Transformation of Gold in N-Type Silicon from a New Deep Level to the Gold Acceptor Level

1992 ◽  
Vol 262 ◽  
Author(s):  
Einar Ö. SveinbjöRnsson ◽  
Olof Engström
Keyword(s):  
Deep Level ◽  
Depth Profiling ◽  
Sample Surface ◽  
Acceptor Level ◽  
Electron Capture Cross Section ◽  
Acceptor Concentration ◽  
Type Silicon ◽  
Float Zone ◽  
Transient Spectroscopy ◽  
Diffusion Of Hydrogen

ABSTRACTUsing deep level transient spectroscopy (DLTS) on gold-doped n-type Czochralski (CZ) and float zone (FZ) silicon we observe a new gold-related acceptor level (G) with an activation energy σn= 0.19 eV and an electron capture cross section On = 1–10-17 cm2. The center anneals out at a temperature of 250°C, simultaneously as the gold acceptor concentration increases. Annealing at temperatures below 250°C does not reverse this process. However, etching a few microns off the sample surface using HF:HNO3 based etch reforms the G center and the gold acceptor concentration decreases accordingly. From DLTS depth-profiling we determine that the new center is only found at depths less than 5 μm, and in the same region we observe neutralization of phosphorus dopants and a reduction in the gold acceptor concentration.We propose that in-diffusion of hydrogen during the etching process is responsible for the three observed transitions, i.e. neutralization of both phosphorus donors and gold acceptors and formation of the G center. We suggest that there are (at least) two possible Au-H complex centers, one which is electrically inactive and another which gives rise to an acceptor level (ΔE = 0.19 eV) in the bandgap of n-type silicon. The electrically active center anneals out at 250°C while the electrically inactive one is more stable and has been observed earlier in remote plasma hydrogenation experiments performed at 150–350°C.

Evaluation of On-State Resistance and Boron-Related Levels in n-Type 4H-SiC

2005 ◽  
Vol 483-485 ◽  
pp. 425-428 ◽  
Author(s):  
R.R Ciechonski ◽  
Samuele Porro ◽  
Mikael Syväjärvi ◽  
Rositza Yakimova
Keyword(s):  
Minority Carrier ◽  
Deep Level ◽  
Schottky Diodes ◽  
Depth Profiling ◽  
Thermionic Emission ◽  
Barrier Heights ◽  
Transient Spectroscopy ◽  
State Resistance ◽  
Thick Layers

Specific on-resistance Ron estimated from current density-voltage characteristics of Schottky diodes on thick layers exhibits variations from tens of mW.cm2 to tens of W.cm2 for different doping levels. In order to understand the occurrence of high on-state resistance, Schottky barrier heights were first estimated for both forward and reverse bias with the application of thermionic emission theory and were in agreement with a literature reported values. Decrease in mobility with the temperature was observed and its dependencies of T–1.3 and T–2.0 for moderately doped and low doped samples respectively were estimated. From deep level measurements by Minority Carrier Transient Spectroscopy, an influence of shallow boron related levels and D-center on dependence of on-state resistance was observed, being more pronounced in low doped samples. Similar tendency was observed in depth profiling of Ron. This suggests a major role of boron in a compensation mechanism thus resulting in high Ron.

Hydrogen-Vacancy Complexes and their Deep States in n-Type Silicon

2015 ◽  
Vol 242 ◽  
pp. 163-168 ◽  
Author(s):  
Ilia L. Kolevatov ◽  
Frank Herklotz ◽  
Viktor Bobal ◽  
Bengt Gunnar Svensson ◽  
Edouard V. Monakhov
Keyword(s):  
Schottky Diode ◽  
Deep Level Transient Spectroscopy ◽  
Minority Carrier ◽  
Deep Level ◽  
Energy Levels ◽  
Depletion Region ◽  
Type Silicon ◽  
Oxygen Center ◽  
Hydrogen Vacancy ◽  
Transient Spectroscopy

The evolution of irradiation-induced and hydrogen-related defects in n-type silicon in the temperature range 0 – 300 °C has been studied by deep level transient spectroscopy (DLTS) and minority carrier transient spectroscopy (MCTS). Implantation of a box-like profile of hydrogen was performed into the depletion region of a Schottky diode to undertake the DLTS and MCTS measurements. Proportionality between the formation of two hydrogen-related deep states and a decrease of the vacancy-oxygen center concentration was found together with the appearance of new hydrogen-related energy levels.

