IN-SITU Analysis Of The Microstructure of Thermally Treated Thin Copper Films
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AbstractCopper thin films were deposited by sputtering, electron beam evaporation, and electroless plating onto nitride membranes for TEM analysis. The samples were heat treated in-situ from room temperature to 600 °C for structural and chemical analysis. The as-deposited and heat treated microstructures were investigated. Orientation changes with heat treatment and reactions among the sample layers were analyzed by electron diffraction. This work provides baseline information for a study of the thermal evolution of copper lines.
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