress is always produced; for N2/SiH4 increasing the gas flow ratio from 25:1 to 500:1 reduces the compressive stress from 1.8 X 1010 to 7 × 108 dyne cm−2. The ability to vary the stress in a dielectric film of approximately constant chemical composition over such a broad range is beneficial for assessing the effects of stress on device performance.

Heat Transfer in Chemical Vapor Deposited Optical Fiber Coatings

2001 ◽  
Author(s):  
Patricia O. Iwanik ◽  
Wilson K. S. Chiu
Keyword(s):  
Heat Transfer ◽  
Optical Fiber ◽  
Gas Flow ◽  
Convection Heat Transfer ◽  
Fiber Surface ◽  
Chemical Vapor ◽  
Temperature Changes ◽  
Flow And Heat Transfer ◽  
Chemical Vapor Deposited ◽  
Fiber Coatings

Abstract A fundamental understanding of how reactor parameters influence the fiber surface temperature is essential to manufacturing high quality optical fiber coatings by chemical vapor deposition (CVD). In an attempt to better understand this process, a finite volume model has been developed to study the gas flow and heat transfer of an optical fiber as it travels through a CVD reactor. This study showed that draw speed significantly affects fiber temperature inside the reactor, with temperature changes up to 45% observed under the conditions studied. Multiple heat transfer modes contribute to this phenomena, with convection heat transfer dominating the process.

Effect of Precursor Supply on (100) and (001) Orientations of α-Al2O3 Film Prepared by Laser CVD

2012 ◽  
Vol 508 ◽  
pp. 3-6 ◽  
Author(s):  
Kadokura Hokuto ◽  
Akihiko Ito ◽  
Teiichi Kimura ◽  
Takashi Goto
Keyword(s):  
Cross Section ◽  
Vapor Deposition ◽  
Gas Flow ◽  
Chemical Vapor ◽  
Gas Flow Rate ◽  
Laser Chemical Vapor Deposition ◽  
Evaporation Temperature ◽  
Oxygen Gas ◽  
Laser Cvd ◽  
Precursor Supply

Α-Al2O3 Films Were Prepared by Laser Chemical Vapor Deposition and the Effects of Precursor Evaporation Temperature (Tvap) and Oxygen Gas Flow Rate (FRo) on Phase and Orientation of Al2o3 Films Were Investigated. at Tvap = 413 K, (100)-Oriented α-Al2O3 and θ-Al2O3 Were Codeposited. the Amount of θ-Al2O3 Increased with Increasing FRo. at Tvap = 433–443 K, α-Al2O3 Films Showed a (001) Orientation. (100)- and (001)-Oriented α-Al2O3 Films Had a Rectangular- and Hexagonal-Shaped Grains, Respectively, and Showed a Columnar in Cross Section. Grain Size of (100)- and (001)-Oriented α-Al2O3 Films Decreased from 10 to 2 μm with Increasing FRo from 0.085 to 0.85 Pa m3 s−1. Deposition Rate Increased from 100 to 300 μm h−1 with Increasing Tvap from 413 to 443 K.

Plasma-assisted chemical vapor deposited silicon oxynitride as an alternative material for gate dielectric in MOS devices

2006 ◽  
Vol 37 (1) ◽  
pp. 64-70 ◽  
Author(s):  
A. Szekeres ◽  
T. Nikolova ◽  
S. Simeonov ◽  
A. Gushterov ◽  
F. Hamelmann ◽  
...  
Keyword(s):  
Gate Dielectric ◽  
Chemical Vapor ◽  
Silicon Oxynitride ◽  
Mos Devices ◽  
Chemical Vapor Deposited ◽  
Alternative Material

Oxidation of PECVD SiC Deposited from Trimethylsilane

1998 ◽  
Vol 555 ◽  
Author(s):  
Peter A. DiFonzo ◽  
Mona Massuda ◽  
James T. Kelliher
Keyword(s):  
Thin Films ◽  
Silicon Carbide ◽  
Oxidation Kinetics ◽  
Stoichiometric Composition ◽  
Chemical Vapor ◽  
Oxidation Rates ◽  
Chemical Vapor Deposited ◽  
Kinetics Of ◽  
Sic Films ◽  
Deposition Conditions

AbstractThe stoichiometric composition and oxidation rates ( wet or dry ) of plasma enhanced chemical vapor deposited (PECVD) silicon carbide (SiC) films are effected by the deposition conditions of trimethylsilane (3MS) and carrier gas. We report the oxidation kinetics of SiC thin films deposited in a modified commercial PECVD reactor. A standard horizontal atmospheric furnace in the temperature range of 925–1100°C was used in the oxidation. Oxidized films were measured optically by commercially available interferometer and ellipsometer tools in addition to mechanically using a commercially available profilometer. Activation energies of the parabolic rates were in the range of 20.93 to 335.26 kJ/mol.