Deep level transient spectroscopy on proton-irradiated Fe-contaminated p-type silicon

2012 ◽  
Vol 9 (10-11) ◽  
pp. 1992-1995 ◽  
Author(s):  
C. K. Tang ◽  
L. Vines ◽  
B. G. Svensson ◽  
E. V. Monakhov
Keyword(s):  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Type Silicon ◽  
Transient Spectroscopy ◽  
P Type

Formation of Intrinsic Defects at MBE-Grown GaAs/AlAs Interfaces

1993 ◽  
Vol 312 ◽  
Author(s):  
P. Krispin ◽  
R. Hey ◽  
H. Kostial ◽  
M. Höricke
Keyword(s):  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Depth Profiling ◽  
Intrinsic Defects ◽  
Capacitance Voltage ◽  
Charge States ◽  
Transient Spectroscopy ◽  
Silicon Doped ◽  
Arsenic Vacancy

AbstractWe report on a detailed investigation of MBE-grown isotype silicon-doped heterostructures by capacitance/voltage (C/V) technique and deep-level transient spectroscopy (DLTS). A sequence of electrically active defects is found. By depth profiling of the density of the dominant levels it is demonstrated that the corresponding defects are concentrated at the GaAs-on-AlAs (inverted) interface. By comparison with studies on irradiation-induced levels in LPE- or VPE-grown AlGaAs we conclude that the defects at the GaAs/AlAs interface are most probably linked to different charge states of the arsenic vacancy VAs and VAs−ASi pairs.

Deep–Level Transient Spectroscopy Studies of Czochralski–Grown N–Type Silicon

1993 ◽  
Vol 324 ◽  
Author(s):  
Yutaka Tokuda ◽  
Isao Katoh ◽  
Masayuki Katayama ◽  
Tadasi Hattori
Keyword(s):  
Crystal Growth ◽  
Deep Level Transient Spectroscopy ◽  
Deep Level ◽  
Electron Traps ◽  
Cooling Period ◽  
Type Silicon ◽  
Transient Spectroscopy ◽  
Spectroscopy Studies

AbstractElectron traps in Czochralski–grown n-type (100) silicon with and without donor annihilation annealing have been studied by deep–level transient spectroscopy. A total of eight electron traps are observed in the concentration range 1010 –1011 cm −3. It is thought that these are grown–in defects during crystal growth cooling period including donor annihilation annealing. It is suggested that two electron traps labelled A2 (Ec–0.34 eV) and A3 (Ec–0.38 eV) of these traps are correlated with oxygen–related defects. It is shown that traps A2 and A3 are formed around 400 ° C and disappear around 500–600 ° C.

In Situ Deep Level Transient Spectroscopy of Defect Evolution in Silicon Following Ion Implantation at 80 K

1998 ◽  
Vol 532 ◽  
Author(s):  
C. R. Cho ◽  
R. A. Brown ◽  
O. Kononchuk ◽  
N. Yarykin ◽  
G. Rozgonyi ◽  
...  
Keyword(s):  
Deep Level Transient Spectroscopy ◽  
Room Temperature ◽  
Deep Level ◽  
Temperature Range ◽  
Type Silicon ◽  
Defect Annealing ◽  
Interstitial Defects ◽  
Transient Spectroscopy ◽  
Dlts Spectra

ABSTRACTThe evolution of defects in Czochralski and epitaxial p- and n-type silicon wafers following irradiation with He. Si or Ge ions at 80 K has been investigated by in situ deep level transient spectroscopy (DLTS). Defect annealing and formation reactions have been observed over the temperature range 80–350 K. In p-type silicon, new species-dependent levels are observed immediately after implantation, but these levels anneal out at or below room temperature. The wellknown divacancy and interstitial defects, usually reported after room temperature implantation, are revealed in the DLTS spectra only upon annealing at 160–200 K. In n-type silicon, vacancy-oxygen pairs are observed immediately after implantation. However, vacancy-related defects continue to form over a broad temperature range in samples implanted with Si or Ge. These observations are consistent with a model whereby vacancies and interstitials are released from defect clusters at temperatures >200 K to form divacancies and other defect pairs which are stable at room temperature.

Electrical and optical investigation of the position of vanadium related defects in the 4H and 6H SiC bandgaps

1996 ◽  
Vol 423 ◽  
Author(s):  
J. R. Jenny ◽  
M. Skowronski ◽  
W. C. Mitchel ◽  
S. R. Smith ◽  
A. O. Evwaraye ◽  
...  
Keyword(s):  
Optical Absorption ◽  
Hall Effect ◽  
Deep Level ◽  
Polarized Light ◽  
Conduction Band Edge ◽  
Optical Investigation ◽  
Admittance Spectroscopy ◽  
Acceptor Level ◽  
Transient Spectroscopy ◽  
Spectroscopy Optical

AbstractHall effect, deep level transient spectroscopy, optical absorption, and optical admittance spectroscopy were employed to determine the position of the vanadium acceptor and vanadiumnitrogen complex in vanadium- and nitrogen-doped 4H and 6H SiC. Hall effect results indicate that the acceptor position in 4H(6H) SiC is 0.80(0.66) eV beneath the conduction band edge. The DLTS signature of the defect in the 4H polytype showed an ionization energy of 806 meV and a capture cross section of 1.8×10−16 cmr−2 The optical absorption measurements proved that the acceptor level investigated is related to isolated vanadium, and therefore the vanadium acceptor level. Based upon DLTS and SIMS measurements, the maximum solubility of vanadium in SiC was determined to the 3×10−17 crn3. An examination of polarized light experiments indicates that vanadium also complexes with another element to form electronic(at 5000 cm−1) and vibrational absorption(at 683 cm−1) bands. While the other constituent cannot be identified, evidence suggests that nitrogen is a likely candidate. This complex introduces a deep level at Ec−0.78 eV as determined using optical admittance spectroscopy.

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