Advances in the Characterization of Compositionally-graded Layers in Amorphous Semiconductor Solar Cells by Real Time Spectroellipsometry

1996 ◽  
Vol 420 ◽  
Author(s):  
R. W. Collins ◽  
Sangbo Kim ◽  
Joohyun Koh ◽  
J. S. Burnham ◽  
Lihong Jiao ◽  
...  
Keyword(s):  
Solar Cells ◽  
Real Time ◽  
Gas Flow ◽  
Chemical Vapor ◽  
Interface Layer ◽  
Open Circuit ◽  
Amorphous Semiconductor ◽  
Deposition Parameters ◽  
Gas Flow Ratio ◽  
Graded Layers

AbstractWe have developed a real time spectroellipsometry data analysis procedure that allows us to characterize compositionally- graded amorphous semiconductor alloy thin films prepared by plasma-enhanced chemical vapor deposition (PECVD). As an example, we have applied the analysis to obtain the depth-profile of the optical gap and alloy composition with ≤15 Å resolution for a hydrogenated amorphous silicon-carbon alloy (a-Si1−xCx:H) film prepared by continuously varying the gas flow ratio z=[CH4]/{[CH4]+[SiH4]} in the PECVD process. The graded layer has been incorporated at the p/i interface of widegap a-Si1−xCx:H (x∼0.05) p-i-n solar cells, and consistent improvements in open-circuit voltage have been demonstrated. The importance of the graded-layer characterization is the ability to relate improvements in device performance directly to the physical properties of the interface layer, rather to the deposition parameters with which they were prepared.

Copper Films Prepared by Metal Organic Chemical Vapor Deposition (MOCVD) Process Using Copper (Acetylacetonate) and Water Vapor as Reactants: The Impact of Water Vapor

1992 ◽  
Vol 282 ◽  
Author(s):  
Yu-Neng Chang
Keyword(s):  
Water Vapor ◽  
Partial Pressure ◽  
Gas Flow ◽  
Chemical Vapor ◽  
Organic Chemical ◽  
Gas Flow Rate ◽  
Cu Films ◽  
Metal Organic ◽  
Carrier Gas Flow ◽  
Organic Chemical Vapor Deposition

ABSTRACTBy using the strong reductive potential of copper acetylacetone (Cu(acac)2) when Cu(acac)2) was thermally decomposed, copper metal films were prepared by metal organic chemical vapor deposition (MOCVD) process using sublimed Cu(acac)2 vapor and water vapor as reactants, at one atmosphere pressure. According to thermodynamic calculations, Cu films could be prepared by MOCVD process with a high ratio of partial pressures for water vapor and Cu(acac)2 vapor (PH2O/Pcu(acac)2>30) In this paper, the impacts of MOCVD processing parameters such as watervapor partial pressure, total carrier gas flow rate, and precursor partial pressure on film composition and microstructure were investigated. Deposition temperature is the primary processing parameter affecting film stoichiometry. In a specific deposition temperature window, from 370°C to 400°C, polycrystalline Cu films with Cu [111] preferential orientation were deposited. ER and XRD results indicated that films deposited at temperature lower than 350°C contain copper oxide phase with poor crystal structure. By comparing the values of X-ray Auger Electron Spectroscopy (XAES) and Auger parameter (αAu) from photoelectrons of Cu films and standards from reference compounds, die principle oxidation state of copper in these films was determined as Cu(0). The deposition results indicated that a water vapor partial pressure above 10 torr is necessary to produce Cu films. As indicated by SEM, Increasing the carrier gas flow rate, above 600 sccm, can reduce the average temperature profile in the thermal boundary layer above the substrate surface, retard the gas phase reaction rate, presumably eliminate the homogeneous nucleation, and deposit smooth Cu films.

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